Forum Engineering Dividends and Buybacks
Dividend criteria checks 4/6
Forum Engineering is a dividend paying company with a current yield of 4.38% that is well covered by earnings. Next payment date is on 6th December, 2024 with an ex-dividend date of 27th September, 2024.
Key information
4.4%
Dividend yield
-0.4%
Buyback Yield
| Total Shareholder Yield | 4.0% |
| Future Dividend Yield | 6.7% |
| Dividend Growth | 1.5% |
| Next dividend pay date | 06 Dec 24 |
| Ex dividend date | 27 Sep 24 |
| Dividend per share | JP¥42.500 |
| Payout ratio | 76% |
Recent dividend and buyback updates
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: Too early to tell whether 7088's dividend payments have been stable as they only just started paying a dividend.
Growing Dividend: Too early to tell if 7088's dividend payments are increasing as they only just started paying a dividend.
Dividend Yield vs Market
| Forum Engineering Dividend Yield vs Market |
|---|
| Segment | Dividend Yield |
|---|---|
| Company (7088) | 4.4% |
| Market Bottom 25% (JP) | 1.8% |
| Market Top 25% (JP) | 3.8% |
| Industry Average (Professional Services) | 0.9% |
| Analyst forecast (7088) (up to 3 years) | 6.7% |
Notable Dividend: 7088's dividend (4.38%) is higher than the bottom 25% of dividend payers in the JP market (1.83%).
High Dividend: 7088's dividend (4.38%) is in the top 25% of dividend payers in the JP market (3.79%)
Earnings Payout to Shareholders
Earnings Coverage: At its current payout ratio (76.3%), 7088's payments are covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its reasonable cash payout ratio (65.8%), 7088's dividend payments are covered by cash flows.