View Financial HealthAdvanced Micro Devices 배당 및 자사주 매입배당 기준 점검 0/6Advanced Micro Devices 배당금을 지급한 기록이 없습니다.핵심 정보n/a배당 수익률0.1%자사주 매입 수익률총 주주 수익률0.1%미래 배당 수익률0%배당 성장률n/a다음 배당 지급일n/a배당락일n/a주당 배당금n/a배당 성향n/a최근 배당 및 자사주 매입 업데이트업데이트 없음모든 업데이트 보기Recent updates공고 • Aug 08Advanced Micro Devices, Inc. (NasdaqGS:AMD) agreed to acquire Taalas Inc.Advanced Micro Devices, Inc. (NasdaqGS:AMD) agreed to acquire Taalas Inc. on August 6, 2026. The transaction is subject to approval by regulatory board / committee and customary closing conditions.공고 • Aug 06+ 1 more updateAMD, Spectro Cloud And Supermicro Introduce AMD Instinct Coder Enterprise AI Inference SolutionAMD, Spectro Cloud and Supermicro announced AMD Instinct Coder, a co-designed turnkey, validated enterprise inference solution. AMD Instinct Coder combines Spectro Cloud PaletteAI Inference Launchpad, providing intelligent model routing, metering, quotas, KV cache optimization, on-prem and hosted deployment options, and governance; AMD Instinct GPUs, delivering high-performance compute, memory capacity and bandwidth for AI inference; and Supermicro enterprise AI systems, providing a production-ready, integrated hardware foundation. The result is a packaged solution intended to replace a complex do-it-yourself infrastructure project with a faster path to deploying and operating private AI inference. AMD Instinct Coder allows organizations to route each request according to policy, workload complexity, model capability and infrastructure availability. Routine and suitable coding workloads can be processed by locally deployed models, while advanced reasoning and other specialized tasks can continue to use frontier models. This hybrid operating model is designed to help customers reduce token costs by shifting appropriate workloads to locally operated models, maintain control of sensitive code, prompts and contextual data, govern AI consumption through metering, quotas and policy-based routing, preserve model choice rather than committing all workloads to one provider, and deploy faster through an integrated, validated hardware and software solution. AMD Instinct GPUs deliver leading performance and cost efficiency for generative AI, training and inferencing, combining high-performance accelerator architecture with large memory capacity, high bandwidth and the open AMD ROCm software ecosystem. The initial AMD Instinct Coder configuration is expected to use AMD Instinct MI325X GPUs. Each MI325X GPU provides 256 GB of HBM3E memory and up to 6 TB/s of peak memory bandwidth, supporting memory-intensive AI inference workloads. AMD Instinct Coder is delivered on Supermicro GPU systems engineered for high-performance AI and HPC workloads. Supermicro offers air- and liquid-cooled, eight-GPU systems supporting AMD Instinct MI325X and MI350 Series accelerators, built on its modular AI system architecture and designed to streamline deployment at scale. Supermicro’s pre-validation, rack integration and system-level qualification are intended to reduce onsite configuration and shorten the path from infrastructure delivery to production use. Spectro Cloud PaletteAI Inference Launchpad provides the software layer for deploying and operating the solution. It allows platform teams to route requests across local and frontier models, apply policies based on workload type, model capability and cost, meter token consumption and establish quotas, separate teams and users through multi-tenant controls, maintain local operation of suitable workloads, and preserve fallback access to external frontier models. The solution is designed to support a tiered inference architecture in which different model endpoints serve different performance, sensitivity and cost requirements. AMD Instinct Coder will be demonstrated at Ai4 in Las Vegas, August 4–6, 2026. The initial configuration is expected to be based on Supermicro systems powered by AMD Instinct MI325X GPUs. Product configuration, availability, pricing and regional support are subject to final partner validation and approval.