View Financial HealthAP Memory Technology 배당 및 자사주 매입배당 기준 점검 0/6AP Memory Technology 은(는) 현재 수익률이 0.73% 인 배당금 지급 회사입니다.핵심 정보0.7%배당 수익률-0.03%자사주 매입 수익률총 주주 수익률0.7%미래 배당 수익률3.6%배당 성장률21.7%다음 배당 지급일n/a배당락일n/a주당 배당금n/a배당 성향90%최근 배당 및 자사주 매입 업데이트공시 • Mar 02AP Memory Technology Corporation Announces Cash Dividend for the Year Ended December 31, 2024AP Memory Technology Corporation announced cash dividend of TWD 7 per share for the year ended December 31, 2024. Total amount of cash distributed to shareholders is TWD 1,137,179,624. Par value of common stock is TWD 5 per share.모든 업데이트 보기Recent updates공시 • Feb 15AP Memory Technology Corporation to Report Fiscal Year 2025 Results on Feb 26, 2026AP Memory Technology Corporation announced that they will report fiscal year 2025 results on Feb 26, 2026공시 • Dec 29AP Memory Technology Corporation, Annual General Meeting, May 08, 2026AP Memory Technology Corporation, Annual General Meeting, May 08, 2026. Location: 2 floor no,3, t`ai yuan 1st st., jhubei city, hsinchu county Taiwan공시 • Dec 18AP Memory Broadens S-SiCap™? Technology Deployment to Support Evolving Ai and Hpc NeedsAP Memory announced further advancements in its S-SiCapTM (Stack Silicon Capacitor) product line to address the increasing integration demands of AI servers and high-performance computing (HPC) systems. The S-SiCapTM portfolio includes two product categories --disc discrete silicon capacitors and interposers with silicon capacitors -- designed to support different system architectures and diverse application requirements. The discrete silicon capacitors, S-SiCapTM Gen4, achieves a capacitance density of 3.8 mF/mm2, an increase of more than 50% over the previous generation. To meet the growing demand for higher performance and power efficiency in AI servers and HPC systems, S-SiCapTMGen4 is the first to adopt embedded substrate packaging and is currently in the sampling and process validation stage. Mass production will be introduced progressively starting in 2026. Meanwhile, the S-SiCapTM Interposer utilizes a silicon wafer as its substrate, embedding high-density silicon capacitors within the interposer. This significantly enhances signal integrity and power stability for high-speed I/O applications such as die-to-die, SerDes, and HBM. In collaboration with supply-chain partners, AP Memory has introduced a reticle-stitching technology to enlarge interposer die area allowing more IC chiplets to meet the growing demand for higher-integration advanced packaging solutions. The S-SiCap™? Interposer has completed customer packaging and reliability validation, entering four-reticle mass production at the end of Third Quarter'25. Additional development projects are currently underway.공시 • Sep 10AP Memory Technology Corp. Launches ApSRAM - A New Low-Power and High-Performance PSRAMAP Memory announced that its next-generation PSRAM--ApSRAM (Attached-pSRAM)-- has successfully passed customer validation and is scheduled to begin mass production by the end of the year. ApSRAMTM is an advanced version of AP Memory's PSRAM (Pseudo Static Random Access Memory), featuring a new architecture optimized for edge computing and IoT applications. ApSRAMTM delivers a powerful combination of low power consumption, low latency, and high performance. ApSRAMTM adopts a more intuitive control interface that eliminates the need for complex signal calibration, while still effectively supporting higher bandwidth requirements. Compared with conventional PSRAM, ApSRAMTM delivers up to four times the bandwidth and reduces dynamic power consumption to just one-fifth, making it particularly suitable for battery-sensitive devices such as wearables and edge computing applications, where both low power consumption and real-time data exchange are essential. ApSRAMTM enables SoCs to scale memory capacity without requiring redesign, offering density options from 128Mb to 2Gb. It supports I/O voltages from 0.6V to 1.1V, ensuring compatibility with a wide range of logic processes and simplifying system integration. The first ApSRAMTM product is now sampling and will enter mass production by year-end. AP Memory also plans to roll out additional density options to meet the evolving requirements of emerging applications and diverse market needs.