View Financial HealthLasertec 배당 및 자사주 매입배당 기준 점검 4/6Lasertec 수익으로 충분히 충당되는 현재 수익률 0.84% 보유한 배당금 지급 회사입니다.핵심 정보0.8%배당 수익률0.3%자사주 매입 수익률총 주주 수익률1.2%미래 배당 수익률1.2%배당 성장률30.4%다음 배당 지급일n/a배당락일n/a주당 배당금n/a배당 성향35%최근 배당 및 자사주 매입 업데이트공시 • Jul 25+ 2 more updatesLasertec Corporation Provides Dividend Forecast for the Fiscal Year Ended June 2023Lasertec Corporation provided dividend forecast for the fiscal year ended June 2023. The company revised forecast of year-end dividend to JPY 126 per share against previous guidance of JPY 77 per share.공시 • Aug 06+ 3 more updatesLasertec Corporation Provides Dividend Guidance for the Second Quarter and Year End of the Fiscal Year Ending June 30, 2023Lasertec Corporation provided dividend guidance for the second quarter and year end of the fiscal year ending June 30, 2023. For the quarter, the company expected dividend of JPY 52.00 per share.For the year, the company expected dividend of JPY 77.00 per share.공시 • Feb 01+ 2 more updatesLasertec Corporation Provides Year-End Dividend Guidance for the Fiscal Year Ending June 30, 2022Lasertec Corporation provided year-end dividend guidance for the fiscal year ending June 30, 2022. For the year, the company expects to pay year-end dividend of JPY 50.00 per share against JPY 55.00 per share paid for the same period a year ago.모든 업데이트 보기Recent updates공시 • Mar 13Lasertec Corporation to Report Q3, 2026 Results on Apr 30, 2026Lasertec Corporation announced that they will report Q3, 2026 results on Apr 30, 2026공시 • Jan 30+ 1 more updateLasertec Corporation Revises Consolidated Earnings Guidance for the Fiscal Year Ending June 30, 2026Lasertec Corporation revised consolidated earnings guidance for the fiscal year ending June 30, 2026. For the year, the company now expects net sales of JPY 220,000 million against previous guidance of JPY 200,000 million; operating income of JPY 100,000 million against previous guidance of JPY 85,000 million; Net income attributable to owners of parents of JPY 72,000 million against previous guidance of JPY 60,000 million and net income per share of JPY 801.89 against previous guidance of JPY 665.27. Reason for the revision: The company has revised the full-year forecast for the fiscal year ending June 30, 2026, considering customer acceptance of some products occurring earlier than expected and the trend of foreign exchange fluctuations. The assumed exchange rate for the forecast has been revised to 145 yen/USD (the previous assumption was 135 yen/USD).공시 • Dec 12Lasertec Corporation to Report Q2, 2026 Results on Jan 30, 2026Lasertec Corporation announced that they will report Q2, 2026 results on Jan 30, 2026공시 • Nov 01Lasertec Corporation Provides Consolidated Earnings Guidance for the Year Ending June 30, 2026Lasertec Corporation provided consolidated earnings guidance for the year ending June 30, 2026. For the year, the company expects net sales of JPY 200,000 million; operating income of JPY 85,000 million; Net income attributable to owners of parents of 60,000 million and net income per share of JPY 665.75.공시 • Aug 07+ 1 more updateLasertec Corporation, Annual General Meeting, Sep 26, 2025Lasertec Corporation, Annual General Meeting, Sep 26, 2025.공시 • Mar 26Lasertec Corporation Appoints Hiroki Miyai as Executive Officer, Effective April 1, 2025Lasertec Corporation announced the appointment of Hiroki Miyai as Executive Officer concurrently, General Manager, Technology Department 5, previously he was General Manager,Technology Department 5, Effective April 1, 2025.