South Korean (KOSPI) Market Analysis & Valuation

Market Valuation and Performance

Has the South Korean Market valuation changed over the past few years?

Date	Market Cap	Revenue	Earnings	PE	Absolute PE	PS
Fri, 07 Aug 2026	₩5535.2t	₩4347.7t	₩468.3t	11.4x	11.8x	1.3x
Sun, 05 Jul 2026	₩7004.4t	₩4166.3t	₩308.8t	11.5x	22.7x	1.7x
Tue, 02 Jun 2026	₩7413.9t	₩4120.8t	₩308.9t	13.2x	24x	1.8x
Thu, 30 Apr 2026	₩6039.9t	₩4008.0t	₩250.8t	16.8x	24.1x	1.5x
Sat, 28 Mar 2026	₩4979.6t	₩3918.9t	₩216.9t	14.8x	23x	1.3x
Mon, 23 Feb 2026	₩5227.8t	₩3871.1t	₩219.2t	15.4x	23.8x	1.4x
Wed, 21 Jan 2026	₩4442.5t	₩3879.3t	₩191.6t	13.9x	23.2x	1.1x
Fri, 19 Dec 2025	₩3656.2t	₩3882.1t	₩191.9t	13.5x	19.1x	0.9x
Sun, 16 Nov 2025	₩3644.9t	₩3807.4t	₩186.9t	14.2x	19.5x	1x
Tue, 14 Oct 2025	₩3289.7t	₩3818.8t	₩172.8t	14.8x	19x	0.9x
Thu, 11 Sep 2025	₩3051.6t	₩3821.5t	₩173.0t	14.8x	17.6x	0.8x
Sat, 09 Aug 2025	₩2954.0t	₩3764.3t	₩177.0t	13.8x	16.7x	0.8x
Mon, 07 Jul 2025	₩2796.6t	₩3763.9t	₩176.5t	13x	15.8x	0.7x
Wed, 04 Jun 2025	₩2499.9t	₩3745.5t	₩179.1t	12.1x	14x	0.7x
Fri, 02 May 2025	₩2373.1t	₩3701.7t	₩170.1t	11.6x	14x	0.6x
Sun, 30 Mar 2025	₩2369.1t	₩3664.5t	₩166.7t	11.3x	14.2x	0.6x
Tue, 25 Feb 2025	₩2375.9t	₩3602.2t	₩154.5t	12.4x	15.4x	0.7x
Thu, 23 Jan 2025	₩2361.8t	₩3635.3t	₩149.0t	11.8x	15.9x	0.6x
Sat, 21 Dec 2024	₩2219.7t	₩3636.5t	₩148.9t	11.4x	14.9x	0.6x
Mon, 18 Nov 2024	₩2238.6t	₩3585.2t	₩148.4t	10.6x	15.1x	0.6x
Wed, 16 Oct 2024	₩2443.3t	₩3580.5t	₩141.3t	11.4x	17.3x	0.7x
Fri, 13 Sep 2024	₩2376.4t	₩3581.5t	₩141.2t	11.3x	16.8x	0.7x
Sun, 11 Aug 2024	₩2404.3t	₩3544.2t	₩132.4t	11.6x	18.2x	0.7x
Tue, 09 Jul 2024	₩2658.8t	₩3533.0t	₩120.0t	12.6x	22.2x	0.8x
Thu, 06 Jun 2024	₩2516.4t	₩3524.2t	₩120.8t	12.7x	20.8x	0.7x
Sat, 04 May 2024	₩2502.2t	₩3525.8t	₩111.2t	13.2x	22.5x	0.7x
Mon, 01 Apr 2024	₩2574.4t	₩3522.2t	₩103.9t	13x	24.8x	0.7x
Wed, 28 Feb 2024	₩2449.9t	₩3620.0t	₩100.8t	14x	24.3x	0.7x
Fri, 26 Jan 2024	₩2321.0t	₩3636.6t	₩106.4t	14.3x	21.8x	0.6x
Sun, 24 Dec 2023	₩2429.9t	₩3643.7t	₩106.2t	14.7x	22.9x	0.7x
Tue, 21 Nov 2023	₩2311.8t	₩3651.8t	₩108.3t	13.5x	21.3x	0.6x
Thu, 19 Oct 2023	₩2278.7t	₩3650.1t	₩106.6t	13.1x	21.4x	0.6x
Sat, 16 Sep 2023	₩2399.1t	₩3651.5t	₩106.6t	14x	22.5x	0.7x
Mon, 14 Aug 2023	₩2417.9t	₩3693.5t	₩125.3t	13.9x	19.3x	0.7x

Current Market PE

Investors are pessimistic on the South Korean market, indicating that they anticipate earnings will not grow as fast as they have historically.

