공시 • Feb 15
AP Memory Technology Corporation to Report Fiscal Year 2025 Results on Feb 26, 2026 AP Memory Technology Corporation announced that they will report fiscal year 2025 results on Feb 26, 2026 공시 • Dec 29
AP Memory Technology Corporation, Annual General Meeting, May 08, 2026 AP Memory Technology Corporation, Annual General Meeting, May 08, 2026. Location: 2 floor no,3, t`ai yuan 1st st., jhubei city, hsinchu county Taiwan 공시 • Dec 18
AP Memory Broadens S-SiCap™? Technology Deployment to Support Evolving Ai and Hpc Needs AP Memory announced further advancements in its S-SiCapTM (Stack Silicon Capacitor) product line to address the increasing integration demands of AI servers and high-performance computing (HPC) systems. The S-SiCapTM portfolio includes two product categories --disc discrete silicon capacitors and interposers with silicon capacitors -- designed to support different system architectures and diverse application requirements. The discrete silicon capacitors, S-SiCapTM Gen4, achieves a capacitance density of 3.8 mF/mm2, an increase of more than 50% over the previous generation. To meet the growing demand for higher performance and power efficiency in AI servers and HPC systems, S-SiCapTMGen4 is the first to adopt embedded substrate packaging and is currently in the sampling and process validation stage. Mass production will be introduced progressively starting in 2026. Meanwhile, the S-SiCapTM Interposer utilizes a silicon wafer as its substrate, embedding high-density silicon capacitors within the interposer. This significantly enhances signal integrity and power stability for high-speed I/O applications such as die-to-die, SerDes, and HBM. In collaboration with supply-chain partners, AP Memory has introduced a reticle-stitching technology to enlarge interposer die area allowing more IC chiplets to meet the growing demand for higher-integration advanced packaging solutions. The S-SiCap™? Interposer has completed customer packaging and reliability validation, entering four-reticle mass production at the end of Third Quarter'25. Additional development projects are currently underway. 공시 • Sep 10
AP Memory Technology Corp. Launches ApSRAM - A New Low-Power and High-Performance PSRAM AP Memory announced that its next-generation PSRAM--ApSRAM (Attached-pSRAM)-- has successfully passed customer validation and is scheduled to begin mass production by the end of the year. ApSRAMTM is an advanced version of AP Memory's PSRAM (Pseudo Static Random Access Memory), featuring a new architecture optimized for edge computing and IoT applications. ApSRAMTM delivers a powerful combination of low power consumption, low latency, and high performance. ApSRAMTM adopts a more intuitive control interface that eliminates the need for complex signal calibration, while still effectively supporting higher bandwidth requirements. Compared with conventional PSRAM, ApSRAMTM delivers up to four times the bandwidth and reduces dynamic power consumption to just one-fifth, making it particularly suitable for battery-sensitive devices such as wearables and edge computing applications, where both low power consumption and real-time data exchange are essential. ApSRAMTM enables SoCs to scale memory capacity without requiring redesign, offering density options from 128Mb to 2Gb. It supports I/O voltages from 0.6V to 1.1V, ensuring compatibility with a wide range of logic processes and simplifying system integration. The first ApSRAMTM product is now sampling and will enter mass production by year-end. AP Memory also plans to roll out additional density options to meet the evolving requirements of emerging applications and diverse market needs. 공시 • Apr 25
AP Memory Technology Corporation to Report Q1, 2025 Results on May 02, 2025 AP Memory Technology Corporation announced that they will report Q1, 2025 results on May 02, 2025 공시 • Mar 02
AP Memory Technology Corporation Announces Cash Dividend for the Year Ended December 31, 2024 AP Memory Technology Corporation announced cash dividend of TWD 7 per share for the year ended December 31, 2024. Total amount of cash distributed to shareholders is TWD 1,137,179,624. Par value of common stock is TWD 5 per share. 공시 • Feb 20
AP Memory Technology Corporation to Report Fiscal Year 2024 Results on Feb 27, 2025 AP Memory Technology Corporation announced that they will report fiscal year 2024 results on Feb 27, 2025 공시 • Dec 30
