NasdaqGS:LRCXSemiconductor
Lam Research (LRCX) Bets on 3D Chip Packaging Can It Redefine Advanced AI Hardware Leadership?
Lam Research recently introduced VECTOR TEOS 3D, a new deposition tool built for advanced packaging in next-generation AI and high-performance computing chips, addressing crucial challenges in 3D stacking and wafer gapfill production.
This innovation reflects Lam's ongoing push into advanced chip manufacturing technologies, enabling chiplet architectures poised to power the rapidly expanding AI and data center markets.
We'll explore how Lam’s introduction of a purpose-built 3D packaging...