공시 • Apr 25AP Memory Technology Corporation to Report Q1, 2025 Results on May 02, 2025AP Memory Technology Corporation announced that they will report Q1, 2025 results on May 02, 2025공시 • Mar 02AP Memory Technology Corporation Announces Cash Dividend for the Year Ended December 31, 2024AP Memory Technology Corporation announced cash dividend of TWD 7 per share for the year ended December 31, 2024. Total amount of cash distributed to shareholders is TWD 1,137,179,624. Par value of common stock is TWD 5 per share.공시 • Feb 20AP Memory Technology Corporation to Report Fiscal Year 2024 Results on Feb 27, 2025AP Memory Technology Corporation announced that they will report fiscal year 2024 results on Feb 27, 2025공시 • Dec 30AP Memory Technology Corporation, Annual General Meeting, Apr 30, 2025AP Memory Technology Corporation, Annual General Meeting, Apr 30, 2025. Location: 2 floor no,3, t`ai yuan 1st st., jhubei city, hsinchu county Taiwan공시 • Dec 28Ap Memory Technology Corporation Announces Compensation Committee ChangesAP Memory Technology Corporation announced Compensation Committee Changes. Name of the previous position holder: Lan, Ching-Yao. Resume of the previous position holder: Supervisor of President Co. Ltd. Name of the new position holder: Ken Chen. Resume of the new position holder: Brillnics (Taiwan) Inc., Business Director, Global Unichip Corporation, General Manager Taiwan Semiconductor Manufacturing Company Limited, Senior Director. Effective date of the new member is January 1,2025. The resignation will be effective on December 31, 2024. The term of appointment for the new member will begin on the date of appointment and continue until the expiration of the current Board of Directors' term.공시 • Oct 23AP Memory Technology Corporation to Report Q3, 2024 Results on Oct 30, 2024AP Memory Technology Corporation announced that they will report Q3, 2024 results on Oct 30, 2024공시 • Oct 22+ 2 more updatesAP Memory Technology Corporation Announces the Reassign the Juridical Person Director RepresentativeAP Memory Technology Corporation Announced the reassign the juridical person director representative. Name of legal person: Shanyi Investment Co. Ltd. Name of the previous position holder: Liu, Chin-Hung. Resume of the previous position holder: Senior Vice President of the Company. Name of the new position holder: Yeh, Jui-Pin. Resume of the new position holder: Independent Director of the Company. Reason for the change: Juristic person director re-appoints representative. Effective date of the new appointment of October 21, 2024.공시 • Jul 24AP Memory Technology Corporation to Report Q2, 2024 Results on Jul 31, 2024AP Memory Technology Corporation announced that they will report Q2, 2024 results on Jul 31, 2024공시 • Apr 28AP Memory Technology Corporation to Report Q1, 2024 Results on May 03, 2024AP Memory Technology Corporation announced that they will report Q1, 2024 results on May 03, 2024공시 • Mar 16AP Memory Technology Corporation Announces New Generation Stack Silicon Capacitor (S-Sicap) Gen3 Passed Customer ValidationAP Memory Technology Corporation announced that the new generation stack silicon capacitor (S-SiCapTM) Gen3 has passed customer validation. S-SiCapTM is a high capacitance density and very low profile (<100um thin) silicon capacitor that can be integrated with System-on-Chip (SoC) with advanced packaging processes. The product can also be customized to meet the application requirements of high-end smartphones and High-Performance Computing (HPC) chips. AP Memory's S-SiCapTM uses a stacked capacitor, offering higher capacitance density, smaller size and thinner form factor compared to deep trench capacitors. The capacitance density of S-SiCapTM Gen3 can reach 2.5uF/mm2, with a maximum operating voltage of 1.2V and demonstrate excellent temperature and voltage stability. Additionally, it has