View ValuationLasertec 将来の成長Future 基準チェック /36Lasertec利益と収益がそれぞれ年間14.5%と14%増加すると予測されています。EPS は年間 増加すると予想されています。自己資本利益率は 3 年後に33.2% 14.5%なると予測されています。主要情報14.5%収益成長率14.49%EPS成長率Semiconductor 収益成長26.1%収益成長率14.0%将来の株主資本利益率33.21%アナリストカバレッジGood最終更新日05 Jun 2026今後の成長に関する最新情報お知らせ • Jan 30+ 1 more updateLasertec Corporation Revises Consolidated Earnings Guidance for the Fiscal Year Ending June 30, 2026Lasertec Corporation revised consolidated earnings guidance for the fiscal year ending June 30, 2026. For the year, the company now expects net sales of JPY 220,000 million against previous guidance of JPY 200,000 million; operating income of JPY 100,000 million against previous guidance of JPY 85,000 million; Net income attributable to owners of parents of JPY 72,000 million against previous guidance of JPY 60,000 million and net income per share of JPY 801.89 against previous guidance of JPY 665.27. Reason for the revision: The company has revised the full-year forecast for the fiscal year ending June 30, 2026, considering customer acceptance of some products occurring earlier than expected and the trend of foreign exchange fluctuations. The assumed exchange rate for the forecast has been revised to 145 yen/USD (the previous assumption was 135 yen/USD).お知らせ • Nov 01Lasertec Corporation Provides Consolidated Earnings Guidance for the Year Ending June 30, 2026Lasertec Corporation provided consolidated earnings guidance for the year ending June 30, 2026. For the year, the company expects net sales of JPY 200,000 million; operating income of JPY 85,000 million; Net income attributable to owners of parents of 60,000 million and net income per share of JPY 665.75.お知らせ • Feb 01+ 2 more updatesLasertec Corporation Provides Consolidated Earnings Guidance for the Fiscal Year Ending June 30, 2024Lasertec Corporation provided consolidated earnings guidance for the fiscal year ending June 30, 2024. For the year, the company expects net sales of JPY 195,000 million, operating income of JPY 67,000 million, net income attributable to owners of parent of JPY 67,000 million and net income per share of JPY 543.32.すべての更新を表示Recent updatesお知らせ • Mar 13Lasertec Corporation to Report Q3, 2026 Results on Apr 30, 2026Lasertec Corporation announced that they will report Q3, 2026 results on Apr 30, 2026お知らせ • Jan 30+ 1 more updateLasertec Corporation Revises Consolidated Earnings Guidance for the Fiscal Year Ending June 30, 2026Lasertec Corporation revised consolidated earnings guidance for the fiscal year ending June 30, 2026. For the year, the company now expects net sales of JPY 220,000 million against previous guidance of JPY 200,000 million; operating income of JPY 100,000 million against previous guidance of JPY 85,000 million; Net income attributable to owners of parents of JPY 72,000 million against previous guidance of JPY 60,000 million and net income per share of JPY 801.89 against previous guidance of JPY 665.27. Reason for the revision: The company has revised the full-year forecast for the fiscal year ending June 30, 2026, considering customer acceptance of some products occurring earlier than expected and the trend of foreign exchange fluctuations. The assumed exchange rate for the forecast has been revised to 145 yen/USD (the previous assumption was 135 yen/USD).お知らせ • Dec 12Lasertec Corporation to Report Q2, 2026 Results on Jan 30, 2026Lasertec Corporation announced that they will report Q2, 2026 results on Jan 30, 2026お知らせ • Nov 01Lasertec Corporation Provides Consolidated Earnings Guidance for the Year Ending June 30, 2026Lasertec Corporation provided consolidated earnings guidance for the year ending June 30, 2026. For the year, the company expects net sales of JPY 200,000 million; operating income of JPY 85,000 million; Net income attributable to owners of parents of 60,000 million and net income per share of JPY 665.75.お知らせ • Aug 07+ 1 more updateLasertec Corporation, Annual General Meeting, Sep 26, 2025Lasertec Corporation, Annual General Meeting, Sep 26, 2025.お知らせ • Mar 26Lasertec Corporation Appoints Hiroki Miyai as Executive Officer, Effective April 1, 2025Lasertec Corporation announced the appointment of Hiroki Miyai as Executive Officer concurrently, General Manager, Technology Department 5, previously he was General Manager,Technology Department 5, Effective April 1, 2025.お知らせ • Mar 15+ 2 more updatesLasertec Corporation to Report Q3, 2025 Results on Apr 28, 2025Lasertec Corporation announced that they will report Q3, 2025 results on Apr 28, 2025お知らせ • Jan 03Lasertec Corporation to Report Q2, 2025 Results on Jan 31, 2025Lasertec Corporation announced that they will report Q2, 2025 results on Jan 31, 2025お知らせ • Sep 24Lasertec Releases SICA108, SiC Wafer Inspection and Review SystemLasertec Corporation announced the release of SICA108, the latest model of its SiC wafer inspection and review systems. Featuring both surface and photoluminescence (PL) inspection capabilities in one body, SICA108 enables customers to concurrently perform high-speed inspection and high-accuracy classification of surface defects as well as crystallographic defects. SiC power devices are used in a variety of applications, including electric vehicles, air conditioners, solar cells, and railway cars, and facilitate the realization of a carbon-neutral society. However, SiC wafer production processes are technically demanding, and