AP Memory Technology Corporation, Annual General Meeting, Apr 30, 2025 AP Memory Technology Corporation, Annual General Meeting, Apr 30, 2025. Location: 2 floor no,3, t`ai yuan 1st st., jhubei city, hsinchu county Taiwan 공시 • Dec 28
Ap Memory Technology Corporation Announces Compensation Committee Changes AP Memory Technology Corporation announced Compensation Committee Changes. Name of the previous position holder: Lan, Ching-Yao. Resume of the previous position holder: Supervisor of President Co. Ltd. Name of the new position holder: Ken Chen. Resume of the new position holder: Brillnics (Taiwan) Inc., Business Director, Global Unichip Corporation, General Manager Taiwan Semiconductor Manufacturing Company Limited, Senior Director. Effective date of the new member is January 1,2025. The resignation will be effective on December 31, 2024. The term of appointment for the new member will begin on the date of appointment and continue until the expiration of the current Board of Directors' term. 공시 • Oct 23
AP Memory Technology Corporation to Report Q3, 2024 Results on Oct 30, 2024 AP Memory Technology Corporation announced that they will report Q3, 2024 results on Oct 30, 2024 공시 • Jul 24
AP Memory Technology Corporation to Report Q2, 2024 Results on Jul 31, 2024 AP Memory Technology Corporation announced that they will report Q2, 2024 results on Jul 31, 2024 공시 • Apr 28
AP Memory Technology Corporation to Report Q1, 2024 Results on May 03, 2024 AP Memory Technology Corporation announced that they will report Q1, 2024 results on May 03, 2024 공시 • Mar 16
AP Memory Technology Corporation Announces New Generation Stack Silicon Capacitor (S-Sicap) Gen3 Passed Customer Validation AP Memory Technology Corporation announced that the new generation stack silicon capacitor (S-SiCapTM) Gen3 has passed customer validation. S-SiCapTM is a high capacitance density and very low profile (<100um thin) silicon capacitor that can be integrated with System-on-Chip (SoC) with advanced packaging processes. The product can also be customized to meet the application requirements of high-end smartphones and High-Performance Computing (HPC) chips. AP Memory's S-SiCapTM uses a stacked capacitor, offering higher capacitance density, smaller size and thinner form factor compared to deep trench capacitors. The capacitance density of S-SiCapTM Gen3 can reach 2.5uF/mm2, with a maximum operating voltage of 1.2V and demonstrate excellent temperature and voltage stability. Additionally, it has low equivalent series inductance (ESL) and low equivalent series resistance (ESR), providing outstanding voltage stability during high-frequency operation. S-SiCapTM provides low profile and customizable product dimensions. In advanced packaging processes, it can meet various integration applications and be placed closer to SoC. For example: S-SiCapTM on the landside, S-SiCapTM embedded in package substrate, S-SiCapTM for 2.5D packaging, and S-SiCapTM in an interposer. AP Memory's President, Hong Chih-Hsun, notes that considering the trend of high-end mobile phones and HPC applications, SoCs need to deliver higher performance. However, this may come with increased power consumption and voltage instability. If customers aim for stable voltage operation in these applications, they will need more robust capacitor technology. AP Memory's S-SiCapTM Gen3 surpasses traditional capacitor technology by providing higher capacitance density, lower profile, and greater application versatility; all of which significantly enhance SoC performance in advanced packaging processes. 공시 • Mar 03
AP Memory Technology Corporation, Annual General Meeting, May 27, 2024 AP Memory Technology Corporation, Annual General Meeting, May 27, 2024. Location: No. 88, Zhuangjing 1st Rd., Hsinchu County 302 Zhubei Taiwan Agenda: To report the business of 2023; to consider the 2023 Audit Committee's Review Report; to consider report 2023 employees' profit sharing bonus and directors' compensation; to consider report 2023 earnings distribution; to accept the 2023 Business Report and Financial Statements; to accept the proposal for distribution of 2023 earnings; to consider amendment to the Company's Procedures for the Election of the Directors; to discuss to approve the lifting of non-competition restrictions for directors and their representatives; and to consider other matters. 
