NasdaqGS:TSEMSemiconductor
Why Tower Semiconductor (TSEM) Is Up 18.1% After Expanding 3D-IC Wafer Tech for Data Centers
Earlier this week, Tower Semiconductor announced the expansion of its 300mm wafer bonding technology to enable heterogeneous 3D-IC integration across Silicon Photonics and SiGe BiCMOS, with full support from Cadence design tools for unified multi-technology design.
This move targets soaring demand for compact, high-performance systems in data centers and AI infrastructure, reinforcing Tower's role at the forefront of photonic and electronic integration.
We'll examine how Tower's advances in...