SAMCO Dividend
Dividend criteria checks 1/6
SAMCO is a dividend paying company with a current yield of 1%. Next payment date is on 25th October, 2024 with an ex-dividend date of 30th July, 2024.
Key information
1.0%
Dividend yield
n/a
Payout ratio
| Industry average yield | 1.0% |
| Next dividend pay date | 25 Oct 24 |
| Ex dividend date | 30 Jul 24 |
| Dividend per share | n/a |
| Earnings per share | JP¥175.89 |
| Dividend yield forecast in 3Y | 1.2% |
Recent dividend updates
Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: Too early to tell whether 6387's dividend payments have been stable as they only just started paying a dividend.
Growing Dividend: Too early to tell if 6387's dividend payments are increasing as they only just started paying a dividend.
Dividend Yield vs Market
| SAMCO Dividend Yield vs Market |
|---|
| Segment | Dividend Yield |
|---|---|
| Company (6387) | 1.0% |
| Market Bottom 25% (JP) | 1.6% |
| Market Top 25% (JP) | 3.2% |
| Industry Average (Semiconductor) | 1.0% |
| Analyst forecast in 3 Years (6387) | 1.2% |
Notable Dividend: 6387's dividend (1%) isn’t notable compared to the bottom 25% of dividend payers in the JP market (1.59%).
High Dividend: 6387's dividend (1%) is low compared to the top 25% of dividend payers in the JP market (3.2%).
Earnings Payout to Shareholders
Earnings Coverage: Insufficient data to calculate 6387's payout ratio to determine if its dividend payments are covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its low cash payout ratio (22.5%), 6387's dividend payments are well covered by cash flows.