low equivalent series inductance (ESL) and low equivalent series resistance (ESR), providing outstanding voltage stability during high-frequency operation. S-SiCapTM provides low profile and customizable product dimensions. In advanced packaging processes, it can meet various integration applications and be placed closer to SoC. For example: S-SiCapTM on the landside, S-SiCapTM embedded in package substrate, S-SiCapTM for 2.5D packaging, and S-SiCapTM in an interposer. AP Memory's President, Hong Chih-Hsun, notes that considering the trend of high-end mobile phones and HPC applications, SoCs need to deliver higher performance. However, this may come with increased power consumption and voltage instability. If customers aim for stable voltage operation in these applications, they will need more robust capacitor technology. AP Memory's S-SiCapTM Gen3 surpasses traditional capacitor technology by providing higher capacitance density, lower profile, and greater application versatility; all of which significantly enhance SoC performance in advanced packaging processes.공시 • Mar 03AP Memory Technology Corporation, Annual General Meeting, May 27, 2024AP Memory Technology Corporation, Annual General Meeting, May 27, 2024. Location: No. 88, Zhuangjing 1st Rd., Hsinchu County 302 Zhubei Taiwan Agenda: To report the business of 2023; to consider the 2023 Audit Committee's Review Report; to consider report 2023 employees' profit sharing bonus and directors' compensation; to consider report 2023 earnings distribution; to accept the 2023 Business Report and Financial Statements; to accept the proposal for distribution of 2023 earnings; to consider amendment to the Company's Procedures for the Election of the Directors; to discuss to approve the lifting of non-competition restrictions for directors and their representatives; and to consider other matters.지급의 안정성과 성장배당 데이터 가져오는 중안정적인 배당: APMT Luxembourg 시장에서 주목할만한 배당금을 지급하지 않으므로 지급이 안정적인지 확인할 필요가 없습니다.배당금 증가: APMT Luxembourg 시장에서 주목할만한 배당금을 지급하지 않으므로 지급액이 증가하는지 확인할 필요가 없습니다.배당 수익률 vs 시장AP Memory Technology 배당 수익률 vs 시장APMT의 배당 수익률은 시장과 어떻게 비교되나요?구분배당 수익률회사 (APMT)0.7%시장 하위 25% (LU)0%시장 상위 25% (LU)0%업계 평균 (Semiconductor)0%분석가 예측 (APMT) (최대 3년)3.6%주목할만한 배당금: APMT 의 배당금( 0.73% )은 Luxembourg 시장에서 배당금 지급자의 하위 25%( 1.99% )와 비교해 주목할 만하지 않습니다.고배당: APMT 의 배당금( 0.73% )은 Luxembourg 시장에서 배당금 지급자의 상위 25%( 5.41% )와 비교해 낮습니다.주주 대상 이익 배당수익 보장: APMT Luxembourg 시장에서 주목할만한 배당금을 지급하지 않습니다.주주 현금 배당현금 흐름 범위: APMT Luxembourg 시장에서 주목할만한 배당금을 지급하지 않습니다.높은 배당을 제공하는 우량 기업 찾기7D1Y7D1Y7D1YLU 시장에서 배당이 강한 기업.View Management기업 분석 및 재무 데이터 상태데이터최종 업데이트 (UTC 시간)기업 분석2026/05/24 23:36종가2026/05/22 00:00수익2026/03/31연간 수익2025/12/31데이터 소스당사의 기업 분석에 사용되는 데이터는 S&P Global Market Intelligence LLC에서 제공됩니다. 아래 데이터는 이 보고서를 생성하기 위해 분석 모델에서 사용됩니다. 데이터는 정규화되므로 소스가 제공된 후 지연이 발생할 수 있습니다.패키지데이터기간미국 소스 예시 *기업 재무제표10년손익계산서현금흐름표대차대조표SEC 양식 10-KSEC 양식 10-Q분석가 컨센서스 추정치+3년재무 예측분석가 목표주가분석가 리서치 보고서Blue Matrix시장 가격30년주가배당, 분할 및 기타 조치ICE 시장 데이터SEC 양식 S-1지분 구조10년주요 주주내부자 거래SEC 양식 4SEC 양식 13D경영진10년리더십 팀이사회SEC 양식 10-KSEC 양식 DEF 14A주요 개발10년회사 공시SEC 양식 8-K* 미국 증권에 대한 예시이며, 비(非)미국 증권에는 해당 국가의 규제 서식 및 자료원을 사용합니다.별도로 명시되지 않는 한 모든 재무 데이터는 연간 기간을 기준으로 하지만 분기별로 업데이트됩니다. 이를 TTM(최근 12개월) 또는 LTM(지난 12개월) 데이터라고 합니다. 자세히 알아보기.분석 모델 및 스노우플레이크이 보고서를 생성하는 데 사용된 분석 모델에 대한 자세한 내용은 당사의 Github 페이지에서 확인하실 수 있습니다. 또한 보고서 활용 방법에 대한 가이드와 YouTube 튜토리얼도 제공합니다.Simply Wall St 분석 모델을 설계하고 구축한 세계적 수준의 팀에 대해 알아보세요.산업 및 섹터 지표산업 및 섹터 지표는 Simply Wall St가 6시간마다 계산하며, 프로세스에 대한 자세한 내용은 Github에서 확인할 수 있습니다.분석가 소스AP Memory Technology Corporation는 4명의 분석가가 다루고 있습니다. 이 중 2명의 분석가가 우리 보고서에 입력 데이터로 사용되는 매출 또는 수익 추정치를 제출했습니다. 분석가의 제출 자료는 하루 종일 업데이트됩니다.분석가기관Liyen ChenCapital Securities CorporationWei Lun YangJ.P. MorganDaniel YenMorgan Stanley1명의 분석가 더 보기
공시 • Mar 02AP Memory Technology Corporation Announces Cash Dividend for the Year Ended December 31, 2024AP Memory Technology Corporation announced cash dividend of TWD 7 per share for the year ended December 31, 2024. Total amount of cash distributed to shareholders is TWD 1,137,179,624. Par value of common stock is TWD 5 per share.