공시 • Mar 15+ 2 more updatesLasertec Corporation to Report Q3, 2025 Results on Apr 28, 2025Lasertec Corporation announced that they will report Q3, 2025 results on Apr 28, 2025공시 • Jan 03Lasertec Corporation to Report Q2, 2025 Results on Jan 31, 2025Lasertec Corporation announced that they will report Q2, 2025 results on Jan 31, 2025공시 • Sep 24Lasertec Releases SICA108, SiC Wafer Inspection and Review SystemLasertec Corporation announced the release of SICA108, the latest model of its SiC wafer inspection and review systems. Featuring both surface and photoluminescence (PL) inspection capabilities in one body, SICA108 enables customers to concurrently perform high-speed inspection and high-accuracy classification of surface defects as well as crystallographic defects. SiC power devices are used in a variety of applications, including electric vehicles, air conditioners, solar cells, and railway cars, and facilitate the realization of a carbon-neutral society. However, SiC wafer production processes are technically demanding, and there are still many defects that impact device yields. It therefore remains a challenge to manufacture high-quality SiC wafers stably at a lower cost. Lasertec has released SICA108 to help overcome this challenge. Renewing the inspection optics from SICA88, the current de facto standard tool widely used among many customers, SICA108 provides higher throughput and improved performance in quality analysis of SiC wafers with a lower cost of ownership. Like its predecessor, SICA108 performs surface inspection for detecting scratches, crystal defects, and particles on the wafer surface and PL inspection for detecting basal plane dislocations (BPD) inside Epi layers and stacking faults (SF), concurrently and with high sensitivity. It also features a high-accuracy defect classification capability based on proprietary deep learning algorithm to enable the early detection and analysis of killer defects. It is also compatible with various automation systems used in smart fabs, such as automatic guided vehicles (AGV) and overhead hoist transports (OHT). Lasertec will continue to pursue the development of defect inspection technologies to address customer needs and contribute to the improvement of power device quality and productivity. Features: Concurrent inspection of surface defects and BPD/SF at high speed and with high sensitivity. Detailed classification of various defect types using high-accuracy Automatic Defect Classification (ADC) and high-resolution review images. Compatible with various automation systems, including AGV and OHT. Applications: Incoming and outgoing inspection of SiC bare wafers and SiC Epi wafers. Monitoring of SiC epitaxial growth processes. Monitoring of SiC polishing processes. Management of SiC device manufacturing processes.공시 • May 03Lasertec Corporation Announces Chief Executive Officer Changes, as of July 1, 2024Lasertec Corporation announced that it has resolved at the board of directors meeting held on April 30, 2024 to make changes in its representative directors and executive officers as follows (as of July 1, 2024): Osamu Okabayashi: Previous position: Representative Director, President & Chief Executive Officer; New position: Representative Director, Chairman & Executive Officer. Tetsuya Sendoda: Previous position: Director, Vice President & Executive Officer concurrently, Chief Sales Officer; New position: Chief Executive Officer. Resume of New Representative Director: Tetsuya Sendoda (April 26, 1977); Career Summary: Jan. 2008, Joined Lasertec Corporation; June 2020, General Manager, Technology Department 2; July 2022, Sales Officer; General Manager, Technology Department 2; and General Manager, Solution Sales Department 1; Sept. 2022 Executive Officer; Sales Officer; General Manager, Technology Department 2; and General Manager, Solution Sales Department 1; April 2023 Executive Officer; Sales Officer; and General Manager, Solution Sales Department 1; Sept. 2023 Director, Vice President & Executive Officer (current); and Chief Sales Officer (current).