공고 • Jul 25Advanced Micro Devices, Inc. Launches 6th Gen EPYC, CPUs, Instinct Mi400 Series CPUs, Helios AI Rackscale Solutions, Ryzen AI Embedded X100 Processors, and Kria AI SOM and Robotics Developer PlatformAdvanced Micro Devices, Inc. launched its next-generation AI infrastructure and physical AI portfolio at Advancing AI 2026, led by AMD Helios rackscale solutions, now in production to be deployed by leading AI companies at gigawatt scale. AMD Helios rackscale solutions are built with co-optimized silicon spanning 72 high-performance AMD Instinct MI455X GPUs and 18 powerful 6th Gen AMD EPYC “Venice” CPUs, connected by AMD Pensando front-end, scale-up and scale-out networking, and accelerated by AMD ROCm open software. AMD Helios combines leadership compute performance, memory capacity and networking bandwidth to deliver up to 30% more tokens per dollar than the leading competitive solution. Leading AI labs and cloud providers are choosing AMD Helios for its open, full-stack performance. AMD also launched 6th Gen EPYC processors, which deliver the broadest server CPU portfolio for agentic AI, spanning cloud, enterprise, general-purpose and high-performance computing workloads. With leadership per-core performance and the highest thread density, they enable the most agents per watt, per dollar and per rack. AMD Instinct MI400 Series GPUs deliver powerful performance for cloud, enterprise and HPC workloads. AMD Instinct MI455X GPUs deliver 34x higher token throughput compared to MI355X GPUs. For high-precision workloads, the AMD Instinct MI430X accelerator is the most advanced for HPC and sovereign AI with up to 288 TFLOPS of hardware-based FP64 performance for scientific computing. AMD also launched the Instinct MI350P GPU, bringing seamless AI acceleration to existing infrastructure with leadership token economics. For developers, AMD ROCm is the open software platform with the performance, flexibility and ecosystem support needed to build and deploy AI on AMD hardware. AMD is introducing ROCm.ai, an AI-driven development platform that helps developers build, optimize and deploy GPU software faster across AMD platforms. AMD introduced AMD Kria AI solutions, extending the company’s robotics capabilities from the robot body to the robot brain. The portfolio includes new AMD Kria AI system-on-modules (SOMs), powered by the new AMD Ryzen AI Embedded X100 Series processors, and the AMD Kria AI Robotics Developer Platform, the first open, turnkey integrated platform for autonomous robotics combining CPU, GPU, NPU and FPGA compute.공고 • Jul 09Advanced Micro Devices, Inc. to Report Q2, 2026 Results on Aug 04, 2026Advanced Micro Devices, Inc. announced that they will report Q2, 2026 results After-Market on Aug 04, 2026공고 • Jun 29+ 3 more updatesAdvanced Micro Devices, Inc.(NasdaqGS:AMD) dropped from Russell Top 200 Value BenchmarkAdvanced Micro Devices, Inc.(NasdaqGS:AMD) dropped from Russell Top 200 Value Benchmark공고 • Jun 16Advanced Micro Devices, Inc. (NasdaqGS:AMD) acquired MEXT Corporation.Advanced Micro Devices, Inc. (NasdaqGS:AMD) acquired MEXT Corporation on June 15, 2026. MEXT team will join AMD. Advanced Micro Devices, Inc. (NasdaqGS:AMD) completed the acquisition of MEXT Corporation on June 15, 2026.