View Financial HealthResonac Holdings 배당 및 자사주 매입배당 기준 점검 0/6Resonac Holdings 은(는) 현재 수익률이 0.41% 인 배당금 지급 회사입니다.핵심 정보0.4%배당 수익률0.0002%자사주 매입 수익률총 주주 수익률0.4%미래 배당 수익률0.5%배당 성장률3.6%다음 배당 지급일n/a배당락일n/a주당 배당금n/a배당 성향33%최근 배당 및 자사주 매입 업데이트공시 • Feb 18+ 1 more updateResonac Holdings Corporation Announces Dividend for the Year Ended December 31, 2024; Provides Dividend Guidance for the Year Ending December 31, 2025Resonac Holdings Corporation announced dividend for the year ended December 31, 2024. For the year, company announced dividend of JPY 65.00 per share against JPY 65.00 per share a year ago. For the year ending December 31, 2025, the company expects to pay a dividend of JPY 65.00 per share compared to JPY 65.00 per share a year ago.공시 • Nov 11Resonac Holdings Corporation Provides Dividend Guidance for the Year-End 2023Resonac Holdings Corporation provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share.공시 • May 17+ 1 more updateShowa Denko K.K. Provides Dividend Guidance for the Year-End 2023Showa Denko K.K. provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share.모든 업데이트 보기Recent updates공시 • May 14Resonac Holdings Corporation to Report Fiscal Year 2026 Results on Feb 15, 2027Resonac Holdings Corporation announced that they will report fiscal year 2026 results at 6:30 AM, Coordinated Universal Time on Feb 15, 2027공시 • Apr 07+ 1 more updateResonac Holdings Corporation to Report Q3, 2026 Results on Nov 11, 2026Resonac Holdings Corporation announced that they will report Q3, 2026 results at 3:30 PM, Tokyo Standard Time on Nov 11, 2026공시 • Feb 18Resonac Holdings Corporation to Report Q1, 2026 Results on May 13, 2026Resonac Holdings Corporation announced that they will report Q1, 2026 results at 3:30 PM, Tokyo Standard Time on May 13, 2026공시 • Feb 13+ 2 more updatesResonac Holdings Corporation, Annual General Meeting, Mar 26, 2026Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2026.공시 • Nov 15Resonac Holdings Corporation to Report Fiscal Year 2025 Results on Feb 13, 2026Resonac Holdings Corporation announced that they will report fiscal year 2025 results at 3:30 PM, Tokyo Standard Time on Feb 13, 2026공시 • Jul 02RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004).RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025. RCapital Partners LLP completed the acquisition of F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025.공시 • Mar 17Resonac Holdings Corporation to Report Q3, 2025 Results on Nov 13, 2025Resonac Holdings Corporation announced that they will report Q3, 2025 results on Nov 13, 2025공시 • Feb 18+ 1 more updateResonac Holdings Corporation Announces Dividend for the Year Ended December 31, 2024; Provides Dividend Guidance for the Year Ending December 31, 2025Resonac Holdings Corporation announced dividend for the year ended December 31, 2024. For the year, company announced dividend of JPY 65.00 per share against JPY 65.00 per share a year ago. For the year ending December 31, 2025, the company expects to pay a dividend of JPY 65.00 per share compared to JPY 65.00 per share a year ago.공시 • Feb 14Resonac Holdings Corporation to Report Q2, 2025 Results on Aug 07, 2025Resonac Holdings Corporation announced that they will report Q2, 2025 results on Aug 07, 2025공시 • Feb 13Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2025Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2025.