공시 • Mar 08+ 2 more updatesLasertec Corporation to Report Q1, 2025 Results on Oct 31, 2024Lasertec Corporation announced that they will report Q1, 2025 results on Oct 31, 2024공시 • Feb 11Lasertec Corporation to Report Q3, 2024 Results on Apr 30, 2024Lasertec Corporation announced that they will report Q3, 2024 results on Apr 30, 2024공시 • Feb 01+ 2 more updatesLasertec Corporation Provides Consolidated Earnings Guidance for the Fiscal Year Ending June 30, 2024Lasertec Corporation provided consolidated earnings guidance for the fiscal year ending June 30, 2024. For the year, the company expects net sales of JPY 195,000 million, operating income of JPY 67,000 million, net income attributable to owners of parent of JPY 67,000 million and net income per share of JPY 543.32.공시 • Nov 25Lasertec Corporation Releases ACTIS “A300” Series Actinic EUV Patterned Mask Inspection SystemLasertec Corporation announced the release of ACTIS A300 series Actinic EUV Patterned Mask Inspection System for High-NA. ACTIS A150 actinic EUV patterned mask inspection system provided by Lasertec has been facilitating the adoption of EUV lithography to high-volume manufacturing. It is renowned for its excellent inspection performance in the industry. The newly released ACTIS A300 is a next-generation model that meets the requirements of manufacturing processes using high-NA EUV lithography to enable the further miniaturization of device geometries. The A300 series uses newly designed optics and high-brightness light source URASHIMA . It achieves a significant improvement in defect detection performance compared to the A150 series. The anamorphic optics used in high-NA lithography have adopted different magnifications of projection in the X and Y directions. Inspection of EUV masks for high-NA lithography, therefore, requires different levels of resolution in the two directions. The A300 series can also be used to inspect EUV masks for the current NA lithography as well as EUV masks for high-NA lithography. Lasertec is dedicated to supporting the needs of leading-edge semiconductor manufacturers, developing unique solutions, and facilitating quality and productivity improvement, thereby contributing to the advancement of the industry. Features: Inspection of EUV masks for high-NA lithography. Inspection of EUV masks for the current NA lithography. High productivity inspection with highly efficient optics and high-brightness light source URASHIMA. Applications: Quality assurance inspection during EUV mask manufacturing processes. Incoming EUV mask inspection and periodic quality assurance inspection at wafer fabs.공시 • Nov 01+ 1 more updateLasertec Corporation to Report Q2, 2024 Results on Jan 31, 2024Lasertec Corporation announced that they will report Q2, 2024 results on Jan 31, 2024공시 • Aug 08+ 1 more updateLasertec Corporation to Report Q1, 2024 Results on Oct 31, 2023Lasertec Corporation announced that they will report Q1, 2024 results on Oct 31, 2023공시 • Jul 25+ 2 more updatesLasertec Corporation Provides Dividend Forecast for the Fiscal Year Ended June 2023Lasertec Corporation provided dividend forecast for the fiscal year ended June 2023. The company revised forecast of year-end dividend to JPY 126 per share against previous guidance of JPY 77 per share.