The market is trading at a PE ratio of 11.8x which is lower than its 3-year average PE of 19.7x.

Past Earnings Growth

The earnings for South Korean listed companies have grown 55% per year over the last three years.
Revenues for these companies have grown 5.6% per year.
This means that more sales are being generated by these companies overall, and subsequently their profits are increasing too.

Sector Trends

Which sectors have driven the changes within the South Korean Market?


KR Market	13.42%
Industrials	18.15%
Materials	16.06%
Tech	14.10%
Healthcare	12.96%
Consumer Discretionary	11.97%
Utilities	9.24%
Telecom	7.83%
Consumer Staples	5.66%
Financials	5.55%
Real Estate	2.38%
Information Technology	0%	0
Financials	0%	0
Health Care	0%	0
Industrials	0%	0
Energy	-0.084%

Sector PE

Investors favour the Real Estate sector the most for future growth, which is trading close to its 3-year average PE ratio of 159x.

It looks like investors are confident that earnings will grow faster in the future than they have historically.

The Utilities sector is the least preferred by investors for future growth, which is trading below its 3-year average of 3.9x.

Forecasted Growth

Analysts are most optimistic on the Materials sector, expecting annual earnings growth of 37% over the next 5 years.
This is better than its past earnings decline of 6.0% per year.

In contrast, the Financials sector is expected to see its earnings grow by 7.2% per year over the next few years.

Top Stock Gainers and Losers

Which companies have driven the market over the last 7 days?

Company	Last Price	7D	1Y	Valuation	Sector
A005930 Samsung Electronics	₩230.50k	11.4% +₩154.7t	227.0%	PE10.1x	Tech
A000660 SK hynix	₩1.50m	13.1% +₩126.1t	470.6%	PE6.7x	Tech
A009150 Samsung Electro-Mechanics	₩1.23m	39.8% +₩26.4t	691.4%	PE103.4x	Tech
A402340 SK Square	₩970.00k	21.4% +₩22.5t	583.6%	PE8.2x	Industrials
A005380 Hyundai Motor	₩400.00k	14.0% +₩12.8t	88.2%	PE12.9x	Consumer Discretionary

Company

Last Price

Valuation

Sector

A005930 Samsung Electronics

₩230.50k

11.4%
+₩154.7t

227.0%

PE10.1x

Tech

A000660 SK hynix

₩1.50m

13.1%
+₩126.1t

470.6%

PE6.7x

Tech

A009150 Samsung Electro-Mechanics

₩1.23m

39.8%
+₩26.4t

691.4%

PE103.4x

Tech

A402340 SK Square

₩970.00k

21.4%
+₩22.5t

583.6%

PE8.2x

Industrials

A005380 Hyundai Motor

₩400.00k

14.0%
+₩12.8t

88.2%

PE12.9x

Consumer Discretionary

Samsung Electronics Unveils Next-Generation 3D Memory Solutions Including zHBM, zNAND-O, And V10 BV-NAND

