NasdaqGS:GFSSemiconductor
How GlobalFoundries’ 3D RF Wafer Bonding Breakthrough Could Reshape GFS’s Differentiated Chip Strategy
GlobalFoundries recently announced that its SLATE wafer-to-wafer bonding technology is now production-ready on the 9SW RF-SOI platform at its 300mm Singapore fab, with 9SW SLATE expected to reach volume production by the second half of 2027.
This 3D integration approach, which can shrink RF die size by up to 45% for compact 5G front-ends, positions GlobalFoundries to address space-constrained mobile and satellite applications with more integrated, power-efficient solutions.
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