공시 • Feb 01+ 3 more updatesLasertec Corporation to Report Fiscal Year 2023 Results on Aug 07, 2023Lasertec Corporation announced that they will report fiscal year 2023 results on Aug 07, 2023공시 • Nov 01Lasertec Corporation to Report Q2, 2023 Results on Jan 31, 2023Lasertec Corporation announced that they will report Q2, 2023 results on Jan 31, 2023공시 • Aug 06+ 3 more updatesLasertec Corporation Provides Dividend Guidance for the Second Quarter and Year End of the Fiscal Year Ending June 30, 2023Lasertec Corporation provided dividend guidance for the second quarter and year end of the fiscal year ending June 30, 2023. For the quarter, the company expected dividend of JPY 52.00 per share.For the year, the company expected dividend of JPY 77.00 per share.공시 • Feb 02+ 1 more updateLasertec Corporation to Report Q3, 2022 Results on Apr 28, 2022Lasertec Corporation announced that they will report Q3, 2022 results on Apr 28, 2022공시 • Feb 01+ 2 more updatesLasertec Corporation Provides Year-End Dividend Guidance for the Fiscal Year Ending June 30, 2022Lasertec Corporation provided year-end dividend guidance for the fiscal year ending June 30, 2022. For the year, the company expects to pay year-end dividend of JPY 50.00 per share against JPY 55.00 per share paid for the same period a year ago.공시 • Dec 02Lasertec Corporation Launches OPTELICS AI2 Automatic Inspection and Review SystemLasertec has launched OPTELICS AI2, a new type of confocal microscope designed to perform automatic defect inspection and review. AI2 provides high-speed automatic surface defect inspection, defect mapping, and high-magnification defect shape review from a single platform. There has been a rapid increase in demand for semiconductor devices due to growing need for 5G mobile communication, high-performance computing, and other applications. Semiconductor device manufacturers are expected to keep developing new devices with increased performance. For the development of new devices adopting new designs and new materials, various challenges need to be overcome with cross-organizational efforts. The evaluation of prototypes, quality control during production, and process improvement for higher yields are among those challenges. AI2 performs automatic surface defect inspection, defect review, and defect shape 3D profiling on a single platform, serving customer need in various situations of R&D and production. AI2 achieves both high-throughput, high-speed inspection and high-magnification surface shape profiling by integrating Lasertec's core technology in confocal optics, automatic inspection software perfected through the development of various semiconductor-related inspection systems, and newly designed high-speed motion hardware into a system. AI2 conducts AI-based inspection using deep learning and offers advanced inspection functions such as high-precision image classification, patterned sample inspection, and the extraction of specific types of defects. Lasertec is dedicated to addressing customer need and helping customers succeed in various R&D and yield improvement efforts. Automatic defect inspection, high-magnification review, and surface shape profiling on semiconductor wafer from a single platform, serving customer need in various situations of R&D and production. High-speed inspection capability: inspecting a whole 