Fujibo Holdings Dividends and Buybacks
Dividend criteria checks 5/6
Fujibo Holdings is a dividend paying company with a current yield of 2.2% that is well covered by earnings. Next payment date is on 6th December, 2024 with an ex-dividend date of 27th September, 2024.
Key information
2.2%
Dividend yield
0.8%
Buyback Yield
Total Shareholder Yield | 3.0% |
Future Dividend Yield | 2.2% |
Dividend Growth | 2.0% |
Next dividend pay date | 06 Dec 24 |
Ex dividend date | 27 Sep 24 |
Dividend per share | JP¥120.000 |
Payout ratio | 19% |
Recent dividend and buyback updates
Fujibo Holdings (TSE:3104) Is Due To Pay A Dividend Of ¥55.00
Mar 25Fujibo Holdings (TSE:3104) Has Affirmed Its Dividend Of ¥55.00
Feb 26Recent updates
Are Investors Undervaluing Fujibo Holdings, Inc. (TSE:3104) By 45%?
Jul 31Fujibo Holdings, Inc. (TSE:3104) Stocks Shoot Up 26% But Its P/E Still Looks Reasonable
Jun 10Fujibo Holdings (TSE:3104) Is Due To Pay A Dividend Of ¥55.00
Mar 25Fujibo Holdings (TSE:3104) Has Affirmed Its Dividend Of ¥55.00
Feb 26Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 3104's dividends per share have been stable in the past 10 years.
Growing Dividend: 3104's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
Fujibo Holdings Dividend Yield vs Market |
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Segment | Dividend Yield |
---|---|
Company (3104) | 2.2% |
Market Bottom 25% (JP) | 1.8% |
Market Top 25% (JP) | 3.8% |
Industry Average (Luxury) | 1.6% |
Analyst forecast (3104) (up to 3 years) | 2.2% |
Notable Dividend: 3104's dividend (2.2%) is higher than the bottom 25% of dividend payers in the JP market (1.81%).
High Dividend: 3104's dividend (2.2%) is low compared to the top 25% of dividend payers in the JP market (3.78%).
Earnings Payout to Shareholders
Earnings Coverage: With its low payout ratio (18.9%), 3104's dividend payments are well covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its reasonably low cash payout ratio (33.2%), 3104's dividend payments are well covered by cash flows.