French (CAC) Semiconductors Industry Analysis

Industry Valuation and Performance

Has the French Semiconductors Industry valuation changed over the past few years?

Date	Market Cap	Revenue	Earnings	PE	Absolute PE	PS
Sat, 06 Jun 2026	€63.6b	€12.2b	-€69,851,540.00	76x	-910.2x	5.2x
Mon, 04 May 2026	€47.3b	€12.2b	€170.2m	61.6x	277.9x	3.9x
Wed, 01 Apr 2026	€28.6b	€11.9b	€176.1m	45.6x	162.4x	2.4x
Fri, 27 Feb 2026	€28.5b	€11.7b	€172.8m	46.3x	165x	2.4x
Sun, 25 Jan 2026	€24.3b	€11.6b	€478.3m	45.3x	50.8x	2.1x
Tue, 23 Dec 2025	€21.7b	€11.7b	€481.2m	41.8x	45.1x	1.9x
Thu, 20 Nov 2025	€19.6b	€12.0b	€571.4m	35.1x	34.3x	1.6x
Sat, 18 Oct 2025	€24.9b	€11.9b	€671.8m	36.2x	37x	2.1x
Mon, 15 Sep 2025	€22.2b	€11.8b	€660.2m	33.3x	33.6x	1.9x
Wed, 13 Aug 2025	€22.9b	€11.9b	€663.3m	36.2x	34.5x	1.9x
Fri, 11 Jul 2025	€28.4b	€12.2b	€1.1b	20.3x	26.8x	2.3x
Sun, 08 Jun 2025	€24.8b	€12.5b	€1.1b	18.3x	22.8x	2x
Tue, 06 May 2025	€20.8b	€12.6b	€1.1b	16.3x	18.7x	1.7x
Thu, 03 Apr 2025	€20.2b	€14.0b	€1.6b	12.4x	12.7x	1.4x
Sat, 01 Mar 2025	€24.4b	€14.5b	€1.7b	14.2x	14.8x	1.7x
Mon, 27 Jan 2025	€25.6b	€15.4b	€2.2b	16.3x	11.8x	1.7x
Wed, 25 Dec 2024	€25.5b	€15.5b	€2.2b	11.7x	11.6x	1.6x
Fri, 22 Nov 2024	€23.8b	€15.4b	€2.2b	11x	11x	1.5x
Sun, 20 Oct 2024	€26.7b	€16.1b	€2.9b	11.6x	9.3x	1.7x
Tue, 17 Sep 2024	€26.5b	€15.7b	€2.8b	15.5x	9.4x	1.7x
Thu, 15 Aug 2024	€28.8b	€15.9b	€2.8b	15.6x	10.2x	1.8x
Sat, 13 Jul 2024	€40.7b	€17.0b	€3.5b	15.5x	11.7x	2.4x
Mon, 10 Jun 2024	€42.4b	€17.2b	€3.5b	16.3x	12.1x	2.5x
Wed, 08 May 2024	€39.1b	€17.3b	€3.6b	15.9x	11x	2.3x
Fri, 05 Apr 2024	€40.1b	€17.9b	€4.0b	15.7x	9.9x	2.2x
Sun, 03 Mar 2024	€45.2b	€17.9b	€4.2b	22.6x	10.6x	2.5x
Tue, 30 Jan 2024	€43.2b	€17.9b	€4.2b	22.2x	10.2x	2.4x
Thu, 28 Dec 2023	€48.7b	€17.6b	€4.6b	27.1x	10.5x	2.8x
Sat, 25 Nov 2023	€45.1b	€17.8b	€4.7b	26.9x	9.6x	2.5x
Mon, 23 Oct 2023	€40.4b	€18.3b	€4.8b	21x	8.4x	2.2x
Wed, 20 Sep 2023	€43.7b	€18.1b	€4.8b	23.8x	9.2x	2.4x
Fri, 18 Aug 2023	€46.3b	€17.8b	€4.7b	26.4x	9.9x	2.6x
Sun, 16 Jul 2023	€50.9b	€16.8b	€4.4b	26.3x	11.6x	3x
Tue, 13 Jun 2023	€47.8b	€17.5b	€4.6b	22.2x	10.4x	2.7x

Current Industry PE

Investors are optimistic on the French Semiconductor industry, and appear confident in long term growth rates.

The 3-year average PS ratio of 2.2x is lower than the industry's current PS ratio of 5.6x.

Past Earnings Growth

Total earnings for the Semiconductor industry have declined over the last three years, with the industry now making a loss overall.
Revenues have also declined 12% per year, which is driving profits down.