3-inch wafer in 15 minutes with sub-micron sensitivity.High-magnification review capability: high-magnification surface shape profiling available with switching of objective lens. Deep learning-based high-precision image classification, patterned sample inspection, and inspection of specific types of defects. Defect inspection, high-magnification review, and surface shape profiling of transparent samples, such as compound semiconductors and films, without interference of backside reflection. Lasertec providing a complete system including both hardware and software, making customization for specific need, and offering entire system support.지급의 안정성과 성장배당 데이터 가져오는 중안정적인 배당: LSRC.F 의 주당 배당금은 지난 10 년 동안 안정적이었습니다.배당금 증가: LSRC.F 의 배당금 지급은 지난 10 년 동안 증가했습니다.배당 수익률 vs 시장Lasertec 배당 수익률 vs 시장LSRC.F의 배당 수익률은 시장과 어떻게 비교되나요?구분배당 수익률회사 (LSRC.F)0.8%시장 하위 25% (US)1.4%시장 상위 25% (US)4.2%업계 평균 (Semiconductor)0.6%분석가 예측 (LSRC.F) (최대 3년)1.2%주목할만한 배당금: LSRC.F 의 배당금( 0.84% )은 US 시장에서 배당금 지급자의 하위 25%( 1.42% )와 비교해 주목할 만하지 않습니다.고배당: LSRC.F 의 배당금( 0.84% )은 US 시장에서 배당금 지급자의 상위 25%( 4.25% )와 비교해 낮습니다.주주 대상 이익 배당수익 보장: 합리적으로 낮은 지불 비율 ( 35% )로 LSRC.F 의 배당금 지급은 수익으로 충분히 충당됩니다.주주 현금 배당현금 흐름 범위: 합리적으로 낮은 현금 지급 비율 ( 42.9% )로 LSRC.F 의 배당금 지급은 현금 흐름으로 잘 충당됩니다.높은 배당을 제공하는 우량 기업 찾기7D1Y7D1Y7D1YUS 시장에서 배당이 강한 기업.View Management기업 분석 및 재무 데이터 상태데이터최종 업데이트 (UTC 시간)기업 분석2026/06/08 08:04종가2026/06/02 00:00수익2026/03/31연간 수익2025/06/30데이터 소스당사의 기업 분석에 사용되는 데이터는 S&P Global Market Intelligence LLC에서 제공됩니다. 아래 데이터는 이 보고서를 생성하기 위해 분석 모델에서 사용됩니다. 데이터는 정규화되므로 소스가 제공된 후 지연이 발생할 수 있습니다.패키지데이터기간미국 소스 예시 *기업 재무제표10년손익계산서현금흐름표대차대조표SEC 양식 10-KSEC 양식 10-Q분석가 컨센서스 추정치+3년재무 예측분석가 목표주가분석가 리서치 보고서Blue Matrix시장 가격30년주가배당, 분할 및 기타 조치ICE 시장 데이터SEC 양식 S-1지분 구조10년주요 주주내부자 거래SEC 양식 4SEC 양식 13D경영진10년리더십 팀이사회SEC 양식 10-KSEC 양식 DEF 14A주요 개발10년회사 공시SEC 양식 8-K* 미국 증권에 대한 예시이며, 비(非)미국 증권에는 해당 국가의 규제 서식 및 자료원을 사용합니다.별도로 명시되지 않는 한 모든 재무 데이터는 연간 기간을 기준으로 하지만 분기별로 업데이트됩니다. 이를 TTM(최근 12개월) 또는 LTM(지난 12개월) 데이터라고 합니다. 자세히 알아보기.분석 모델 및 스노우플레이크이 보고서를 생성하는 데 사용된 분석 모델에 대한 자세한 내용은 당사의 Github 페이지에서 확인하실 수 있습니다. 또한 보고서 활용 방법에 대한 가이드와 YouTube 튜토리얼도 제공합니다.Simply Wall St 분석 모델을 설계하고 구축한 세계적 수준의 팀에 대해 알아보세요.산업 및 섹터 지표산업 및 섹터 지표는 Simply Wall St가 6시간마다 계산하며, 프로세스에 대한 자세한 내용은 Github에서 확인할 수 있습니다.분석가 소스Lasertec Corporation는 29명의 분석가가 다루고 있습니다. 이 중 14명의 분석가가 우리 보고서에 입력 데이터로 사용되는 매출 또는 수익 추정치를 제출했습니다. 분석가의 제출 자료는 하루 종일 업데이트됩니다.분석가기관Warren LauAletheia Analyst Network LimitedStacy RasgonBernsteinHao DaiBernstein26명의 분석가 더 보기
공시 • Jul 25+ 2 more updatesLasertec Corporation Provides Dividend Forecast for the Fiscal Year Ended June 2023Lasertec Corporation provided dividend forecast for the fiscal year ended June 2023. The company revised forecast of year-end dividend to JPY 126 per share against previous guidance of JPY 77 per share.
공시 • Aug 06+ 3 more updatesLasertec Corporation Provides Dividend Guidance for the Second Quarter and Year End of the Fiscal Year Ending June 30, 2023Lasertec Corporation provided dividend guidance for the second quarter and year end of the fiscal year ending June 30, 2023. For the quarter, the company expected dividend of JPY 52.00 per share.For the year, the company expected dividend of JPY 77.00 per share.
공시 • Feb 01+ 2 more updatesLasertec Corporation Provides Year-End Dividend Guidance for the Fiscal Year Ending June 30, 2022Lasertec Corporation provided year-end dividend guidance for the fiscal year ending June 30, 2022. For the year, the company expects to pay year-end dividend of JPY 50.00 per share against JPY 55.00 per share paid for the same period a year ago.
