Has the U.S. Market valuation changed over the past few years?

Investors are relatively neutral on the American market at the moment, indicating that they expect earnings will grow in line with historical growth rates. The market is trading at a PE ratio close to its 3-year average PE ratio of 30.0x.

Which sectors have driven the changes within the U.S. Market?

Investors favour the Healthcare sector the most for future growth even though it's trading below its 3-year average PE ratio of 65.5x. The market's confidence is likely because analysts are expecting annual earnings growth of 18.1%, which is higher than its past year's earnings growth of 14.2% per year. The Financials sector is the least preferred by investors for future growth, which is trading close to its 3-year average of 17.7x.

U.S. Market Analysis & Valuation - Dow Jones, Nasdaq, S&P 500 Summary

Date	Market Cap	Revenue	Earnings	PE	Absolute PE	PS
Tue, 02 Jun 2026	US$74.5t	US$24.2t	US$2.5t	18.8x	30.2x	3.1x
Thu, 30 Apr 2026	US$69.8t	US$23.8t	US$2.3t	19.3x	30x	2.9x
Sat, 28 Mar 2026	US$67.9t	US$23.7t	US$2.3t	18.1x	29.4x	2.9x
Mon, 23 Feb 2026	US$72.7t	US$23.6t	US$2.3t	19.5x	31.9x	3.1x
Wed, 21 Jan 2026	US$72.5t	US$23.2t	US$2.3t	19.2x	31.7x	3.1x
Fri, 19 Dec 2025	US$70.5t	US$23.2t	US$2.3t	19.1x	30.8x	3x
Sun, 16 Nov 2025	US$70.3t	US$23.1t	US$2.3t	18.2x	31x	3x
Tue, 14 Oct 2025	US$69.3t	US$22.9t	US$2.2t	18.6x	31.6x	3x
Thu, 11 Sep 2025	US$68.7t	US$22.9t	US$2.2t	19x	31.4x	3x
Sat, 09 Aug 2025	US$66.6t	US$22.8t	US$2.2t	18.6x	30.9x	2.9x
Mon, 07 Jul 2025	US$65.6t	US$22.5t	US$2.1t	18.8x	31.2x	2.9x
Wed, 04 Jun 2025	US$61.9t	US$22.5t	US$2.1t	17.8x	29.5x	2.8x
Fri, 02 May 2025	US$57.6t	US$21.9t	US$2.1t	17.1x	27.4x	2.6x
Sun, 30 Mar 2025	US$58.0t	US$21.9t	US$2.1t	17.4x	28.3x	2.6x
Tue, 25 Feb 2025	US$63.1t	US$21.9t	US$2.0t	18x	30.9x	2.9x
Thu, 23 Jan 2025	US$63.8t	US$22.1t	US$2.0t	19.1x	32.5x	2.9x
Sat, 21 Dec 2024	US$61.6t	US$22.0t	US$1.9t	18.3x	31.8x	2.8x
Mon, 18 Nov 2024	US$61.7t	US$22.0t	US$1.9t	18.9x	32.3x	2.8x
Wed, 16 Oct 2024	US$60.3t	US$21.6t	US$1.9t	18.5x	32.4x	2.8x
Fri, 13 Sep 2024	US$57.2t	US$21.5t	US$1.9t	17.7x	30.8x	2.7x
Sun, 11 Aug 2024	US$55.2t	US$21.5t	US$1.8t	17.2x	29.9x	2.6x
Tue, 09 Jul 2024	US$57.6t	US$21.3t	US$1.8t	16.7x	31.4x	2.7x
Thu, 06 Jun 2024	US$54.6t	US$21.3t	US$1.8t	17.1x	29.9x	2.6x
Sat, 04 May 2024	US$53.1t	US$21.2t	US$1.8t	17.1x	28.8x	2.5x
Mon, 01 Apr 2024	US$54.8t	US$21.1t	US$1.8t	17.5x	29.7x	2.6x
Wed, 28 Feb 2024	US$52.8t	US$21.1t	US$1.8t	16.5x	28.7x	2.5x
Fri, 26 Jan 2024	US$50.8t	US$21.0t	US$1.8t	16.8x	29x	2.4x
Sun, 24 Dec 2023	US$50.1t	US$21.0t	US$1.8t	16.9x	28.5x	2.4x
Tue, 21 Nov 2023	US$47.1t	US$21.0t	US$1.7t	15.9x	27.1x	2.2x
Thu, 19 Oct 2023	US$45.2t	US$21.0t	US$1.7t	15.1x	26.2x	2.2x
Sat, 16 Sep 2023	US$47.1t	US$20.9t	US$1.7t	15.6x	27.4x	2.2x
Mon, 14 Aug 2023	US$47.5t	US$20.9t	US$1.7t	16x	27.9x	2.3x
Wed, 12 Jul 2023	US$47.0t	US$21.0t	US$1.7t	15.6x	28.3x	2.2x
Fri, 09 Jun 2023	US$45.6t	US$21.0t	US$1.7t	15.2x	27.3x	2.2x