공시 • Nov 13Resonac Holdings Corporation to Report Q1, 2025 Results on May 15, 2025Resonac Holdings Corporation announced that they will report Q1, 2025 results on May 15, 2025공시 • Sep 20Resonac Corporation Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor PackagesResonac Corporation has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process) and semiconductor packaging process (back-end process), as well as its debonding process. This debonding process uses xenon (Xe) flash light irradiation to debond the wafer or package from the carrier and can be applied from wafer level to panel level processing. It also should be noted that Debonding is completed in a shorter time as compared to the conventional laser ablation method without producing foreign substances such as soot. This technology has been patented in Japan, the United States, Korea, China, and Taiwan region. Easy removal of temporary bonding film by peeling off. Therefore, the performance of the temporary bonding material must be compatible with all fabrication processes, and the residual temporary bonding material must be easily removed. Additionally, debonding process must be completed in a short time without damaging them to achieve high yield and productivity. Furthermore, even the back-end process is now required to be as clean as the front-end process. Therefore, the soot which is generated by the conventional laser ablation debonding method has not been preferable. Resonac's temporary debonding film with high heat resistance and chemical resistance exhibits sufficient adhesion performance when wafers and packages are temporarily supported on the carrier. Once they are debonded from the carrier, the film can be removed easily by peeling at room temperature without any residues. The process for debonded the wafer from the carrier adopts Xe flash light irradiation, which allows for large-area batch irradiation and instantaneous high energy output. Instant deformation induced by locally heating a metal layer on the glass carrier with Xe flash light irradiation enables quick debonded of wafers and packages without applying heat or mechanical stress. In addition, as the debonding mechanism is not related to resin decision, this method has the advantage of being a clean process that does not generate any foreign substances, such as soot generated during laser ablation. Resonac believes that this temporary bonding film and new debonding method are suitable for the fabrication process for memory, logic, and power semiconductors as well as advanced semiconductor packages.공시 • Aug 09Resonac Holdings Corporation to Report Fiscal Year 2024 Results on Feb 13, 2025Resonac Holdings Corporation announced that they will report fiscal year 2024 results on Feb 13, 2025공시 • May 17+ 1 more updateResonac Holdings Corporation to Report Q2, 2024 Results on Aug 08, 2024Resonac Holdings Corporation announced that they will report Q2, 2024 results at 3:00 PM, Tokyo Standard Time on Aug 08, 2024공시 • May 16Resonac Holdings Corporation Provides Earnings Guidance for the First Half and Fiscal Year Ending December 31, 2024Resonac Holdings Corporation provided earnings guidance for the first half and fiscal year ending December 31, 2024. For the first half, the company expected net sales to be JPY 670,000 million, Operating income to be JPY 14,000 million.For the year, the company expected net sales to be JPY 1,360,000 million, Operating income to be JPY 47,000 million, Net income attributable to owners of the parent of JPY 25,000 million, and Net income attributable to owners of the parent per share: Basic of JPY 138.34.공시 • Feb 16Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2024Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2024.공시 • Feb 15Resonac Holdings Corporation to Report Q1, 2024 Results on May 15, 2024Resonac Holdings Corporation announced that they will report Q1, 2024 results at 3:00 PM, Tokyo Standard Time on May 15, 2024공시 • Dec 05Resonac Holdings Corporation to Report Fiscal Year 2023 Results on Feb 14, 2024Resonac Holdings Corporation announced that they will report fiscal year 2023 results on Feb 14, 2024공시 • Nov 21Resonac Holdings Corporation Announces Board ResignationsResonac Holdings Corporation decided at its board of directors meeting November 21, 2023 on changes in corporate management (directors and audit & supervisory board members): Kohei Morikawa (Representative Director; Chairman of the Board) will resign as Representative Director. Keiichi Kamiguchi (Board Director; Managing Corporate