there are still many defects that impact device yields. It therefore remains a challenge to manufacture high-quality SiC wafers stably at a lower cost. Lasertec has released SICA108 to help overcome this challenge. Renewing the inspection optics from SICA88, the current de facto standard tool widely used among many customers, SICA108 provides higher throughput and improved performance in quality analysis of SiC wafers with a lower cost of ownership. Like its predecessor, SICA108 performs surface inspection for detecting scratches, crystal defects, and particles on the wafer surface and PL inspection for detecting basal plane dislocations (BPD) inside Epi layers and stacking faults (SF), concurrently and with high sensitivity. It also features a high-accuracy defect classification capability based on proprietary deep learning algorithm to enable the early detection and analysis of killer defects. It is also compatible with various automation systems used in smart fabs, such as automatic guided vehicles (AGV) and overhead hoist transports (OHT). Lasertec will continue to pursue the development of defect inspection technologies to address customer needs and contribute to the improvement of power device quality and productivity. Features: Concurrent inspection of surface defects and BPD/SF at high speed and with high sensitivity. Detailed classification of various defect types using high-accuracy Automatic Defect Classification (ADC) and high-resolution review images. Compatible with various automation systems, including AGV and OHT. Applications: Incoming and outgoing inspection of SiC bare wafers and SiC Epi wafers. Monitoring of SiC epitaxial growth processes. Monitoring of SiC polishing processes. Management of SiC device manufacturing processes.お知らせ • May 03Lasertec Corporation Announces Chief Executive Officer Changes, as of July 1, 2024Lasertec Corporation announced that it has resolved at the board of directors meeting held on April 30, 2024 to make changes in its representative directors and executive officers as follows (as of July 1, 2024): Osamu Okabayashi: Previous position: Representative Director, President & Chief Executive Officer; New position: Representative Director, Chairman & Executive Officer. Tetsuya Sendoda: Previous position: Director, Vice President & Executive Officer concurrently, Chief Sales Officer; New position: Chief Executive Officer. Resume of New Representative Director: Tetsuya Sendoda (April 26, 1977); Career Summary: Jan. 2008, Joined Lasertec Corporation; June 2020, General Manager, Technology Department 2; July 2022, Sales Officer; General Manager, Technology Department 2; and General Manager, Solution Sales Department 1; Sept. 2022 Executive Officer; Sales Officer; General Manager, Technology Department 2; and General Manager, Solution Sales Department 1; April 2023 Executive Officer; Sales Officer; and General Manager, Solution Sales Department 1; Sept. 2023 Director, Vice President & Executive Officer (current); and Chief Sales Officer (current).お知らせ • Mar 08+ 2 more updatesLasertec Corporation to Report Q1, 2025 Results on Oct 31, 2024Lasertec Corporation announced that they will report Q1, 2025 results on Oct 31, 2024お知らせ • Feb 11Lasertec Corporation to Report Q3, 2024 Results on Apr 30, 2024Lasertec Corporation announced that they will report Q3, 2024 results on Apr 30, 2024お知らせ • Feb 01+ 2 more updatesLasertec Corporation Provides Consolidated Earnings Guidance for the Fiscal Year Ending June 30, 2024Lasertec Corporation provided consolidated earnings guidance for the fiscal year ending June 30, 2024. For the year, the company expects net sales of JPY 195,000 million, operating income of JPY 67,000 million, net income attributable to owners of parent of JPY 67,000 million and net income per share of JPY 543.32.お知らせ • Nov 25Lasertec Corporation Releases ACTIS “A300” Series Actinic EUV Patterned Mask Inspection SystemLasertec Corporation announced the release of ACTIS A300 series Actinic EUV Patterned Mask Inspection System for High-NA. ACTIS A150 actinic EUV patterned mask inspection system provided by Lasertec has been facilitating the adoption of EUV lithography to high-volume manufacturing. It is renowned for its excellent inspection performance in the industry. The newly released ACTIS A300 is a next-generation model that meets the requirements of manufacturing processes using high-NA EUV lithography to enable the further miniaturization of device geometries. The A300 series uses newly designed optics and high-brightness light source URASHIMA . It achieves a significant improvement in defect detection performance compared to the A150 series. The anamorphic optics used in high-NA lithography have adopted different magnifications of projection in the X and Y directions. Inspection of EUV masks for high-NA lithography, therefore, requires different levels of resolution in the two directions. The A300 series can also be used to inspect EUV masks for the current NA lithography as well as EUV masks for high-NA lithography. Lasertec is dedicated to supporting the needs of leading-edge semiconductor manufacturers, developing unique solutions, and facilitating quality and productivity improvement, thereby contributing to the advancement of the industry. Features: Inspection of EUV masks for high-NA lithography. Inspection of EUV masks for the current NA lithography. High productivity inspection with highly efficient optics and high-brightness light source URASHIMA. Applications: Quality assurance inspection during EUV mask manufacturing processes. Incoming EUV mask inspection and periodic quality assurance inspection at wafer fabs.