US Market	1.58%
Tech	4.73%
Materials	2.67%
Consumer Discretionary	1.58%
Industrials	1.37%
Healthcare	0.32%
Telecom	0.19%
Financials	-0.41%
Real Estate	-1.15%
Utilities	-1.84%
Consumer Staples	-2.67%
Energy	-5.54%

Company	Last Price	7D	1Y	Valuation	Sector
AVGO Broadcom	US$481.57	14.1% +US$282.0b	87.5%	PE91.3x	Tech
NVDA NVIDIA	US$222.82	3.7% +US$192.8b	57.8%	PE33.8x	Tech
MU Micron Technology	US$1.06k	18.8% +US$189.7b	940.7%	PE49.8x	Tech
MSFT Microsoft	US$441.31	6.1% +US$187.8b	-4.7%	PE26.2x	Tech
ORCL Oracle	US$244.58	26.7% +US$148.2b	44.6%	PE43.5x	Tech

Announcement • 5h

Micron Technology Showcases Full Portfolio of AI-Optimized Memory and Storage Solutions At COMPUTEX 2026

Micron Technology showcased its full portfolio of AI-optimized memory and storage solutions during COMPUTEX 2026, empowering next-generation AI data center and intelligent edge applications. Micron's data center memory and storage portfolio is purpose-built to address every layer of the AI infrastructure hierarchy. High-bandwidth memory (HBM) powers high-speed model execution and hot key-value (KV) cache, while LPDDR and DDR deliver system memory for orchestration and long-context expansion (with LPDDR offering greater power efficiency). Data center SSDs round out the stack, offering high-performance drives to address persistent KV cache needs and high-capacity drives for massive data lakes. This tiered memory architecture, with Micron at the heart of every layer, optimizes latency, bandwidth, power, capacity and cost — offloading GPUs to maximize data center token production. Micron's latest milestones across the portfolio demonstrate this momentum: HBM: HBM4 36GB 12H enables a 2.6-times increase in large language model (LLM) inference throughput, measured in tokens per second for every 2-times increase in bandwidth. SOCAMM: Micron is the only provider of a 256GB SOCAMM2, the world's highest capacity offering, extending leadership in low-power data center memory by delivering one-third the power and one-third the footprint versus standard RDIMMs. High-capacity RDIMMs: Micron sampled the company’s leading-edge 1? (1 gamma) technology in the 256GB DDR5 RDIMM, which is capable of speeds up to 9,200 megatransfers per second (MT/s), is 40% faster than modules in volume production today, and has more than 40% lower operating power versus two 128GB modules. Data center SSDs: The Micron 9650 SSD was the world’s first commercially available PCIe Gen6 SSD and is designed to deliver high performance for AI inference and training workloads. Now available at up to 245TB, the Micron 6600 ION sets a new benchmark for density and power efficiency, reducing rack footprint by 82% and power consumption by half compared to HDD-based deployments. As AI inference expands from the data center to PCs, smartphones, vehicles and embedded systems, the demands on memory and storage are fundamentally changing. Higher-density DRAM keeps AI models and agents resident and running, while Micron's storage solutions evolve into an active working layer, supporting everything from local model caches on an AI PC to real-time sensor fusion inside a vehicle, delivering faster, more responsive AI experiences at every edge. LPCAMM: LPCAMM2 delivers up to 9,600 MT/s with LPDDR5X in a modular, low power 128-bit dual-channel design for thinner, lighter PCs. GDDR: GDDR7 delivers up to 1.5 TB/s system bandwidth, 60% higher than GDDR6 with up to 33% higher AI inference throughput. LPDDR: LPDDR5X delivers industry-leading low-power performance for real-time AI processing across PCs, smartphones, robotics and next-generation automotive platforms. Client SSDs: The Micron 4600 PCIe Gen5 NVMe SSD loads LLMs in under a second, with 107% better energy efficiency versus prior-generation Gen4 SSDs. UFS for automotive: UFS 4.1 delivers up to 4.2 GB/s, twice the previous generation, with 115°C thermal protection and functional safety compliance for advanced driver-assistance systems (ADAS) and in-vehicle AI. Building on multi-generation leadership in DRAM and NAND process technology, most recently 1? DRAM and G9 NAND, Micron is deepening its technical collaboration with partners across the ecosystem through cooperative design and engineering, bringing AI platforms to market faster and with greater system-level optimization. Backed by major manufacturing investments across the U.S., India, Japan, Singapore and Taiwan, Micron is positioned to deliver these innovations at scale. During COMPUTEX 2026, Micron will host an invitation-only product showcase at its Taipei office in TFC Plaza from June 2 through June 4.

Announcement • 6h

Intel Corporation Unveils New AI Innovations Including Rackscale AI Infrastructure, Agentic Cloud Offering, Intel Xeon 6+ Processors, And Series 3 Family Of Processors

