Duyuru • Mar 13
Lasertec Corporation to Report Q3, 2026 Results on Apr 30, 2026 Lasertec Corporation announced that they will report Q3, 2026 results on Apr 30, 2026 Duyuru • Dec 12
Lasertec Corporation to Report Q2, 2026 Results on Jan 30, 2026 Lasertec Corporation announced that they will report Q2, 2026 results on Jan 30, 2026 Duyuru • Nov 01
Lasertec Corporation Provides Consolidated Earnings Guidance for the Year Ending June 30, 2026 Lasertec Corporation provided consolidated earnings guidance for the year ending June 30, 2026. For the year, the company expects net sales of JPY 200,000 million; operating income of JPY 85,000 million; Net income attributable to owners of parents of 60,000 million and net income per share of JPY 665.75. Duyuru • Mar 26
Lasertec Corporation Appoints Hiroki Miyai as Executive Officer, Effective April 1, 2025 Lasertec Corporation announced the appointment of Hiroki Miyai as Executive Officer concurrently, General Manager, Technology Department 5, previously he was General Manager,Technology Department 5, Effective April 1, 2025. Duyuru • Jan 03
Lasertec Corporation to Report Q2, 2025 Results on Jan 31, 2025 Lasertec Corporation announced that they will report Q2, 2025 results on Jan 31, 2025 Duyuru • Sep 24
Lasertec Releases SICA108, SiC Wafer Inspection and Review System Lasertec Corporation announced the release of SICA108, the latest model of its SiC wafer inspection and review systems. Featuring both surface and photoluminescence (PL) inspection capabilities in one body, SICA108 enables customers to concurrently perform high-speed inspection and high-accuracy classification of surface defects as well as crystallographic defects. SiC power devices are used in a variety of applications, including electric vehicles, air conditioners, solar cells, and railway cars, and facilitate the realization of a carbon-neutral society. However, SiC wafer production processes are technically demanding, and there are still many defects that impact device yields. It therefore remains a challenge to manufacture high-quality SiC wafers stably at a lower cost. Lasertec has released SICA108 to help overcome this challenge. Renewing the inspection optics from SICA88, the current de facto standard tool widely used among many customers, SICA108 provides higher throughput and improved performance in quality analysis of SiC wafers with a lower cost of ownership. Like its predecessor, SICA108 performs surface inspection for detecting scratches, crystal defects, and particles on the wafer surface and PL inspection for detecting basal plane dislocations (BPD) inside Epi layers and stacking faults (SF), concurrently and with high sensitivity. It also features a high-accuracy defect classification capability based on proprietary deep learning algorithm to enable the early detection and analysis of killer defects. It is also compatible with various automation systems used in smart fabs, such as automatic guided vehicles (AGV) and overhead hoist transports (OHT). Lasertec will continue to pursue the development of defect inspection technologies to address customer needs and contribute to the improvement of power device quality and productivity. Features: Concurrent inspection of surface defects and BPD/SF at high speed and with high sensitivity. Detailed classification of various defect types using high-accuracy Automatic Defect Classification (ADC) and high-resolution review images. Compatible with various automation systems, including AGV and OHT. Applications: Incoming and outgoing inspection of SiC bare wafers and SiC Epi wafers. Monitoring of SiC epitaxial growth processes. Monitoring of SiC polishing processes. Management of SiC device manufacturing processes. Duyuru • May 03
Lasertec Corporation Announces Chief Executive Officer Changes, as of July 1, 2024 Lasertec Corporation announced that it has resolved at the board of directors meeting held on April 30, 2024 to make changes in its representative directors and executive officers as follows (as of July 1, 2024): Osamu Okabayashi: Previous position: Representative Director, President & Chief Executive Officer; New position: Representative Director, Chairman & Executive Officer. Tetsuya Sendoda: Previous position: Director, Vice President & Executive Officer concurrently, Chief Sales Officer; New position: Chief Executive Officer. Resume of New Representative Director: Tetsuya Sendoda (April 26, 1977); Career Summary: Jan. 2008, Joined Lasertec Corporation; June 2020, General Manager, Technology Department 2; July 2022, Sales Officer; General Manager, Technology Department 2; and General Manager, Solution Sales Department 1; Sept. 2022 Executive Officer; Sales Officer; General Manager, Technology Department 2; and General Manager, Solution Sales Department 1; April 2023 Executive Officer; Sales Officer; and General Manager, Solution Sales Department 1; Sept. 2023 Director, Vice President & Executive Officer (current); and Chief Sales Officer (current). Duyuru • Feb 11
