NasdaqGS:MUSemiconductor
Micron’s Early HBM4 Ramp And Massive US Buildout Test Valuation
Micron Technology has started volume production of its next generation HBM4 memory a quarter earlier than planned.
The company reports its entire 2026 HBM capacity is already committed under multi year agreements.
Micron is investing US$100b in a new semiconductor facility in New York and committing a further US$200b to expand DRAM production.
For investors watching NasdaqGS:MU, this news comes on top of a share price of US$411.66 and very strong multi year returns. The stock is up 10.3%...