공시 • Mar 13Lasertec Corporation to Report Q3, 2026 Results on Apr 30, 2026Lasertec Corporation announced that they will report Q3, 2026 results on Apr 30, 2026
공시 • Jan 30+ 1 more updateLasertec Corporation Revises Consolidated Earnings Guidance for the Fiscal Year Ending June 30, 2026Lasertec Corporation revised consolidated earnings guidance for the fiscal year ending June 30, 2026. For the year, the company now expects net sales of JPY 220,000 million against previous guidance of JPY 200,000 million; operating income of JPY 100,000 million against previous guidance of JPY 85,000 million; Net income attributable to owners of parents of JPY 72,000 million against previous guidance of JPY 60,000 million and net income per share of JPY 801.89 against previous guidance of JPY 665.27. Reason for the revision: The company has revised the full-year forecast for the fiscal year ending June 30, 2026, considering customer acceptance of some products occurring earlier than expected and the trend of foreign exchange fluctuations. The assumed exchange rate for the forecast has been revised to 145 yen/USD (the previous assumption was 135 yen/USD).
공시 • Dec 12Lasertec Corporation to Report Q2, 2026 Results on Jan 30, 2026Lasertec Corporation announced that they will report Q2, 2026 results on Jan 30, 2026
공시 • Nov 01Lasertec Corporation Provides Consolidated Earnings Guidance for the Year Ending June 30, 2026Lasertec Corporation provided consolidated earnings guidance for the year ending June 30, 2026. For the year, the company expects net sales of JPY 200,000 million; operating income of JPY 85,000 million; Net income attributable to owners of parents of 60,000 million and net income per share of JPY 665.75.
공시 • Aug 07+ 1 more updateLasertec Corporation, Annual General Meeting, Sep 26, 2025Lasertec Corporation, Annual General Meeting, Sep 26, 2025.
공시 • Mar 26Lasertec Corporation Appoints Hiroki Miyai as Executive Officer, Effective April 1, 2025Lasertec Corporation announced the appointment of Hiroki Miyai as Executive Officer concurrently, General Manager, Technology Department 5, previously he was General Manager,Technology Department 5, Effective April 1, 2025.
공시 • Mar 15+ 2 more updatesLasertec Corporation to Report Q3, 2025 Results on Apr 28, 2025Lasertec Corporation announced that they will report Q3, 2025 results on Apr 28, 2025
공시 • Jan 03Lasertec Corporation to Report Q2, 2025 Results on Jan 31, 2025Lasertec Corporation announced that they will report Q2, 2025 results on Jan 31, 2025
공시 • Sep 24Lasertec Releases SICA108, SiC Wafer Inspection and Review SystemLasertec Corporation announced the release of SICA108, the latest model of its SiC wafer inspection and review systems. Featuring both surface and photoluminescence (PL) inspection capabilities in one body, SICA108 enables customers to concurrently perform high-speed inspection and high-accuracy classification of surface defects as well as crystallographic defects. SiC power devices are used in a variety of applications, including electric vehicles, air conditioners, solar cells, and railway cars, and facilitate the realization of a carbon-neutral society. However, SiC wafer production processes are technically demanding, and there are still many defects that impact device yields. It therefore remains a challenge to manufacture high-quality SiC wafers stably at a lower cost. Lasertec has released SICA108 to help overcome this challenge. Renewing the inspection optics from SICA88, the current de facto standard tool widely used among many customers, SICA108 provides higher throughput and improved performance in quality analysis of SiC wafers with a lower cost of ownership. Like its predecessor, SICA108 performs surface inspection for detecting scratches, crystal defects, and particles on the wafer surface and PL inspection for detecting basal plane dislocations (BPD) inside Epi layers and stacking faults (SF), concurrently and with high sensitivity. It also features a high-accuracy defect classification capability based on proprietary deep learning algorithm to enable the early detection and analysis of killer defects. It is also compatible with various automation systems used in smart fabs, such as automatic guided vehicles (AGV) and overhead hoist transports (OHT). Lasertec will continue to pursue the development of defect inspection technologies to address customer needs and contribute to the improvement of power device quality and productivity. Features: Concurrent inspection of surface defects and BPD/SF at high speed and with high sensitivity. Detailed classification of various defect types using high-accuracy Automatic Defect Classification (ADC) and high-resolution review images. Compatible with various automation systems, including AGV and OHT. Applications: Incoming and outgoing inspection of SiC bare wafers and SiC Epi wafers. Monitoring of SiC epitaxial growth processes. Monitoring of SiC polishing processes. Management of SiC device manufacturing processes.