공고 • Jun 03Super Micro Computer Showcases Next-Generation AMD Helios Rack-Scale Platform At ComputexSuper Micro Computer, Inc. showcased the next-generation AMD Helios rack-scale platform at Computex. Helios enables Cloud Service Providers (CSPs), NeoClouds, hyperscalers, and enterprises to deliver large-scale AI workloads—including Sovereign AI, LLM training, inference, and fine-tuning—with unmatched efficiency and scalability. The Helios platform is a 72-GPU double-width rack-scale system powered by AMD Instinct MI455X GPUs, 6th Gen AMD EPYC CPUs, and AMD Pensando networking technologies all unified by the open AMD ROCm software stack. Helios delivers exceptional compute density and performance for frontier model training and high-throughput inference. Key capabilities include modular scalability from rack to cluster level, open networking for both scale-up and scale-out AI, advanced security, and integrated virtualization with rack-scale software acceleration. With open networking, advanced security, and integrated ROCm software, Helios helps providers accelerate time-to-market AI services, optimize resource utilization, and deliver reliable, high-performance AI capabilities at hyperscale. The Helios platform exemplifies Supermicro's A+A+A approach—Architecture, Accelerators, and Advancements—bringing together rack-scale system design, leading AMD AI compute solutions, and integrated software innovations. This unified approach enables customers to deploy AI infrastructure faster, operate more efficiently, and scale seamlessly as demand grows. DCBBS delivers complete, modular AI infrastructure built from validated components and subsystems, enabling flexible deployment from individual servers and networking to full rack-scale and data center-level solutions, including software and services. The AMD Helios rack-scale solution will be on display at the Supermicro booth Taipei Nangang Exhibition Center Hall 1, 4F, N0602, offering attendees a first-hand look at its design and capabilities. Visitors can also explore the platform through Supermicro's A+ Superverse Interactive Demo.공고 • May 22Advanced Micro Devices Announces Production Ramp Of Next-Generation AMD EPYC Processor Venice On TSMC 2nm Process TechnologyAdvanced Micro Devices announced that its next-generation AMD EPYC processor, codenamed Venice, is ramping production in Taiwan on TSMC’s advanced 2nm process technology, with future plans to ramp production at TSMC’s Arizona fabrication facility. The milestone in the execution of the Advanced Micro Devices data center CPU roadmap demonstrates continued progress toward delivering the performance and energy efficiency required for next-generation cloud, enterprise and AI infrastructure. Venice is the first high-performance computing product in the industry to enter production on TSMC’s advanced 2nm process technology. As AI adoption expands from training and inference to increasingly complex agentic workloads, the CPU is becoming even more critical to scaling AI infrastructure, coordinating data movement, networking, storage, security and system orchestration across the data center. The ramp of Venice comes as Advanced Micro Devices continues to build momentum in the server market, reflecting growing customer demand for EPYC processors to power modern cloud, enterprise, HPC and AI deployments. The Venice ramp in Taiwan and plans to ramp at TSMC Arizona reflect Advanced Micro Devices’ focus on strengthening its geographically diverse advanced manufacturing footprint. By pairing next-generation EPYC processor innovation with advanced manufacturing capacity across the globe, Advanced Micro Devices is expanding the foundation needed to support customers as they deploy and scale AI infrastructure. Advanced Micro Devices also plans to extend TSMC 2nm process technology across its data center CPU roadmap with Verano, a 6th Gen EPYC processor optimized for performance-per-dollar-per-watt leadership. Designed to support cloud and AI computing workloads, Verano is expected to build on the Advanced Micro Devices EPYC platform with advanced memory innovations, including LPDDR, to deliver the CPU performance, bandwidth and efficiency required for increasingly power constrained workloads and applications. Advanced Micro Devices and TSMC’s partnership spans the technologies needed to scale modern data center computing, from TSMC 2nm process technology for next-generation CPUs to advanced packaging technologies, including TSMC’s SoIC-X and CoWoS-L, used across Advanced Micro Devices’ broader AI and data center portfolio. With Venice ramping on TSMC 2nm, Advanced Micro Devices is advancing the CPU foundation for AI infrastructure while continuing to leverage TSMC’s process and packaging leadership to deliver increasingly integrated compute platforms at scale.