NYSE:TSMSemiconductor
TSMC Weighs Arizona Packaging Expansion Against Delayed Next EUV Investment
Taiwan Semiconductor Manufacturing (NYSE:TSM) plans to open a major chip packaging plant in Arizona through a partnership with Amkor.
The company expects to expand advanced packaging capabilities in the U.S. ahead of 2029, adding to its existing Arizona wafer fabs.
TSMC is delaying adoption of ASML’s next generation EUV lithography equipment until at least 2029.
For investors tracking NYSE:TSM, the latest moves come as the stock trades around $397.67, with a 1 year return of 124.0% and a 3...