TSE:6857Semiconductor
Is Advantest (TSE:6857) Quietly Repositioning Its Test Platform for the AI Packaging Era?
In December 2025, Advantest and Tokyo Seimitsu announced a collaboration to co-develop a die-level prober for testing advanced AI and high-performance computing devices using complex 2.5D/3D packaging, while Advantest also introduced its T2000 AiR2X next-generation air-cooled test system and later held a board meeting to approve treasury stock disposal for post-issued restricted stock units.
This combination of a focused AI/HPC testing partnership and an expanded, more flexible SoC test...