Officer; Chief Risk Management Officer (CRO)) will resign as Board Director at the General Meeting of Shareholders in late March 2024. Kiyoshi Nishioka (Outside Board Director) will resign as Outside Board Director at the General Meeting of Shareholders in late March 2024. Jun Tanaka (Audit & Supervisory Board Member) will resign as Audit & Supervisory Board Member at the General Meeting of Shareholders in late March 2024. Kiyomi Saito (Outside Member of Audit & Supervisory Board) will resign as Outside Member of Audit & Supervisory Board at the General Meeting of Shareholders in late March 2024.공시 • Nov 11Resonac Holdings Corporation Provides Dividend Guidance for the Year-End 2023Resonac Holdings Corporation provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share.공시 • Aug 27Resonac Holdings Corporation to Report Q3, 2023 Results on Nov 09, 2023Resonac Holdings Corporation announced that they will report Q3, 2023 results on Nov 09, 2023공시 • Jun 01Resonac Holdings Corporation to Report Q2, 2023 Results on Aug 08, 2023Resonac Holdings Corporation announced that they will report Q2, 2023 results on Aug 08, 2023공시 • May 17+ 1 more updateShowa Denko K.K. Provides Dividend Guidance for the Year-End 2023Showa Denko K.K. provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share.공시 • Feb 16Resonac Holdings Corporation, Annual General Meeting, Mar 30, 2023Resonac Holdings Corporation, Annual General Meeting, Mar 30, 2023.공시 • Dec 09Showa Denko K.K. to Report Fiscal Year 2022 Results on Feb 14, 2023Showa Denko K.K. announced that they will report fiscal year 2022 results on Feb 14, 2023지급의 안정성과 성장배당 데이터 가져오는 중안정적인 배당: SHWD.F US 시장에서 주목할만한 배당금을 지급하지 않으므로 지급이 안정적인지 확인할 필요가 없습니다.배당금 증가: SHWD.F US 시장에서 주목할만한 배당금을 지급하지 않으므로 지급액이 증가하는지 확인할 필요가 없습니다.배당 수익률 vs 시장Resonac Holdings 배당 수익률 vs 시장SHWD.F의 배당 수익률은 시장과 어떻게 비교되나요?구분배당 수익률회사 (SHWD.F)0.4%시장 하위 25% (US)1.4%시장 상위 25% (US)4.3%업계 평균 (Chemicals)1.7%분석가 예측 (SHWD.F) (최대 3년)0.5%주목할만한 배당금: SHWD.F 의 배당금( 0.41% )은 US 시장에서 배당금 지급자의 하위 25%( 1.42% )와 비교해 주목할 만하지 않습니다.고배당: SHWD.F 의 배당금( 0.41% )은 US 시장에서 배당금 지급자의 상위 25%( 4.27% )와 비교해 낮습니다.주주 대상 이익 배당수익 보장: SHWD.F US 시장에서 주목할만한 배당금을 지급하지 않습니다.주주 현금 배당현금 흐름 범위: SHWD.F US 시장에서 주목할만한 배당금을 지급하지 않습니다.높은 배당을 제공하는 우량 기업 찾기7D1Y7D1Y7D1YUS 시장에서 배당이 강한 기업.View Management기업 분석 및 재무 데이터 상태데이터최종 업데이트 (UTC 시간)기업 분석2026/05/21 13:10종가2026/05/19 00:00수익2026/03/31연간 수익2025/12/31데이터 소스당사의 기업 분석에 사용되는 데이터는 S&P Global Market Intelligence LLC에서 제공됩니다. 아래 데이터는 이 보고서를 생성하기 위해 분석 모델에서 사용됩니다. 데이터는 정규화되므로 소스가 제공된 후 지연이 발생할 수 있습니다.패키지데이터기간미국 소스 예시 *기업 재무제표10년손익계산서현금흐름표대차대조표SEC 양식 10-KSEC 양식 10-Q분석가 컨센서스 추정치+3년재무 예측분석가 목표주가분석가 리서치 보고서Blue Matrix시장 가격30년주가배당, 분할 및 기타 조치ICE 시장 데이터SEC 양식 S-1지분 구조10년주요 주주내부자 거래SEC 양식 4SEC 양식 13D경영진10년리더십 팀이사회SEC 양식 10-KSEC 양식 DEF 14A주요 개발10년회사 공시SEC 양식 8-K* 미국 증권에 대한 예시이며, 비(非)미국 증권에는 해당 국가의 규제 서식 및 자료원을 사용합니다.별도로 명시되지 않는 한 모든 재무 데이터는 연간 기간을 기준으로 하지만 분기별로 업데이트됩니다. 이를 TTM(최근 12개월) 또는 LTM(지난 12개월) 데이터라고 합니다. 자세히 알아보기.분석 모델 및 스노우플레이크이 보고서를 생성하는 데 사용된 분석 모델에 대한 자세한 내용은 당사의 Github 페이지에서 확인하실 수 있습니다. 또한 보고서 활용 방법에 대한 가이드와 YouTube 튜토리얼도 제공합니다.Simply Wall St 분석 모델을 설계하고 구축한 세계적 수준의 팀에 대해 알아보세요.산업 및 섹터 지표산업 및 섹터 지표는 Simply Wall St가 6시간마다 계산하며, 프로세스에 대한 자세한 내용은 Github에서 확인할 수 있습니다.분석가 소스Resonac Holdings Corporation는 25명의 분석가가 다루고 있습니다. 이 중 13명의 분석가가 우리 보고서에 입력 데이터로 사용되는 매출 또는 수익 추정치를 제출했습니다. 분석가의 제출 자료는 하루 종일 업데이트됩니다.분석가기관Mikiya YamadaBarclaysTakashi EnomotoBofA Global ResearchAtsushi IkedaCitigroup Inc22명의 분석가 더 보기
공시 • Feb 18+ 1 more updateResonac Holdings Corporation Announces Dividend for the Year Ended December 31, 2024; Provides Dividend Guidance for the Year Ending December 31, 2025Resonac Holdings Corporation announced dividend for the year ended December 31, 2024. For the year, company announced dividend of JPY 65.00 per share against JPY 65.00 per share a year ago. For the year ending December 31, 2025, the company expects to pay a dividend of JPY 65.00 per share compared to JPY 65.00 per share a year ago.