공시 • May 03Lasertec Corporation Announces Chief Executive Officer Changes, as of July 1, 2024Lasertec Corporation announced that it has resolved at the board of directors meeting held on April 30, 2024 to make changes in its representative directors and executive officers as follows (as of July 1, 2024): Osamu Okabayashi: Previous position: Representative Director, President & Chief Executive Officer; New position: Representative Director, Chairman & Executive Officer. Tetsuya Sendoda: Previous position: Director, Vice President & Executive Officer concurrently, Chief Sales Officer; New position: Chief Executive Officer. Resume of New Representative Director: Tetsuya Sendoda (April 26, 1977); Career Summary: Jan. 2008, Joined Lasertec Corporation; June 2020, General Manager, Technology Department 2; July 2022, Sales Officer; General Manager, Technology Department 2; and General Manager, Solution Sales Department 1; Sept. 2022 Executive Officer; Sales Officer; General Manager, Technology Department 2; and General Manager, Solution Sales Department 1; April 2023 Executive Officer; Sales Officer; and General Manager, Solution Sales Department 1; Sept. 2023 Director, Vice President & Executive Officer (current); and Chief Sales Officer (current).
공시 • Mar 08+ 2 more updatesLasertec Corporation to Report Q1, 2025 Results on Oct 31, 2024Lasertec Corporation announced that they will report Q1, 2025 results on Oct 31, 2024
공시 • Feb 11Lasertec Corporation to Report Q3, 2024 Results on Apr 30, 2024Lasertec Corporation announced that they will report Q3, 2024 results on Apr 30, 2024
공시 • Feb 01+ 2 more updatesLasertec Corporation Provides Consolidated Earnings Guidance for the Fiscal Year Ending June 30, 2024Lasertec Corporation provided consolidated earnings guidance for the fiscal year ending June 30, 2024. For the year, the company expects net sales of JPY 195,000 million, operating income of JPY 67,000 million, net income attributable to owners of parent of JPY 67,000 million and net income per share of JPY 543.32.
공시 • Nov 25Lasertec Corporation Releases ACTIS “A300” Series Actinic EUV Patterned Mask Inspection SystemLasertec Corporation announced the release of ACTIS A300 series Actinic EUV Patterned Mask Inspection System for High-NA. ACTIS A150 actinic EUV patterned mask inspection system provided by Lasertec has been facilitating the adoption of EUV lithography to high-volume manufacturing. It is renowned for its excellent inspection performance in the industry. The newly released ACTIS A300 is a next-generation model that meets the requirements of manufacturing processes using high-NA EUV lithography to enable the further miniaturization of device geometries. The A300 series uses newly designed optics and high-brightness light source URASHIMA . It achieves a significant improvement in defect detection performance compared to the A150 series. The anamorphic optics used in high-NA lithography have adopted different magnifications of projection in the X and Y directions. Inspection of EUV masks for high-NA lithography, therefore, requires different levels of resolution in the two directions. The A300 series can also be used to inspect EUV masks for the current NA lithography as well as EUV masks for high-NA lithography. Lasertec is dedicated to supporting the needs of leading-edge semiconductor manufacturers, developing unique solutions, and facilitating quality and productivity improvement, thereby contributing to the advancement of the industry. Features: Inspection of EUV masks for high-NA lithography. Inspection of EUV masks for the current NA lithography. High productivity inspection with highly efficient optics and high-brightness light source URASHIMA. Applications: Quality assurance inspection during EUV mask manufacturing processes. Incoming EUV mask inspection and periodic quality assurance inspection at wafer fabs.