Samsung Electronics showcased its latest AI memory innovations at Future of Memory and Storage (FMS) 2026 in Santa Clara, California. Samsung presented its latest AI memory portfolio and technology roadmap, including a preview of its zHBM and zNAND-O concept models, the industry-first introduction of its V10 BV-NAND with 400-plus layers, and a comprehensive range of solutions designed to advance future AI infrastructure. Samsung is also featuring its AI cloud server-inspired booth at FMS 2026, where approximately 30 memory and storage technologies are on display. Titled "Driving the Wave of AI Revolution: 3D Innovations in Memory & Storage Architecture," the keynote presented Samsung's vision to maximize AI system performance and power efficiency while addressing the rapidly growing demands of high-performance computing (HPC) and AI infrastructure. The company also unveiled V10 BV-NAND, an architecture enabled by a new wafer bonding technology — for the first time in the industry. At FMS 2026, Samsung unveiled the industry's first concept models of zHBM and zNAND-O, presenting its vision for the next generation of 3D memory architectures. Designed for advanced AI computing, zHBM presents a new memory architecture that vertically stacks HBM directly above AI accelerators, moving beyond conventional designs in which HBM is positioned alongside the processor. By minimizing the distance that data travels between the AI processor and memory, zHBM is designed to deliver higher bandwidth and improved power efficiency, enabling the ultra-fast data processing required for large-scale AI training and inference. A next-generation interface system incorporating zHBM is expected to deliver approximately eight times the performance of HBM5. With next-generation wafer bonding technology, zHBM can achieve more than 10 times the memory density of HBM5 while enhancing energy efficiency threefold and reducing thermal resistance by more than half, maximizing the stability and power efficiency of high-capacity, high-bandwidth systems. zHBM also supports customer-specific designs, enabling customized IP to be integrated into the interlayer between the memory and AI accelerator to expand memory capacity and enhance accelerator performance. The company also introduced zNAND-O, a next-generation high-performance NAND solution built on its V-NAND technology and in development in four- and eight-layer versions. By combining high space efficiency, improved I/O performance, and low latency, zNAND-O is optimized for edge AI environments supporting real-time, data-intensive AI applications. Samsung unveiled V10 BV-NAND, featuring its new Bonding V-NAND architecture. With more than 400 layers, V10 BV-NAND delivers higher performance and power efficiency while significantly increasing storage density. By applying wafer bonding technology to stack memory cells, Samsung has increased memory density by approximately 58% over the previous generation (V9). Beyond the increased layer count, V10 BV-NAND also improves read, write and I/O performance over the previous generation, supporting high-performance, high-capacity NAND for future AI systems and applications. Samsung also presented its latest AI memory and storage portfolio — including HBM4E, HBM5, LPDDR5X-PIM and PM1763 — highlighting its roadmap for next-generation AI computing and data center infrastructure. Following the industry's first mass production of HBM4 using its 1c DRAM and 4-nanometer (nm) base die technologies in February, Samsung was the first to begin shipping HBM4E samples to global customers in May, reinforcing its leadership in next-generation HBM. Along with its HBM4E samples and HBM5 model, the company showcased its LPDDR5X-PIM, the industry's first LPDDR memory with processing-in-memory technology. The new solution is built to perform data processing within the memory itself to improve the efficiency of both data movement and power. The exhibition also featured Samsung's latest enterprise storage solutions — including PM1763 and BM1773 — designed to meet the growing storage demands of AI data centers. As the world's only integrated device manufacturer (IDM) with industry-leading capabilities spanning memory, foundry and advanced packaging, Samsung presented its end-to-end strategy for next-generation AI infrastructure, which provides customers with one-stop turnkey solutions supporting the evolving needs of the AI era. From product design through mass production, Samsung delivers integrated development and manufacturing services that help shorten development cycles while optimizing performance and power efficiency, enabling customers to quickly bring differentiated AI semiconductor solutions to market.

South Korean (KOSPI) Market Analysis & Valuation

Market Valuation and Performance

Sector Trends

Top Stock Gainers and Losers

Market Insights

What Korea's market says about your index fund

Latest News

Kt&G Corporation Raises Earnings Guidance for the Full Year 2026

Samsung Electronics Unveils Next-Generation 3D Memory Solutions Including zHBM, zNAND-O, And V10 BV-NAND

A005380: Robotics And World Cup Exposure Will Drive Future Multiple Expansion

Investor sentiment improves as stock rises 21%

Upcoming dividend of ₩270 per share

New major risk - Revenue and earnings growth

A012450: Updated Fair Value And Premium P/E Will Support Future Upside

Investor sentiment deteriorates as stock falls 21%

Price target decreased by 11% to ₩2,330,370

Now 47% overvalued

A096770: Future Returns Will Rely On Higher Fair Value Versus Lower P/E

Price target decreased by 8.5% to ₩128,529

New major risk - Share price stability

A259960: Share Repurchases And Adjusted Earnings Multiple Will Support Future Returns

Samsung Biologics Co.,Ltd. (KOSE:A207940) entered into a transaction agreement to acquire PolyPeptide Group AG (SWX:PPGN) from Draupnir Holding B.V. and others for CHF 1.5 billion.

DB Insurance Co., Ltd. (KOSE:A005830) completed the acquisition of The Fortegra Group, Inc. from Tiptree Holdings LLC, Warburg Pincus LLC and others.