NasdaqGS:INTCSemiconductor
Can Intel’s New Foundry Chief Reframe INTC’s Role in Advanced Packaging and AI Supply Chains?
Earlier this month, Intel appointed former SK hynix and SK On chief Seok-Hee Lee as executive vice president of Intel Foundry, putting him in charge of advanced packaging, system integration, and back-end manufacturing as the company pushes its 18A-P process into risk production and ramps Apple-backed U.S. chipmaking.
This move brings deep memory and high-bandwidth packaging expertise into Intel just as advanced packaging and domestic foundry capacity become central to AI infrastructure and...