공시 • Jun 16
Advanced Micro Devices, Inc. (NasdaqGS:AMD) acquired MEXT Corporation. Advanced Micro Devices, Inc. (NasdaqGS:AMD) acquired MEXT Corporation on June 15, 2026.
MEXT team will join AMD.
Advanced Micro Devices, Inc. (NasdaqGS:AMD) completed the acquisition of MEXT Corporation on June 15, 2026. 공시 • Jun 03
Super Micro Computer Showcases Next-Generation AMD Helios Rack-Scale Platform At Computex Super Micro Computer, Inc. showcased the next-generation AMD Helios rack-scale platform at Computex. Helios enables Cloud Service Providers (CSPs), NeoClouds, hyperscalers, and enterprises to deliver large-scale AI workloads—including Sovereign AI, LLM training, inference, and fine-tuning—with unmatched efficiency and scalability. The Helios platform is a 72-GPU double-width rack-scale system powered by AMD Instinct MI455X GPUs, 6th Gen AMD EPYC CPUs, and AMD Pensando networking technologies all unified by the open AMD ROCm software stack. Helios delivers exceptional compute density and performance for frontier model training and high-throughput inference. Key capabilities include modular scalability from rack to cluster level, open networking for both scale-up and scale-out AI, advanced security, and integrated virtualization with rack-scale software acceleration. With open networking, advanced security, and integrated ROCm software, Helios helps providers accelerate time-to-market AI services, optimize resource utilization, and deliver reliable, high-performance AI capabilities at hyperscale. The Helios platform exemplifies Supermicro's A+A+A approach—Architecture, Accelerators, and Advancements—bringing together rack-scale system design, leading AMD AI compute solutions, and integrated software innovations. This unified approach enables customers to deploy AI infrastructure faster, operate more efficiently, and scale seamlessly as demand grows. DCBBS delivers complete, modular AI infrastructure built from validated components and subsystems, enabling flexible deployment from individual servers and networking to full rack-scale and data center-level solutions, including software and services. The AMD Helios rack-scale solution will be on display at the Supermicro booth Taipei Nangang Exhibition Center Hall 1, 4F, N0602, offering attendees a first-hand look at its design and capabilities. Visitors can also explore the platform through Supermicro's A+ Superverse Interactive Demo. 공시 • May 22
Advanced Micro Devices Announces Production Ramp Of Next-Generation AMD EPYC Processor Venice On TSMC 2nm Process Technology Advanced Micro Devices announced that its next-generation AMD EPYC processor, codenamed Venice, is ramping production in Taiwan on TSMC’s advanced 2nm process technology, with future plans to ramp production at TSMC’s Arizona fabrication facility. The milestone in the execution of the Advanced Micro Devices data center CPU roadmap demonstrates continued progress toward delivering the performance and energy efficiency required for next-generation cloud, enterprise and AI infrastructure. Venice is the first high-performance computing product in the industry to enter production on TSMC’s advanced 2nm process technology. As AI adoption expands from training and inference to increasingly complex agentic workloads, the CPU is becoming even more critical to scaling AI infrastructure, coordinating data movement, networking, storage, security and system orchestration across the data center. The ramp of Venice comes as Advanced Micro Devices continues to build momentum in the server market, reflecting growing customer demand for EPYC processors to power modern cloud, enterprise, HPC and AI deployments. The Venice ramp in Taiwan and plans to ramp at TSMC Arizona reflect Advanced Micro Devices’ focus on strengthening its geographically diverse advanced manufacturing footprint. By pairing next-generation EPYC processor innovation with advanced manufacturing capacity across the globe, Advanced Micro Devices is expanding the foundation needed to support customers as they deploy and scale AI infrastructure. Advanced Micro Devices also plans to extend TSMC 2nm process technology across its data center CPU roadmap with Verano, a 6th Gen EPYC processor optimized for performance-per-dollar-per-watt leadership. Designed to support cloud and AI computing workloads, Verano is expected to build on the Advanced Micro Devices EPYC platform with advanced memory innovations, including LPDDR, to deliver the CPU performance, bandwidth and efficiency required for increasingly power constrained workloads and applications. Advanced Micro Devices and TSMC’s partnership spans the technologies needed to scale modern data center computing, from TSMC 2nm process technology for next-generation CPUs to advanced packaging technologies, including TSMC’s SoIC-X and CoWoS-L, used across Advanced Micro Devices’ broader AI and data center portfolio. With Venice ramping on TSMC 2nm, Advanced Micro Devices is advancing the CPU foundation for AI infrastructure while continuing to leverage TSMC’s process and packaging leadership to deliver increasingly integrated compute platforms at scale. 공시 • May 08
Advanced Micro Devices, Inc. Provides Earnings Guidance for the Second Quarter of 2026 Advanced Micro Devices, Inc. provided earnings guidance for the second quarter of 2026. For the period, the company expects revenue to be approximately $11.2 billion, plus or minus $300 million. The mid-point of the revenue range represents year-over-year growth of approximately 46% and a sequential increase of approximately 9%. 공시 • Apr 11
Advanced Micro Devices, Inc. to Report Q1, 2026 Results on May 05, 2026 Advanced Micro Devices, Inc. announced that they will report Q1, 2026 results After-Market on May 05, 2026 
