TSE:6857Semiconductor
Is Advantest (TSE:6857) Using AI Thermal Testing To Deepen Its Chip Ecosystem Moat?
Earlier this week, Advantest Corporation and Tokyo Seimitsu Co., Ltd. announced a plan to co-develop a die-level prober for testing advanced AI and high-performance computing devices that use complex 2.5D/3D packaging and generate significant heat during operation.
This collaboration targets one of the toughest bottlenecks in next-generation chip production, precise thermal control during testing, which could make Advantest’s ecosystem more relevant across the AI and HPC value chain.
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