Forum Engineering Dividends and Buybacks

Dividend criteria checks 4/6

Forum Engineering is a dividend paying company with a current yield of 5.52% that is well covered by earnings. Next payment date is on 26th June, 2025 with an ex-dividend date of 28th March, 2025.

Key information

5.5%

Dividend yield

-0.4%

Buyback Yield

Total Shareholder Yield5.1%
Future Dividend Yield6.5%
Dividend Growth23.6%
Next dividend pay date26 Jun 25
Ex dividend date28 Mar 25
Dividend per shareJP¥58.000
Payout ratio76%

Recent dividend and buyback updates

Recent updates

We Think Forum Engineering's (TSE:7088) Healthy Earnings Might Be Conservative

Nov 20
We Think Forum Engineering's (TSE:7088) Healthy Earnings Might Be Conservative

We Like The Quality Of Forum Engineering's (TSE:7088) Earnings

May 21
We Like The Quality Of Forum Engineering's (TSE:7088) Earnings

Upcoming Dividend Payment

TodayDec 27 2024Ex Dividend DateMar 28 2025Dividend Pay DateJun 26 202590 days from Ex DividendBuy in the next 91 days to receive the upcoming dividend

Stability and Growth of Payments

Fetching dividends data

Stable Dividend: Too early to tell whether 7088's dividend payments have been stable as they only just started paying a dividend.

Growing Dividend: Too early to tell if 7088's dividend payments are increasing as they only just started paying a dividend.


Dividend Yield vs Market

Forum Engineering Dividend Yield vs Market
How does 7088 dividend yield compare to the market?
SegmentDividend Yield
Company (7088)5.5%
Market Bottom 25% (JP)1.8%
Market Top 25% (JP)3.8%
Industry Average (Professional Services)0.8%
Analyst forecast (7088) (up to 3 years)6.5%

Notable Dividend: 7088's dividend (5.52%) is higher than the bottom 25% of dividend payers in the JP market (1.83%).

High Dividend: 7088's dividend (5.52%) is in the top 25% of dividend payers in the JP market (3.8%)


Earnings Payout to Shareholders

Earnings Coverage: At its current payout ratio (76.3%), 7088's payments are covered by earnings.


Cash Payout to Shareholders

Cash Flow Coverage: At its current cash payout ratio (90%), 7088's dividend payments are covered by cash flows.


Discover strong dividend paying companies

Company Analysis and Financial Data Status

DataLast Updated (UTC time)
Company Analysis2024/12/27 08:24
End of Day Share Price 2024/12/27 00:00
Earnings2024/09/30
Annual Earnings2024/03/31

Data Sources

The data used in our company analysis is from S&P Global Market Intelligence LLC. The following data is used in our analysis model to generate this report. Data is normalised which can introduce a delay from the source being available.

PackageDataTimeframeExample US Source *
Company Financials10 years
  • Income statement
  • Cash flow statement
  • Balance sheet
Analyst Consensus Estimates+3 years
  • Forecast financials
  • Analyst price targets
Market Prices30 years
  • Stock prices
  • Dividends, Splits and Actions
Ownership10 years
  • Top shareholders
  • Insider trading
Management10 years
  • Leadership team
  • Board of directors
Key Developments10 years
  • Company announcements

* example for US securities, for non-US equivalent regulatory forms and sources are used.

Unless specified all financial data is based on a yearly period but updated quarterly. This is known as Trailing Twelve Month (TTM) or Last Twelve Month (LTM) Data. Learn more here.

Analysis Model and Snowflake

Details of the analysis model used to generate this report is available on our Github page, we also have guides on how to use our reports and tutorials on Youtube.

Learn about the world class team who designed and built the Simply Wall St analysis model.

Industry and Sector Metrics

Our industry and section metrics are calculated every 6 hours by Simply Wall St, details of our process are available on .

Analyst Sources

Forum Engineering Inc. is covered by 1 analysts. 1 of those analysts submitted the estimates of revenue or earnings used as inputs to our report. Analysts submissions are updated throughout the day.

AnalystInstitution
Hiroshi NayaIchiyoshi Research Institute Inc.