Team Group Dividend
Dividend criteria checks 3/6
Team Group is a dividend paying company with a current yield of 2.11% that is well covered by earnings.
Key information
2.1%
Dividend yield
59%
Payout ratio
Industry average yield | 2.4% |
Next dividend pay date | n/a |
Ex dividend date | n/a |
Dividend per share | n/a |
Earnings per share | NT$3.38 |
Dividend yield forecast in 3Y | n/a |
Recent dividend updates
Recent updates
Team Group's (TWSE:4967) Earnings Are Of Questionable Quality
Mar 25Is Team Group (TPE:4967) A Risky Investment?
Apr 13Will Team Group's (TPE:4967) Growth In ROCE Persist?
Mar 18We're Not Counting On Team Group (TPE:4967) To Sustain Its Statutory Profitability
Feb 19Should You Be Concerned About Team Group Inc.'s (TPE:4967) ROE?
Feb 01Does Team Group (TPE:4967) Have A Healthy Balance Sheet?
Jan 12Did You Participate In Any Of Team Group's (TPE:4967) Incredible 761% Return?
Dec 25Returns On Capital - An Important Metric For Team Group (TPE:4967)
Dec 07We Wouldn't Rely On Team Group's (TPE:4967) Statutory Earnings As A Guide
Nov 19Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 4967's dividend payments have been volatile in the past 10 years.
Growing Dividend: 4967's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
Team Group Dividend Yield vs Market |
---|
Segment | Dividend Yield |
---|---|
Company (4967) | 2.1% |
Market Bottom 25% (TW) | 1.8% |
Market Top 25% (TW) | 4.4% |
Industry Average (Semiconductor) | 2.4% |
Analyst forecast in 3 Years (4967) | n/a |
Notable Dividend: 4967's dividend (2.11%) is higher than the bottom 25% of dividend payers in the TW market (1.78%).
High Dividend: 4967's dividend (2.11%) is low compared to the top 25% of dividend payers in the TW market (4.44%).
Earnings Payout to Shareholders
Earnings Coverage: With its reasonable payout ratio (59.2%), 4967's dividend payments are covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: 4967 is paying a dividend but the company has no free cash flows.