공고 • May 08Advanced Micro Devices, Inc. Provides Earnings Guidance for the Second Quarter of 2026Advanced Micro Devices, Inc. provided earnings guidance for the second quarter of 2026. For the period, the company expects revenue to be approximately $11.2 billion, plus or minus $300 million. The mid-point of the revenue range represents year-over-year growth of approximately 46% and a sequential increase of approximately 9%.공고 • Apr 11Advanced Micro Devices, Inc. to Report Q1, 2026 Results on May 05, 2026Advanced Micro Devices, Inc. announced that they will report Q1, 2026 results After-Market on May 05, 2026공고 • Apr 09Ultra Accelerator Link Consortium Publishes Four Specifications Defining In-Network Compute, Chiplets, Manageability and 200G PerformanceUltra Accelerator Link Consortium, the industry standards organization developing the open scale-up interconnect for next-generation AI workloads, announced the ratification of the next UALink Specification, which encompasses three major additions – In-Network Compute, Chiplet Definition, and Manageability. The new specifications support the deployment of UALink solutions in multi-workload environments, while simultaneously helping improve UALink technology efficiency, performance for AI workloads and ease of implementation. The UALink Consortium provides a standardized foundation for accelerator connectivity at scale, helping drive innovation, increase deployment flexibility and support the rapidly growing performance demands of next-generation AI workloads. The new specification update is facilitated through UALink Consortium’s open governance model, which fosters innovation while enabling a robust, multi-vendor supply chain, providing system designers and cloud providers with the necessary flexibility to deploy interoperable solutions without vendor lock-in. New UALink Specifications: UALink Common Specification 2.0 introduces In-Network Compute for UALink technology, facilitating computation and communication between accelerators. Reduces latency, saves bandwidth, and improves scaling efficiency for distributed training and inference for AI solutions for complex and multi-workload environments for UALink systems. UALink 200G Data Link and Physical Layers (DL/PL) Specification 2.0 split the DL/PL Specification from the UALink Common Specification to enable UALink to move quickly as new physical layers and speeds are needed by the industry without requiring changes to the other specifications. UALink Manageability Specification 1.0 introduces UALink as a system with centralized control and management planes. Utilizes standardized protocols, modeling and APIs like gNMI, Yang, SAI and Redfish. UALink Chiplet Specification 1.0 defines the necessary information to integrate UALink technology into chiplet-based SoCs, including interfaces, form factors, flow control and chiplet management standardization. Fully compliant with the UCIe 3.0 Specification for simplified integration into existing chiplet ecosystems. All of the UALink specifications are available for public download.지급의 안정성과 성장배당 데이터 가져오는 중안정적인 배당: 과거에 AMD23 의 주당 배당금이 안정적이었는지 판단하기에는 데이터가 부족합니다.배당금 증가: AMD23 의 배당금 지급이 증가했는지 판단하기에는 데이터가 부족합니다.배당 수익률 vs 시장Advanced Micro Devices 배당 수익률 vs 시장AMD23의 배당 수익률은 시장과 어떻게 비교되나요?구분배당 수익률회사 (AMD23)n/a시장 하위 25% (TH)3.1%시장 상위 25% (TH)7.1%업계 평균 (Semiconductor)0.8%분석가 예측 (AMD23) (최대 3년)0%주목할만한 배당금: 회사가 최근 지급을 보고하지 않았기 때문에 하위 25%의 배당금 지급자에 대해 AMD23 의 배당 수익률을 평가할 수 없습니다.고배당: 회사가 최근 지급을 보고하지 않았기 때문에 배당금 지급자의 상위 25%에 대해 AMD23 의 배당 수익률을 평가할 수 없습니다.