공시 • Nov 01+ 1 more updateLasertec Corporation to Report Q2, 2024 Results on Jan 31, 2024Lasertec Corporation announced that they will report Q2, 2024 results on Jan 31, 2024
공시 • Aug 08+ 1 more updateLasertec Corporation to Report Q1, 2024 Results on Oct 31, 2023Lasertec Corporation announced that they will report Q1, 2024 results on Oct 31, 2023
공시 • Jul 25+ 2 more updatesLasertec Corporation Provides Dividend Forecast for the Fiscal Year Ended June 2023Lasertec Corporation provided dividend forecast for the fiscal year ended June 2023. The company revised forecast of year-end dividend to JPY 126 per share against previous guidance of JPY 77 per share.
공시 • Feb 01+ 3 more updatesLasertec Corporation to Report Fiscal Year 2023 Results on Aug 07, 2023Lasertec Corporation announced that they will report fiscal year 2023 results on Aug 07, 2023
공시 • Nov 01Lasertec Corporation to Report Q2, 2023 Results on Jan 31, 2023Lasertec Corporation announced that they will report Q2, 2023 results on Jan 31, 2023
공시 • Aug 06+ 3 more updatesLasertec Corporation Provides Dividend Guidance for the Second Quarter and Year End of the Fiscal Year Ending June 30, 2023Lasertec Corporation provided dividend guidance for the second quarter and year end of the fiscal year ending June 30, 2023. For the quarter, the company expected dividend of JPY 52.00 per share.For the year, the company expected dividend of JPY 77.00 per share.
공시 • Feb 02+ 1 more updateLasertec Corporation to Report Q3, 2022 Results on Apr 28, 2022Lasertec Corporation announced that they will report Q3, 2022 results on Apr 28, 2022
공시 • Feb 01+ 2 more updatesLasertec Corporation Provides Year-End Dividend Guidance for the Fiscal Year Ending June 30, 2022Lasertec Corporation provided year-end dividend guidance for the fiscal year ending June 30, 2022. For the year, the company expects to pay year-end dividend of JPY 50.00 per share against JPY 55.00 per share paid for the same period a year ago.
공시 • Dec 02Lasertec Corporation Launches OPTELICS AI2 Automatic Inspection and Review SystemLasertec has launched OPTELICS AI2, a new type of confocal microscope designed to perform automatic defect inspection and review. AI2 provides high-speed automatic surface defect inspection, defect mapping, and high-magnification defect shape review from a single platform. There has been a rapid increase in demand for semiconductor devices due to growing need for 5G mobile communication, high-performance computing, and other applications. Semiconductor device manufacturers are expected to keep developing new devices with increased performance. For the development of new devices adopting new designs and new materials, various challenges need to be overcome with cross-organizational efforts. The evaluation of prototypes, quality control during production, and process improvement for higher yields are among those challenges. AI2 performs automatic surface defect inspection, defect review, and defect shape 3D profiling on a single platform, serving customer need in various situations of R&D and production. AI2 achieves both high-throughput, high-speed inspection and high-magnification surface shape profiling by integrating Lasertec's core technology in confocal optics, automatic inspection software perfected through the development of various semiconductor-related inspection systems, and newly designed high-speed motion hardware into a system. AI2 conducts AI-based inspection using deep learning and offers advanced inspection functions such as high-precision image classification, patterned sample inspection, and the extraction of specific types of defects. Lasertec is dedicated to addressing customer need and helping customers succeed in various R&D and yield improvement efforts. Automatic defect inspection, high-magnification review, and surface shape profiling on semiconductor wafer from a single platform, serving customer need in various situations of R&D and production. High-speed inspection capability: inspecting a whole 3-inch wafer in 15 minutes with sub-micron sensitivity.High-magnification review capability: high-magnification surface shape profiling available with switching of objective lens. Deep learning-based high-precision image classification, patterned sample inspection, and inspection of specific types of defects. Defect inspection, high-magnification review, and surface shape profiling of transparent samples, such as compound semiconductors and films, without interference of backside reflection. Lasertec providing a complete system including both hardware and software, making customization for specific need, and offering entire system support.