공시 • Nov 11Resonac Holdings Corporation Provides Dividend Guidance for the Year-End 2023Resonac Holdings Corporation provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share.
공시 • May 17+ 1 more updateShowa Denko K.K. Provides Dividend Guidance for the Year-End 2023Showa Denko K.K. provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share.
공시 • May 14Resonac Holdings Corporation to Report Fiscal Year 2026 Results on Feb 15, 2027Resonac Holdings Corporation announced that they will report fiscal year 2026 results at 6:30 AM, Coordinated Universal Time on Feb 15, 2027
공시 • Apr 07+ 1 more updateResonac Holdings Corporation to Report Q3, 2026 Results on Nov 11, 2026Resonac Holdings Corporation announced that they will report Q3, 2026 results at 3:30 PM, Tokyo Standard Time on Nov 11, 2026
공시 • Feb 18Resonac Holdings Corporation to Report Q1, 2026 Results on May 13, 2026Resonac Holdings Corporation announced that they will report Q1, 2026 results at 3:30 PM, Tokyo Standard Time on May 13, 2026
공시 • Feb 13+ 2 more updatesResonac Holdings Corporation, Annual General Meeting, Mar 26, 2026Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2026.
공시 • Nov 15Resonac Holdings Corporation to Report Fiscal Year 2025 Results on Feb 13, 2026Resonac Holdings Corporation announced that they will report fiscal year 2025 results at 3:30 PM, Tokyo Standard Time on Feb 13, 2026
공시 • Jul 02RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004).RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025. RCapital Partners LLP completed the acquisition of F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025.
공시 • Mar 17Resonac Holdings Corporation to Report Q3, 2025 Results on Nov 13, 2025Resonac Holdings Corporation announced that they will report Q3, 2025 results on Nov 13, 2025
공시 • Feb 18+ 1 more updateResonac Holdings Corporation Announces Dividend for the Year Ended December 31, 2024; Provides Dividend Guidance for the Year Ending December 31, 2025Resonac Holdings Corporation announced dividend for the year ended December 31, 2024. For the year, company announced dividend of JPY 65.00 per share against JPY 65.00 per share a year ago. For the year ending December 31, 2025, the company expects to pay a dividend of JPY 65.00 per share compared to JPY 65.00 per share a year ago.
공시 • Feb 14Resonac Holdings Corporation to Report Q2, 2025 Results on Aug 07, 2025Resonac Holdings Corporation announced that they will report Q2, 2025 results on Aug 07, 2025
공시 • Feb 13Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2025Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2025.
공시 • Nov 13Resonac Holdings Corporation to Report Q1, 2025 Results on May 15, 2025Resonac Holdings Corporation announced that they will report Q1, 2025 results on May 15, 2025
공시 • Sep 20Resonac Corporation Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor PackagesResonac Corporation has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process) and semiconductor packaging process (back-end process), as well as its debonding process. This debonding process uses xenon (Xe) flash light irradiation to debond the wafer or package from the carrier and can be applied from wafer level to panel level processing. It also should be noted that Debonding is completed in a shorter time as compared to the conventional laser ablation method without producing foreign substances such as soot. This technology has been patented in Japan, the United States, Korea, China, and Taiwan region. Easy removal of temporary bonding film by peeling off. Therefore, the performance of the temporary bonding material must be compatible with all fabrication processes, and the residual temporary bonding material must be easily removed. Additionally, debonding process must be completed in a short time without damaging them to achieve high yield and productivity. Furthermore, even the back-end process is now required to be as clean as the front-end process. Therefore, the soot which is generated by the conventional laser ablation debonding method has not been preferable. Resonac's temporary debonding film with high heat resistance and chemical resistance exhibits sufficient adhesion performance when wafers and packages are temporarily supported on the carrier. Once they are debonded from the carrier, the film can be removed easily by peeling at room temperature without any residues. The process for debonded the wafer from the carrier adopts Xe flash light irradiation, which allows for large-area batch irradiation and instantaneous high energy output. Instant deformation induced by locally heating a metal layer on the glass carrier with Xe flash light irradiation enables quick debonded of wafers and packages without applying heat or mechanical stress. In addition, as the debonding mechanism is not related to resin decision, this method has the advantage of being a clean process that does not generate any foreign substances, such as soot generated during laser ablation. Resonac believes that this temporary bonding film and new debonding method are suitable for the fabrication process for memory, logic, and power semiconductors as well as advanced semiconductor packages.