주주 대상 이익 배당수익 보장: 배당금 지급이 수익으로 충당되는지 확인하기 위해 AMD23 의 지급 비율을 계산하기에는 데이터가 부족합니다.주주 현금 배당현금 흐름 범위: AMD23 에서 지급을 보고하지 않았기 때문에 배당 지속 가능성을 계산할 수 없습니다.높은 배당을 제공하는 우량 기업 찾기7D1Y7D1Y7D1YTH 시장에서 배당이 강한 기업.View Management기업 분석 및 재무 데이터 상태데이터최종 업데이트 (UTC 시간)기업 분석2026/08/17 00:58종가2026/08/17 00:00수익2026/06/27연간 수익2025/12/27데이터 소스당사의 기업 분석에 사용되는 데이터는 S&P Global Market Intelligence LLC에서 제공됩니다. 아래 데이터는 이 보고서를 생성하기 위해 분석 모델에서 사용됩니다. 데이터는 정규화되므로 소스가 제공된 후 지연이 발생할 수 있습니다.패키지데이터기간미국 소스 예시 *기업 재무제표10년손익계산서현금흐름표대차대조표SEC 양식 10-KSEC 양식 10-Q분석가 컨센서스 추정치+3년재무 예측분석가 목표주가분석가 리서치 보고서Blue Matrix시장 가격30년주가배당, 분할 및 기타 조치ICE 시장 데이터SEC 양식 S-1지분 구조10년주요 주주내부자 거래SEC 양식 4SEC 양식 13D경영진10년리더십 팀이사회SEC 양식 10-KSEC 양식 DEF 14A주요 개발10년회사 공시SEC 양식 8-K* 미국 증권에 대한 예시이며, 비(非)미국 증권에는 해당 국가의 규제 서식 및 자료원을 사용합니다.별도로 명시되지 않는 한 모든 재무 데이터는 연간 기간을 기준으로 하지만 분기별로 업데이트됩니다. 이를 TTM(최근 12개월) 또는 LTM(지난 12개월) 데이터라고 합니다. 자세히 알아보기.분석 모델 및 스노우플레이크이 보고서를 생성하는 데 사용된 분석 모델의 세부 정보는 당사의 GitHub 페이지에서 확인하실 수 있습니다. 또한 보고서 사용 방법에 대한 가이드와 YouTube 튜토리얼도 제공하고 있습니다.Simply Wall St 분석 모델을 설계하고 구축한 세계적 수준의 팀에 대해 알아보세요.산업 및 섹터 지표산업 및 섹터 지표는 Simply Wall St가 6시간마다 계산하며, 프로세스에 대한 자세한 내용은 Github에서 확인할 수 있습니다.분석가 소스Advanced Micro Devices, Inc.는 81명의 분석가가 다루고 있습니다. 이 중 48명의 분석가가 우리 보고서에 입력 데이터로 사용되는 매출 또는 수익 추정치를 제출했습니다. 분석가의 제출 자료는 하루 종일 업데이트됩니다.분석가기관Stefan ChangAletheia Analyst Network LimitedJanco VenterArete Research Services LLPJames FontanelliArete Research Services LLP78명의 분석가 더 보기
공고 • Aug 08Advanced Micro Devices, Inc. (NasdaqGS:AMD) agreed to acquire Taalas Inc.Advanced Micro Devices, Inc. (NasdaqGS:AMD) agreed to acquire Taalas Inc. on August 6, 2026. The transaction is subject to approval by regulatory board / committee and customary closing conditions.
공고 • Aug 06+ 1 more updateAMD, Spectro Cloud And Supermicro Introduce AMD Instinct Coder Enterprise AI Inference SolutionAMD, Spectro Cloud and Supermicro announced AMD Instinct Coder, a co-designed turnkey, validated enterprise inference solution. AMD Instinct Coder combines Spectro Cloud PaletteAI Inference Launchpad, providing intelligent model routing, metering, quotas, KV cache optimization, on-prem and hosted deployment options, and governance; AMD Instinct GPUs, delivering high-performance compute, memory capacity and bandwidth for AI inference; and Supermicro enterprise AI systems, providing a production-ready, integrated hardware foundation. The result is a packaged solution intended to replace a complex do-it-yourself infrastructure project with a faster path to deploying and operating private AI inference. AMD Instinct Coder allows organizations to route each request according to policy, workload complexity, model capability and infrastructure availability. Routine and suitable coding workloads can be processed by locally deployed models, while advanced reasoning and other specialized tasks can continue to use frontier models. This hybrid operating model is designed to help customers reduce token costs by shifting appropriate workloads to locally operated models, maintain control of sensitive code, prompts and contextual data, govern AI consumption through metering, quotas and policy-based routing, preserve model choice rather than committing all workloads to one provider, and deploy faster through an integrated, validated hardware and software solution. AMD Instinct GPUs deliver leading performance and cost efficiency for generative AI, training and inferencing, combining high-performance accelerator architecture with large memory capacity, high bandwidth and the open AMD ROCm software ecosystem. The initial AMD Instinct Coder configuration is expected to use AMD Instinct MI325X GPUs. Each MI325X GPU provides 256 GB of HBM3E memory and up to 6 TB/s of peak memory bandwidth, supporting memory-intensive AI inference workloads. AMD Instinct Coder is delivered on Supermicro GPU systems engineered for high-performance AI and HPC