Forum Engineering Dividend
Dividend criteria checks 3/6
Forum Engineering is a dividend paying company with a current yield of 3.82%.
Key information
3.8%
Dividend yield
n/a
Payout ratio
Industry average yield | 1.0% |
Next dividend pay date | n/a |
Ex dividend date | n/a |
Dividend per share | n/a |
Earnings per share | JP¥38.74 |
Dividend yield forecast in 3Y | 5.9% |
Recent dividend updates
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: Too early to tell whether 7088's dividend payments have been stable as they only just started paying a dividend.
Growing Dividend: Too early to tell if 7088's dividend payments are increasing as they only just started paying a dividend.
Dividend Yield vs Market
Forum Engineering Dividend Yield vs Market |
---|
Segment | Dividend Yield |
---|---|
Company (7088) | 3.8% |
Market Bottom 25% (JP) | 1.7% |
Market Top 25% (JP) | 3.4% |
Industry Average (Professional Services) | 1.0% |
Analyst forecast in 3 Years (7088) | 5.9% |
Notable Dividend: 7088's dividend (3.82%) is higher than the bottom 25% of dividend payers in the JP market (1.67%).
High Dividend: 7088's dividend (3.82%) is in the top 25% of dividend payers in the JP market (3.37%)
Earnings Payout to Shareholders
Earnings Coverage: Insufficient data to calculate 7088's payout ratio to determine if its dividend payments are covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its reasonable cash payout ratio (55.4%), 7088's dividend payments are covered by cash flows.