Intel Corporation unveiled new innovations that address customers’ chip-to-systems-level AI needs with solutions tailored to address their specific industry challenges, including: New rackscale AI infrastructure: Intel announced rackscale AI infrastructure for customers interested in scaling their inference and agentic workloads based on Intel Xeon processors and SambaNova SN-50 Reconfigurable Dataflow Units (RDUs). Agentic Cloud Offering for Disaggregated Inference: Vector Core Compute, a new purpose-built enterprise inference cloud formed by Vista Equity Partners and Cambium Capital, unveiled fully disaggregated inference running on Intel Xeon processors, SambaNova RDUs, and NVIDIA Blackwell GPUs. Deep industry solutions: Strategic collaborations with industry leaders, including Foxconn, Siemens, Hitachi, Echo Neurotechnologies, and Greenstone Biosciences focused on delivering integrated vertical customer solutions based on Intel processors and purpose-built silicon. Intel Xeon 6+ processors: Next-generation data center CPU built on Intel 18A and designed for high-density, scale-out workloads. PC, gaming handheld, and physical AI momentum: Broad partner support and customer uptake for the Series 3 family of processors. Intel, SambaNova, and Foxconn announced their intent to build rackscale AI infrastructure for data center, hyperscale, and intelligence center deployments—built on Intel Xeon processors. The companies are demonstrating production-ready racks that combine Intel Xeon processors with SambaNova SN-50 RDUs, which together are designed to deliver high performance AI inference with improved cost and power efficiency. As part of the collaboration, Foxconn will provide system integration capabilities for the new rackscale AI infrastructure. Foxconn also plans to manufacture a CPU-dense variant of the rackscale infrastructure for workloads that do not require additional acceleration, including cost-optimized inference, data processing, and hybrid AI. Vector Core Compute, a new purpose-built enterprise inference cloud formed by Vista Equity Partners and Cambium Capital, unveiled fully disaggregated inference. Running onstage at Computex, Intel, SambaNova, Vista Equity Partners and Cambium Capital showcased the first real-world demonstration of a disaggregated inference system, using Intel Xeon 6 processors for orchestration and execution, SambaNova SN40 RDUs for decode, and NVIDIA Blackwell GPUs for prefill—operating from a Vector Core Compute data center in Los Angeles, California. Together.ai is the first commercial customer running workloads on Vector Core Compute’s agentic cloud, which delivered the fastest enterprise inference on the MiniMax 2.5 model of any architecture to date. Vista Equity Partners has secured early access to the company’s high-quality, low-cost inference solutions for its 90+ portfolio companies which serve more than 2,500,000 enterprise customers and 750,000,000 users worldwide. Intel announced several strategic partnerships designed to co-develop industry-specific vertical solutions based on Intel processors and purpose-built silicon, including: Foxconn: The world’s largest electronics manufacturer is working with Intel to provide systems integration capabilities for rackscale AI infrastructure and explore collaboration in design services and custom silicon