workloads. Supermicro offers air- and liquid-cooled, eight-GPU systems supporting AMD Instinct MI325X and MI350 Series accelerators, built on its modular AI system architecture and designed to streamline deployment at scale. Supermicro’s pre-validation, rack integration and system-level qualification are intended to reduce onsite configuration and shorten the path from infrastructure delivery to production use. Spectro Cloud PaletteAI Inference Launchpad provides the software layer for deploying and operating the solution. It allows platform teams to route requests across local and frontier models, apply policies based on workload type, model capability and cost, meter token consumption and establish quotas, separate teams and users through multi-tenant controls, maintain local operation of suitable workloads, and preserve fallback access to external frontier models. The solution is designed to support a tiered inference architecture in which different model endpoints serve different performance, sensitivity and cost requirements. AMD Instinct Coder will be demonstrated at Ai4 in Las Vegas, August 4–6, 2026. The initial configuration is expected to be based on Supermicro systems powered by AMD Instinct MI325X GPUs. Product configuration, availability, pricing and regional support are subject to final partner validation and approval.
공고 • Jul 25Advanced Micro Devices, Inc. Launches 6th Gen EPYC, CPUs, Instinct Mi400 Series CPUs, Helios AI Rackscale Solutions, Ryzen AI Embedded X100 Processors, and Kria AI SOM and Robotics Developer PlatformAdvanced Micro Devices, Inc. launched its next-generation AI infrastructure and physical AI portfolio at Advancing AI 2026, led by AMD Helios rackscale solutions, now in production to be deployed by leading AI companies at gigawatt scale. AMD Helios rackscale solutions are built with co-optimized silicon spanning 72 high-performance AMD Instinct MI455X GPUs and 18 powerful 6th Gen AMD EPYC “Venice” CPUs, connected by AMD Pensando front-end, scale-up and scale-out networking, and accelerated by AMD ROCm open software. AMD Helios combines leadership compute performance, memory capacity and networking bandwidth to deliver up to 30% more tokens per dollar than the leading competitive solution. Leading AI labs and cloud providers are choosing AMD Helios for its open, full-stack performance. AMD also launched 6th Gen EPYC processors, which deliver the broadest server CPU portfolio for agentic AI, spanning cloud, enterprise, general-purpose and high-performance computing workloads. With leadership per-core performance and the highest thread density, they enable the most agents per watt, per dollar and per rack. AMD Instinct MI400 Series GPUs deliver powerful performance for cloud, enterprise and HPC workloads. AMD Instinct MI455X GPUs deliver 34x higher token throughput compared to MI355X GPUs. For high-precision workloads, the AMD Instinct MI430X accelerator is the most advanced for HPC and sovereign AI with up to 288 TFLOPS of hardware-based FP64 performance for scientific computing. AMD also launched the Instinct MI350P GPU, bringing seamless AI acceleration to existing infrastructure with leadership token economics. For developers, AMD ROCm is the open software platform with the performance, flexibility and ecosystem support needed to build and deploy AI on AMD hardware. AMD is introducing ROCm.ai, an AI-driven development platform that helps developers build, optimize and deploy GPU software faster across AMD platforms. AMD introduced AMD Kria AI solutions, extending the company’s robotics capabilities from the robot body to the robot brain. The portfolio includes new AMD Kria AI system-on-modules (SOMs), powered by the new AMD Ryzen AI Embedded X100 Series processors, and the AMD Kria AI Robotics Developer Platform, the first open, turnkey integrated platform for autonomous robotics combining CPU, GPU, NPU and FPGA compute.