공시 • Aug 09Resonac Holdings Corporation to Report Fiscal Year 2024 Results on Feb 13, 2025Resonac Holdings Corporation announced that they will report fiscal year 2024 results on Feb 13, 2025
공시 • May 17+ 1 more updateResonac Holdings Corporation to Report Q2, 2024 Results on Aug 08, 2024Resonac Holdings Corporation announced that they will report Q2, 2024 results at 3:00 PM, Tokyo Standard Time on Aug 08, 2024
공시 • May 16Resonac Holdings Corporation Provides Earnings Guidance for the First Half and Fiscal Year Ending December 31, 2024Resonac Holdings Corporation provided earnings guidance for the first half and fiscal year ending December 31, 2024. For the first half, the company expected net sales to be JPY 670,000 million, Operating income to be JPY 14,000 million.For the year, the company expected net sales to be JPY 1,360,000 million, Operating income to be JPY 47,000 million, Net income attributable to owners of the parent of JPY 25,000 million, and Net income attributable to owners of the parent per share: Basic of JPY 138.34.
공시 • Feb 16Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2024Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2024.
공시 • Feb 15Resonac Holdings Corporation to Report Q1, 2024 Results on May 15, 2024Resonac Holdings Corporation announced that they will report Q1, 2024 results at 3:00 PM, Tokyo Standard Time on May 15, 2024
공시 • Dec 05Resonac Holdings Corporation to Report Fiscal Year 2023 Results on Feb 14, 2024Resonac Holdings Corporation announced that they will report fiscal year 2023 results on Feb 14, 2024
공시 • Nov 21Resonac Holdings Corporation Announces Board ResignationsResonac Holdings Corporation decided at its board of directors meeting November 21, 2023 on changes in corporate management (directors and audit & supervisory board members): Kohei Morikawa (Representative Director; Chairman of the Board) will resign as Representative Director. Keiichi Kamiguchi (Board Director; Managing Corporate Officer; Chief Risk Management Officer (CRO)) will resign as Board Director at the General Meeting of Shareholders in late March 2024. Kiyoshi Nishioka (Outside Board Director) will resign as Outside Board Director at the General Meeting of Shareholders in late March 2024. Jun Tanaka (Audit & Supervisory Board Member) will resign as Audit & Supervisory Board Member at the General Meeting of Shareholders in late March 2024. Kiyomi Saito (Outside Member of Audit & Supervisory Board) will resign as Outside Member of Audit & Supervisory Board at the General Meeting of Shareholders in late March 2024.
공시 • Nov 11Resonac Holdings Corporation Provides Dividend Guidance for the Year-End 2023Resonac Holdings Corporation provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share.
공시 • Aug 27Resonac Holdings Corporation to Report Q3, 2023 Results on Nov 09, 2023Resonac Holdings Corporation announced that they will report Q3, 2023 results on Nov 09, 2023
공시 • Jun 01Resonac Holdings Corporation to Report Q2, 2023 Results on Aug 08, 2023Resonac Holdings Corporation announced that they will report Q2, 2023 results on Aug 08, 2023
공시 • May 17+ 1 more updateShowa Denko K.K. Provides Dividend Guidance for the Year-End 2023Showa Denko K.K. provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share.
공시 • Feb 16Resonac Holdings Corporation, Annual General Meeting, Mar 30, 2023Resonac Holdings Corporation, Annual General Meeting, Mar 30, 2023.
공시 • Dec 09Showa Denko K.K. to Report Fiscal Year 2022 Results on Feb 14, 2023Showa Denko K.K. announced that they will report fiscal year 2022 results on Feb 14, 2023