Lasertec Dividend
Dividend criteria checks 0/6
Lasertec is a dividend paying company with a current yield of 0.47%. Next payment date is on 28th September, 2024 with an ex-dividend date of 27th June, 2024.
Key information
0.5%
Dividend yield
27%
Payout ratio
Industry average yield | 1.0% |
Next dividend pay date | 28 Sep 24 |
Ex dividend date | 27 Jun 24 |
Dividend per share | n/a |
Earnings per share | JP¥742.55 |
Dividend yield forecast in 3Y | 1.0% |
Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 6920 is not paying a notable dividend for the JP market, therefore no need to check if payments are stable.
Growing Dividend: 6920 is not paying a notable dividend for the JP market, therefore no need to check if payments are increasing.
Dividend Yield vs Market
Lasertec Dividend Yield vs Market |
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Segment | Dividend Yield |
---|---|
Company (6920) | 0.5% |
Market Bottom 25% (JP) | 1.6% |
Market Top 25% (JP) | 3.2% |
Industry Average (Semiconductor) | 1.0% |
Analyst forecast in 3 Years (6920) | 1.0% |
Notable Dividend: 6920's dividend (0.47%) isn’t notable compared to the bottom 25% of dividend payers in the JP market (1.6%).
High Dividend: 6920's dividend (0.47%) is low compared to the top 25% of dividend payers in the JP market (3.23%).
Earnings Payout to Shareholders
Earnings Coverage: 6920 is not paying a notable dividend for the JP market.
Cash Payout to Shareholders
Cash Flow Coverage: 6920 is not paying a notable dividend for the JP market.