공고 • Jul 09Advanced Micro Devices, Inc. to Report Q2, 2026 Results on Aug 04, 2026Advanced Micro Devices, Inc. announced that they will report Q2, 2026 results After-Market on Aug 04, 2026
공고 • Jun 29+ 3 more updatesAdvanced Micro Devices, Inc.(NasdaqGS:AMD) dropped from Russell Top 200 Value BenchmarkAdvanced Micro Devices, Inc.(NasdaqGS:AMD) dropped from Russell Top 200 Value Benchmark
공고 • Jun 16Advanced Micro Devices, Inc. (NasdaqGS:AMD) acquired MEXT Corporation.Advanced Micro Devices, Inc. (NasdaqGS:AMD) acquired MEXT Corporation on June 15, 2026. MEXT team will join AMD. Advanced Micro Devices, Inc. (NasdaqGS:AMD) completed the acquisition of MEXT Corporation on June 15, 2026.
공고 • Jun 03Super Micro Computer Showcases Next-Generation AMD Helios Rack-Scale Platform At ComputexSuper Micro Computer, Inc. showcased the next-generation AMD Helios rack-scale platform at Computex. Helios enables Cloud Service Providers (CSPs), NeoClouds, hyperscalers, and enterprises to deliver large-scale AI workloads—including Sovereign AI, LLM training, inference, and fine-tuning—with unmatched efficiency and scalability. The Helios platform is a 72-GPU double-width rack-scale system powered by AMD Instinct MI455X GPUs, 6th Gen AMD EPYC CPUs, and AMD Pensando networking technologies all unified by the open AMD ROCm software stack. Helios delivers exceptional compute density and performance for frontier model training and high-throughput inference. Key capabilities include modular scalability from rack to cluster level, open networking for both scale-up and scale-out AI, advanced security, and integrated virtualization with rack-scale software acceleration. With open networking, advanced security, and integrated ROCm software, Helios helps providers accelerate time-to-market AI services, optimize resource utilization, and deliver reliable, high-performance AI capabilities at hyperscale. The Helios platform exemplifies Supermicro's A+A+A approach—Architecture, Accelerators, and Advancements—bringing together rack-scale system design, leading AMD AI compute solutions, and integrated software innovations. This unified approach enables customers to deploy AI infrastructure faster, operate more efficiently, and scale seamlessly as demand grows. DCBBS delivers complete, modular AI infrastructure built from validated components and subsystems, enabling flexible deployment from individual servers and networking to full rack-scale and data center-level solutions, including software and services. The AMD Helios rack-scale solution will be on display at the Supermicro booth Taipei Nangang Exhibition Center Hall 1, 4F, N0602, offering attendees a first-hand look at its design and capabilities. Visitors can also explore the platform through Supermicro's A+ Superverse Interactive Demo.