development. Siemens: The leading technology company focused on industry, infrastructure, transport, and healthcare and Intel have expanded their existing collaboration. In 2023, Siemens and Intel first joined forces; now the two companies are strengthening their collaboration across the entire value chain from design to manufacturing to chips embedded in Siemens products. Siemens brings its capabilities for the design, manufacturing, and lifecycle management of chips, as well as fab digitalization, automation, and electrification. This collaboration will enable the exploration of use cases for purpose-built Intel silicon for Siemens’ varied compute requirements, which may include edge devices, high-performance computing (HPC), and robotics. Hitachi: A global leader in digital innovation and sustainable solutions and Intel intend to work together on a range of solutions including foundry tools and quantum computing. Echo Neurotechnologies: The developer of neuroscience and brain-computer interface solutions and Intel are exploring new neuromorphic technologies to advance neuro-AI, speech neuroscience, brain-computer interfaces, and Intel's future neuromorphic and conventional hardware architectures. Greenstone Biosciences: The Silicon Valley biotech company plans to use Intel processors, purpose-built silicon, and the Intel Health and Life Sciences AI Suite to accelerate human-centric drug development using stem cells, organoids, genomics, and AI. Intel announced the availability of Intel Xeon 6+ processors, which provide greater performance density, power efficiency, and operational scale for cloud-native, agentic AI, and network-intensive workloads. Built on Intel 18A—its first use in a data center CPU—Xeon 6+ is engineered for sustained performance under real-world power constraints—addressing the orchestration, concurrency, and data movement demands of emerging agentic AI. Xeon 6+ can be configured for AI rackscale infrastructure purpose-built for hosting agents at maximum density. For example, a single liquid-cooled rack can deliver 36,864 cores using 32U of compute space, which provides the highest agent density available (at approximately 100-kilowatt rack power compute). Optimized for environments where watts per rack, throughput per core, and latency predictability are critical, Xeon 6+ emphasizes scale-out performance—making room for new AI workloads without requiring disruptive data center redesign. Core Ultra Series 3, built on Intel 18A, continues to experience strong customer uptake for a platform that now powers more than 325 consumer and commercial PC designs. Leveraging the same advanced IP as Ultra, the recently launched Core processors are enabling a new class of thin, sleek, powerful, and efficient PCs at affordable price points. Series 3 also pushes into the growing market of handheld gaming with the new Intel Arc G-series processors, which will be available starting this month. The expansion of the Series 3 processor family is being accelerated by increased 18A yields and strong customer and partner engagement. For the first time, the latest Series 3 IP scaling in the PC ecosystem will deploy in parallel to thousands of edge customers globally. Over 130 customers have already chosen Series 3 to power edge AI and robotics designs.

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