Industry Trends

Which industries have driven the changes within the French Tech industry?


FR Market	-0.077%
Tech	2.51%
Semiconductors	3.54%
Semiconductors	6.22%
Semiconductor Equipment	-16.52%

Industry PE

Investors are most optimistic about the Semiconductors industry which is trading above its 3-year average PE ratio of 41.9x.

Analysts are expecting annual earnings growth of 40.0%, which is higher than its past year's earnings decline of 62.8% per year.

Forecasted Growth

Analysts are most optimistic on the Semiconductor Equipment industry, expecting annual earnings growth of 64% over the next 5 years.
This is better than its past earnings growth rate of 5.6% per year.

In contrast, the Semiconductors industry is expected to see its earnings grow by 40% per year over the next few years.

	Company	Last Price	7D	1Y	Valuation
	STMPA STMicroelectronics	€62.82	6.6% +€3.4b	150.8%	PE437.8x
	MEMS MEMSCAP	€6.00	2.9% +€1.3m	70.2%	PE51x

Company

Last Price

Valuation

STMPA STMicroelectronics

€62.82

6.6%
+€3.4b

150.8%

PE437.8x

MEMS MEMSCAP

€6.00

2.9%
+€1.3m

70.2%

PE51x

STMicroelectronics N.V. Introduces Intelligent Vibration Sensor with In-Sensor Ai for Industrial Condition Monitoring

STMicroelectronics N.V. introduced an intelligent vibration sensor designed for industrial condition monitoring applications that require high accuracy, reliability, and energy efficiency. Built using ST MEMS (Micro Electromechanical Systems) technology, the IIS3DWB10IS vibration sensor with intelligent sensor processing unit (ISPU 2.0) brings advanced digital signal processing and AI inference closer to the sensing element. The result is a compact, rugged device that measures vibrations and shocks up to 200g at frequencies of 10 kHz and above. Combining digital precision and ease of use with a wide temperature range, up to 125°C, to withstand harsh environments, the vibration sensor is engineered to help customers improve equipment uptime, reduce unplanned downtime, and support predictive maintenance strategies across industrial environments. Vibration analysis is the dominant segment in condition monitoring, as many industries use rotating and oscillating machinery for cutting, shaping, moving, cooling, and other processes. The ability to prevent equipment stoppages through early detection of issues, such as predicting bearing failures in advance, helps companies across all sectors, including automotive and other manufacturing activities to optimize production flow. The IIS3DWB10IS vibration sensor is the first digital sensor with wide bandwidth and embedded processing to deliver performance meeting the needs of high-end industrial condition monitoring applications offering a compelling alternative to piezoelectric sensors. Accurate measurement of vibrations above 10 kHz, with a large dynamic range up to 200g, combines with a noise floor as low as 35 µg/sqrt(Hz). This is comparable to the noise performance of piezoelectric sensors. Moreover, the IIS3DWB10IS delivers equivalent accuracy and sensitivity, adding digital-sensing advantages including smaller size, lower power consumption, simplified electrical and mechanical design, and greater flexibility in the computational partitioning. ISPU 2.0 (Intelligent Sensor Processing Unit) introduces new hardware accelerators to perform real-time signal processing and AI at the edge. These hardware accelerators make frequently used functions faster and more power efficient. The core is C-programmable and contains on-chip program and data RAM. The supporting ecosystem provides software libraries that facilitate executing typical vibration monitoring algorithms in the ISPU, including FFT, filtering, envelope, velocity severity, and anomaly detection. With 40 MIPS and 40 MFLOPS digital signal processing, the ISPU 2.0 delivers up to four times the processing performance of the previous generation. In addition, the ISPU 2.0 sensor interface supports six times faster data transfer with the MEMS circuitry. The IIS3DWB10IS also contains a 2048x80-bit FIFO register and an accurate temperature sensor. The sensor’s rugged MEMS-based design supports operation up to 125°C. The IIS3DWB10IS is supported in ST’s 10-year industrial longevity program. The IIS3DWB10IS is packaged as a 4.5 mm x 4.5 mm x 1.5 mm 16-lead LGA package with wettable flanks that facilitate automatic optical inspection in high-quality surface-mount assembly processes. The product is scheduled to be available by July 2026 from $25 for orders of 1,000 pieces.

French (CAC) Semiconductors Industry Analysis

Industry Valuation and Performance

Industry Trends

Top Stock Gainers and Losers

Latest News

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