공고 • May 22Advanced Micro Devices Announces Production Ramp Of Next-Generation AMD EPYC Processor Venice On TSMC 2nm Process TechnologyAdvanced Micro Devices announced that its next-generation AMD EPYC processor, codenamed Venice, is ramping production in Taiwan on TSMC’s advanced 2nm process technology, with future plans to ramp production at TSMC’s Arizona fabrication facility. The milestone in the execution of the Advanced Micro Devices data center CPU roadmap demonstrates continued progress toward delivering the performance and energy efficiency required for next-generation cloud, enterprise and AI infrastructure. Venice is the first high-performance computing product in the industry to enter production on TSMC’s advanced 2nm process technology. As AI adoption expands from training and inference to increasingly complex agentic workloads, the CPU is becoming even more critical to scaling AI infrastructure, coordinating data movement, networking, storage, security and system orchestration across the data center. The ramp of Venice comes as Advanced Micro Devices continues to build momentum in the server market, reflecting growing customer demand for EPYC processors to power modern cloud, enterprise, HPC and AI deployments. The Venice ramp in Taiwan and plans to ramp at TSMC Arizona reflect Advanced Micro Devices’ focus on strengthening its geographically diverse advanced manufacturing footprint. By pairing next-generation EPYC processor innovation with advanced manufacturing capacity across the globe, Advanced Micro Devices is expanding the foundation needed to support customers as they deploy and scale AI infrastructure. Advanced Micro Devices also plans to extend TSMC 2nm process technology across its data center CPU roadmap with Verano, a 6th Gen EPYC processor optimized for performance-per-dollar-per-watt leadership. Designed to support cloud and AI computing workloads, Verano is expected to build on the Advanced Micro Devices EPYC platform with advanced memory innovations, including LPDDR, to deliver the CPU performance, bandwidth and efficiency required for increasingly power constrained workloads and applications. Advanced Micro Devices and TSMC’s partnership spans the technologies needed to scale modern data center computing, from TSMC 2nm process technology for next-generation CPUs to advanced packaging technologies, including TSMC’s SoIC-X and CoWoS-L, used across Advanced Micro Devices’ broader AI and data center portfolio. With Venice ramping on TSMC 2nm, Advanced Micro Devices is advancing the CPU foundation for AI infrastructure while continuing to leverage TSMC’s process and packaging leadership to deliver increasingly integrated compute platforms at scale.
공고 • May 08Advanced Micro Devices, Inc. Provides Earnings Guidance for the Second Quarter of 2026Advanced Micro Devices, Inc. provided earnings guidance for the second quarter of 2026. For the period, the company expects revenue to be approximately $11.2 billion, plus or minus $300 million. The mid-point of the revenue range represents year-over-year growth of approximately 46% and a sequential increase of approximately 9%.
공고 • Apr 11Advanced Micro Devices, Inc. to Report Q1, 2026 Results on May 05, 2026Advanced Micro Devices, Inc. announced that they will report Q1, 2026 results After-Market on May 05, 2026
공고 • Apr 09Ultra Accelerator Link Consortium Publishes Four Specifications Defining In-Network Compute, Chiplets, Manageability and 200G PerformanceUltra Accelerator Link Consortium, the industry standards organization developing the open scale-up interconnect for next-generation AI workloads, announced the ratification of the next UALink Specification, which encompasses three major additions – In-Network Compute, Chiplet Definition, and Manageability. The new specifications support the deployment of UALink solutions in multi-workload environments, while simultaneously helping improve UALink technology efficiency, performance for AI workloads and ease of implementation. The UALink Consortium provides a standardized foundation for accelerator connectivity at scale, helping drive innovation, increase deployment flexibility and support the rapidly growing performance demands of next-generation AI workloads. The new specification update is facilitated through UALink Consortium’s open governance model, which fosters innovation while enabling a robust, multi-vendor supply chain, providing system designers and cloud providers with the necessary flexibility to deploy interoperable solutions without vendor lock-in. New UALink Specifications: UALink Common Specification 2.0 introduces In-Network Compute for UALink technology, facilitating computation and communication between accelerators. Reduces latency, saves bandwidth, and improves scaling efficiency for distributed training and inference for AI solutions for complex and multi-workload environments for UALink systems. UALink 200G Data Link and Physical Layers (DL/PL) Specification 2.0 split the DL/PL Specification from the UALink Common Specification to enable UALink to move quickly as new physical layers and speeds are needed by the industry without requiring changes to the other specifications. UALink Manageability Specification 1.0 introduces UALink as a system with centralized control and management planes. Utilizes standardized protocols, modeling and APIs like gNMI, Yang, SAI and Redfish. UALink Chiplet Specification 1.0 defines the necessary information to integrate UALink technology into chiplet-based SoCs, including interfaces, form factors, flow control and chiplet management standardization. Fully compliant with the UCIe 3.0 Specification for simplified integration into existing chiplet ecosystems. All of the UALink specifications are available for public download.