공시 • Feb 15AP Memory Technology Corporation to Report Fiscal Year 2025 Results on Feb 26, 2026AP Memory Technology Corporation announced that they will report fiscal year 2025 results on Feb 26, 2026
공시 • Dec 29AP Memory Technology Corporation, Annual General Meeting, May 08, 2026AP Memory Technology Corporation, Annual General Meeting, May 08, 2026. Location: 2 floor no,3, t`ai yuan 1st st., jhubei city, hsinchu county Taiwan
공시 • Dec 18AP Memory Broadens S-SiCap™? Technology Deployment to Support Evolving Ai and Hpc NeedsAP Memory announced further advancements in its S-SiCapTM (Stack Silicon Capacitor) product line to address the increasing integration demands of AI servers and high-performance computing (HPC) systems. The S-SiCapTM portfolio includes two product categories --disc discrete silicon capacitors and interposers with silicon capacitors -- designed to support different system architectures and diverse application requirements. The discrete silicon capacitors, S-SiCapTM Gen4, achieves a capacitance density of 3.8 mF/mm2, an increase of more than 50% over the previous generation. To meet the growing demand for higher performance and power efficiency in AI servers and HPC systems, S-SiCapTMGen4 is the first to adopt embedded substrate packaging and is currently in the sampling and process validation stage. Mass production will be introduced progressively starting in 2026. Meanwhile, the S-SiCapTM Interposer utilizes a silicon wafer as its substrate, embedding high-density silicon capacitors within the interposer. This significantly enhances signal integrity and power stability for high-speed I/O applications such as die-to-die, SerDes, and HBM. In collaboration with supply-chain partners, AP Memory has introduced a reticle-stitching technology to enlarge interposer die area allowing more IC chiplets to meet the growing demand for higher-integration advanced packaging solutions. The S-SiCap™? Interposer has completed customer packaging and reliability validation, entering four-reticle mass production at the end of Third Quarter'25. Additional development projects are currently underway.
공시 • Sep 10AP Memory Technology Corp. Launches ApSRAM - A New Low-Power and High-Performance PSRAMAP Memory announced that its next-generation PSRAM--ApSRAM (Attached-pSRAM)-- has successfully passed customer validation and is scheduled to begin mass production by the end of the year. ApSRAMTM is an advanced version of AP Memory's PSRAM (Pseudo Static Random Access Memory), featuring a new architecture optimized for edge computing and IoT applications. ApSRAMTM delivers a powerful combination of low power consumption, low latency, and high performance. ApSRAMTM adopts a more intuitive control interface that eliminates the need for complex signal calibration, while still effectively supporting higher bandwidth requirements. Compared with conventional PSRAM, ApSRAMTM delivers up to four times the bandwidth and reduces dynamic power consumption to just one-fifth, making it particularly suitable for battery-sensitive devices such as wearables and edge computing applications, where both low power consumption and real-time data exchange are essential. ApSRAMTM enables SoCs to scale memory capacity without requiring redesign, offering density options from 128Mb to 2Gb. It supports I/O voltages from 0.6V to 1.1V, ensuring compatibility with a wide range of logic processes and simplifying system integration. The first ApSRAMTM product is now sampling and will enter mass production by year-end. AP Memory also plans to roll out additional density options to meet the evolving requirements of emerging applications and diverse market needs.
공시 • Apr 25AP Memory Technology Corporation to Report Q1, 2025 Results on May 02, 2025AP Memory Technology Corporation announced that they will report Q1, 2025 results on May 02, 2025
공시 • Mar 02AP Memory Technology Corporation Announces Cash Dividend for the Year Ended December 31, 2024AP Memory Technology Corporation announced cash dividend of TWD 7 per share for the year ended December 31, 2024. Total amount of cash distributed to shareholders is TWD 1,137,179,624. Par value of common stock is TWD 5 per share.