Lasertec Corporation to Report Q3, 2024 Results on Apr 30, 2024 Lasertec Corporation announced that they will report Q3, 2024 results on Apr 30, 2024 Duyuru • Nov 25
Lasertec Corporation Releases ACTIS “A300” Series Actinic EUV Patterned Mask Inspection System Lasertec Corporation announced the release of ACTIS A300 series Actinic EUV Patterned Mask Inspection System for High-NA. ACTIS A150 actinic EUV patterned mask inspection system provided by Lasertec has been facilitating the adoption of EUV lithography to high-volume manufacturing. It is renowned for its excellent inspection performance in the industry. The newly released ACTIS A300 is a next-generation model that meets the requirements of manufacturing processes using high-NA EUV lithography to enable the further miniaturization of device geometries. The A300 series uses newly designed optics and high-brightness light source URASHIMA . It achieves a significant improvement in defect detection performance compared to the A150 series. The anamorphic optics used in high-NA lithography have adopted different magnifications of projection in the X and Y directions. Inspection of EUV masks for high-NA lithography, therefore, requires different levels of resolution in the two directions. The A300 series can also be used to inspect EUV masks for the current NA lithography as well as EUV masks for high-NA lithography. Lasertec is dedicated to supporting the needs of leading-edge semiconductor manufacturers, developing unique solutions, and facilitating quality and productivity improvement, thereby contributing to the advancement of the industry. Features: Inspection of EUV masks for high-NA lithography. Inspection of EUV masks for the current NA lithography. High productivity inspection with highly efficient optics and high-brightness light source URASHIMA. Applications: Quality assurance inspection during EUV mask manufacturing processes. Incoming EUV mask inspection and periodic quality assurance inspection at wafer fabs. Duyuru • Nov 01
Lasertec Corporation to Report Q2, 2023 Results on Jan 31, 2023 Lasertec Corporation announced that they will report Q2, 2023 results on Jan 31, 2023 Duyuru • Dec 02
Lasertec Corporation Launches OPTELICS AI2 Automatic Inspection and Review System Lasertec has launched OPTELICS AI2, a new type of confocal microscope designed to perform automatic defect inspection and review. AI2 provides high-speed automatic surface defect inspection, defect mapping, and high-magnification defect shape review from a single platform. There has been a rapid increase in demand for semiconductor devices due to growing need for 5G mobile communication, high-performance computing, and other applications. Semiconductor device manufacturers are expected to keep developing new devices with increased performance. For the development of new devices adopting new designs and new materials, various challenges need to be overcome with cross-organizational efforts. The evaluation of prototypes, quality control during production, and process improvement for higher yields are among those challenges. AI2 performs automatic surface defect inspection, defect review, and defect shape 3D profiling on a single platform, serving customer need in various situations of R&D and production. AI2 achieves both high-throughput, high-speed inspection and high-magnification surface shape profiling by integrating Lasertec's core technology in confocal optics, automatic inspection software perfected through the development of various semiconductor-related inspection systems, and newly designed high-speed motion hardware into a system. AI2 conducts AI-based inspection using deep learning and offers advanced inspection functions such as high-precision image classification, patterned sample inspection, and the extraction of specific types of defects. Lasertec is dedicated to addressing customer need and helping customers succeed in various R&D and yield improvement efforts. Automatic defect inspection, high-magnification review, and surface shape profiling on semiconductor wafer from a single platform, serving customer need in various situations of R&D and production. High-speed inspection capability: inspecting a whole 3-inch wafer in 15 minutes with sub-micron sensitivity.High-magnification review capability: high-magnification surface shape profiling available with switching of objective lens. Deep learning-based high-precision image classification, patterned sample inspection, and inspection of specific types of defects. Defect inspection, high-magnification review, and surface shape profiling of transparent samples, such as compound semiconductors and films, without interference of backside reflection. Lasertec providing a complete system including both hardware and software, making customization for specific need, and offering entire system support. 
