공지 • Feb 18
Resonac Holdings Corporation to Report Q1, 2026 Results on May 13, 2026 Resonac Holdings Corporation announced that they will report Q1, 2026 results at 3:30 PM, Tokyo Standard Time on May 13, 2026 공지 • Nov 15
Resonac Holdings Corporation to Report Fiscal Year 2025 Results on Feb 13, 2026 Resonac Holdings Corporation announced that they will report fiscal year 2025 results at 3:30 PM, Tokyo Standard Time on Feb 13, 2026 공지 • Jul 02
RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004). RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025.
RCapital Partners LLP completed the acquisition of F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025. 공지 • Mar 17
Resonac Holdings Corporation to Report Q3, 2025 Results on Nov 13, 2025 Resonac Holdings Corporation announced that they will report Q3, 2025 results on Nov 13, 2025 공지 • Feb 14
Resonac Holdings Corporation to Report Q2, 2025 Results on Aug 07, 2025 Resonac Holdings Corporation announced that they will report Q2, 2025 results on Aug 07, 2025 공지 • Feb 13
Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2025 Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2025. 공지 • Nov 13
Resonac Holdings Corporation to Report Q1, 2025 Results on May 15, 2025 Resonac Holdings Corporation announced that they will report Q1, 2025 results on May 15, 2025 공지 • Sep 20
Resonac Corporation Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor Packages Resonac Corporation has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process) and semiconductor packaging process (back-end process), as well as its debonding process. This debonding process uses xenon (Xe) flash light irradiation to debond the wafer or package from the carrier and can be applied from wafer level to panel level processing. It also should be noted that Debonding is completed in a shorter time as compared to the conventional laser ablation method without producing foreign substances such as soot. This technology has been patented in Japan, the United States, Korea, China, and Taiwan region. Easy removal of temporary bonding film by peeling off. Therefore, the performance of the temporary bonding material must be compatible with all fabrication processes, and the residual temporary bonding material must be easily removed. Additionally, debonding process must be completed in a short time without damaging them to achieve high yield and productivity. Furthermore, even the back-end process is now required to be as clean as the front-end process. Therefore, the soot which is generated by the conventional laser ablation debonding method has not been preferable. Resonac's temporary debonding film with high heat resistance and chemical resistance exhibits sufficient adhesion performance when wafers and packages are temporarily supported on the carrier. Once they are debonded from the carrier, the film can be removed easily by peeling at room temperature without any residues. The process for debonded the wafer from the carrier adopts Xe flash light irradiation, which allows for large-area batch irradiation and instantaneous high energy output. Instant deformation induced by locally heating a metal layer on the glass carrier with Xe flash light irradiation enables quick debonded of wafers and packages without applying heat or mechanical stress. In addition, as the debonding mechanism is not related to resin decision, this method has the advantage of being a clean process that does not generate any foreign substances, such as soot generated during laser ablation. Resonac believes that this temporary bonding film and new debonding method are suitable for the fabrication process for memory, logic, and power semiconductors as well as advanced semiconductor packages. 공지 • Aug 09
Resonac Holdings Corporation to Report Fiscal Year 2024 Results on Feb 13, 2025 Resonac Holdings Corporation announced that they will report fiscal year 2024 results on Feb 13, 2025 공지 • May 16
Resonac Holdings Corporation Provides Earnings Guidance for the First Half and Fiscal Year Ending December 31, 2024 Resonac Holdings Corporation provided earnings guidance for the first half and fiscal year ending December 31, 2024. For the first half, the company expected net sales to be JPY 670,000 million, Operating income to be JPY 14,000 million.For the year, the company expected net sales to be JPY 1,360,000 million, Operating income to be JPY 47,000 million, Net income attributable to owners of the parent of JPY 25,000 million, and Net income attributable to owners of the parent per share: Basic of JPY 138.34. 공지 • Feb 16
Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2024 Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2024. 공지 • Feb 15
Resonac Holdings Corporation to Report Q1, 2024 Results on May 15, 2024 Resonac Holdings Corporation announced that they will report Q1, 2024 results at 3:00 PM, Tokyo Standard Time on May 15, 2024 공지 • Dec 05
Resonac Holdings Corporation to Report Fiscal Year 2023 Results on Feb 14, 2024 Resonac Holdings Corporation announced that they will report fiscal year 2023 results on Feb 14, 2024 공지 • Nov 21
Resonac Holdings Corporation Announces Board Resignations Resonac Holdings Corporation decided at its board of directors meeting November 21, 2023 on changes in corporate management (directors and audit & supervisory board members): Kohei Morikawa (Representative Director; Chairman of the Board) will resign as Representative Director. Keiichi Kamiguchi (Board Director; Managing Corporate Officer; Chief Risk Management Officer (CRO)) will resign as Board Director at the General Meeting of Shareholders in late March 2024. Kiyoshi Nishioka (Outside Board Director) will resign as Outside Board Director at the General Meeting of Shareholders in late March 2024. Jun Tanaka (Audit & Supervisory Board Member) will resign as Audit & Supervisory Board Member at the General Meeting of Shareholders in late March 2024. Kiyomi Saito (Outside Member of Audit & Supervisory Board) will resign as Outside Member of Audit & Supervisory Board at the General Meeting of Shareholders in late March 2024. 공지 • Nov 11
Resonac Holdings Corporation Provides Dividend Guidance for the Year-End 2023 Resonac Holdings Corporation provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share. 공지 • Aug 27
Resonac Holdings Corporation to Report Q3, 2023 Results on Nov 09, 2023 Resonac Holdings Corporation announced that they will report Q3, 2023 results on Nov 09, 2023 공지 • Jun 01
Resonac Holdings Corporation to Report Q2, 2023 Results on Aug 08, 2023 Resonac Holdings Corporation announced that they will report Q2, 2023 results on Aug 08, 2023 공지 • Feb 16
Resonac Holdings Corporation, Annual General Meeting, Mar 30, 2023 Resonac Holdings Corporation, Annual General Meeting, Mar 30, 2023. 공지 • Dec 09
Showa Denko K.K. to Report Fiscal Year 2022 Results on Feb 14, 2023 Showa Denko K.K. announced that they will report fiscal year 2022 results on Feb 14, 2023 