공시 • Feb 20AP Memory Technology Corporation to Report Fiscal Year 2024 Results on Feb 27, 2025AP Memory Technology Corporation announced that they will report fiscal year 2024 results on Feb 27, 2025
공시 • Dec 30AP Memory Technology Corporation, Annual General Meeting, Apr 30, 2025AP Memory Technology Corporation, Annual General Meeting, Apr 30, 2025. Location: 2 floor no,3, t`ai yuan 1st st., jhubei city, hsinchu county Taiwan
공시 • Dec 28Ap Memory Technology Corporation Announces Compensation Committee ChangesAP Memory Technology Corporation announced Compensation Committee Changes. Name of the previous position holder: Lan, Ching-Yao. Resume of the previous position holder: Supervisor of President Co. Ltd. Name of the new position holder: Ken Chen. Resume of the new position holder: Brillnics (Taiwan) Inc., Business Director, Global Unichip Corporation, General Manager Taiwan Semiconductor Manufacturing Company Limited, Senior Director. Effective date of the new member is January 1,2025. The resignation will be effective on December 31, 2024. The term of appointment for the new member will begin on the date of appointment and continue until the expiration of the current Board of Directors' term.
공시 • Oct 23AP Memory Technology Corporation to Report Q3, 2024 Results on Oct 30, 2024AP Memory Technology Corporation announced that they will report Q3, 2024 results on Oct 30, 2024
공시 • Oct 22+ 2 more updatesAP Memory Technology Corporation Announces the Reassign the Juridical Person Director RepresentativeAP Memory Technology Corporation Announced the reassign the juridical person director representative. Name of legal person: Shanyi Investment Co. Ltd. Name of the previous position holder: Liu, Chin-Hung. Resume of the previous position holder: Senior Vice President of the Company. Name of the new position holder: Yeh, Jui-Pin. Resume of the new position holder: Independent Director of the Company. Reason for the change: Juristic person director re-appoints representative. Effective date of the new appointment of October 21, 2024.
공시 • Jul 24AP Memory Technology Corporation to Report Q2, 2024 Results on Jul 31, 2024AP Memory Technology Corporation announced that they will report Q2, 2024 results on Jul 31, 2024
공시 • Apr 28AP Memory Technology Corporation to Report Q1, 2024 Results on May 03, 2024AP Memory Technology Corporation announced that they will report Q1, 2024 results on May 03, 2024
공시 • Mar 16AP Memory Technology Corporation Announces New Generation Stack Silicon Capacitor (S-Sicap) Gen3 Passed Customer ValidationAP Memory Technology Corporation announced that the new generation stack silicon capacitor (S-SiCapTM) Gen3 has passed customer validation. S-SiCapTM is a high capacitance density and very low profile (<100um thin) silicon capacitor that can be integrated with System-on-Chip (SoC) with advanced packaging processes. The product can also be customized to meet the application requirements of high-end smartphones and High-Performance Computing (HPC) chips. AP Memory's S-SiCapTM uses a stacked capacitor, offering higher capacitance density, smaller size and thinner form factor compared to deep trench capacitors. The capacitance density of S-SiCapTM Gen3 can reach 2.5uF/mm2, with a maximum operating voltage of 1.2V and demonstrate excellent temperature and voltage stability. Additionally, it has low equivalent series inductance (ESL) and low equivalent series resistance (ESR), providing outstanding voltage stability during high-frequency operation. S-SiCapTM provides low profile and customizable product dimensions. In advanced packaging processes, it can meet various integration applications and be placed closer to SoC. For example: S-SiCapTM on the landside, S-SiCapTM embedded in package substrate, S-SiCapTM for 2.5D packaging, and S-SiCapTM in an interposer. AP Memory's President, Hong Chih-Hsun, notes that considering the trend of high-end mobile phones and HPC applications, SoCs need to deliver higher performance. However, this may come with increased power consumption and voltage instability. If customers aim for stable voltage operation in these applications, they will need more robust capacitor technology. AP Memory's S-SiCapTM Gen3 surpasses traditional capacitor technology by providing higher capacitance density, lower profile, and greater application versatility; all of which significantly enhance SoC performance in advanced packaging processes.
공시 • Mar 03AP Memory Technology Corporation, Annual General Meeting, May 27, 2024AP Memory Technology Corporation, Annual General Meeting, May 27, 2024. Location: No. 88, Zhuangjing 1st Rd., Hsinchu County 302 Zhubei Taiwan Agenda: To report the business of 2023; to consider the 2023 Audit Committee's Review Report; to consider report 2023 employees' profit sharing bonus and directors' compensation; to consider report 2023 earnings distribution; to accept the 2023 Business Report and Financial Statements; to accept the proposal for distribution of 2023 earnings; to consider amendment to the Company's Procedures for the Election of the Directors; to discuss to approve the lifting of non-competition restrictions for directors and their representatives; and to consider other matters.