お知らせ • Nov 01+ 1 more updateLasertec Corporation to Report Q2, 2024 Results on Jan 31, 2024Lasertec Corporation announced that they will report Q2, 2024 results on Jan 31, 2024お知らせ • Aug 08+ 1 more updateLasertec Corporation to Report Q1, 2024 Results on Oct 31, 2023Lasertec Corporation announced that they will report Q1, 2024 results on Oct 31, 2023お知らせ • Jul 25+ 2 more updatesLasertec Corporation Provides Dividend Forecast for the Fiscal Year Ended June 2023Lasertec Corporation provided dividend forecast for the fiscal year ended June 2023. The company revised forecast of year-end dividend to JPY 126 per share against previous guidance of JPY 77 per share.お知らせ • Feb 01+ 3 more updatesLasertec Corporation to Report Fiscal Year 2023 Results on Aug 07, 2023Lasertec Corporation announced that they will report fiscal year 2023 results on Aug 07, 2023お知らせ • Nov 01Lasertec Corporation to Report Q2, 2023 Results on Jan 31, 2023Lasertec Corporation announced that they will report Q2, 2023 results on Jan 31, 2023お知らせ • Aug 06+ 3 more updatesLasertec Corporation Provides Dividend Guidance for the Second Quarter and Year End of the Fiscal Year Ending June 30, 2023Lasertec Corporation provided dividend guidance for the second quarter and year end of the fiscal year ending June 30, 2023. For the quarter, the company expected dividend of JPY 52.00 per share.For the year, the company expected dividend of JPY 77.00 per share.お知らせ • Feb 02+ 1 more updateLasertec Corporation to Report Q3, 2022 Results on Apr 28, 2022Lasertec Corporation announced that they will report Q3, 2022 results on Apr 28, 2022お知らせ • Feb 01+ 2 more updatesLasertec Corporation Provides Year-End Dividend Guidance for the Fiscal Year Ending June 30, 2022Lasertec Corporation provided year-end dividend guidance for the fiscal year ending June 30, 2022. For the year, the company expects to pay year-end dividend of JPY 50.00 per share against JPY 55.00 per share paid for the same period a year ago.お知らせ • Dec 02Lasertec Corporation Launches OPTELICS AI2 Automatic Inspection and Review SystemLasertec has launched OPTELICS AI2, a new type of confocal microscope designed to perform automatic defect inspection and review. AI2 provides high-speed automatic surface defect inspection, defect mapping, and high-magnification defect shape review from a single platform. There has been a rapid increase in demand for semiconductor devices due to growing need for 5G mobile communication, high-performance computing, and other applications. Semiconductor device manufacturers are expected to keep developing new devices with increased performance. For the development of new devices adopting new designs and new materials, various challenges need to be overcome with cross-organizational efforts. The evaluation of prototypes, quality control during production, and process improvement for higher yields are among those challenges. AI2 performs automatic surface defect inspection, defect review, and defect shape 3D profiling on a single platform, serving customer need in various situations of R&D and production. AI2 achieves both high-throughput, high-speed inspection and high-magnification surface shape profiling by integrating Lasertec's core technology in confocal optics, automatic inspection software perfected through the development of various semiconductor-related inspection systems, and newly designed high-speed motion hardware into a system. AI2 conducts AI-based inspection using deep learning and offers advanced inspection functions such as high-precision image classification, patterned sample inspection, and the extraction of specific types of defects. Lasertec is dedicated to addressing customer need and helping customers succeed in various R&D and yield improvement efforts. Automatic defect inspection, high-magnification review, and surface shape profiling on semiconductor wafer from a single platform, serving customer need in various situations of R&D and production. High-speed inspection capability: inspecting a whole 3-inch wafer in 15 minutes with sub-micron sensitivity.High-magnification review capability: high-magnification surface shape profiling available with switching of objective lens. Deep learning-based high-precision image classification, patterned sample inspection, and inspection of specific types of defects. Defect inspection, high-magnification review, and surface shape profiling of transparent samples, such as compound semiconductors and films, without interference of backside reflection. Lasertec providing a complete system including both hardware and software, making customization for specific need, and offering entire system support.業績と収益の成長予測OTCPK:LSRC.F - アナリストの将来予測と過去の財務データ ( )JPY Millions日付収益収益フリー・キャッシュフロー営業活動によるキャッシュ平均アナリスト数6/30/2028333,396116,02078,44580,250136/30/2027271,89693,55875,05067,697146/30/2026227,25475,80276,66369,547143/31/2026252,18188,78168,76670,194N/A12/31/2025250,76787,07995,43596,706N/A9/30/2025268,91194,77982,65885,016N/A6/30/2025251,47784,65275,55177,874N/A3/31/2025225,13970,24950,20753,514N/A12/31/2024247,48580,19616,95420,361N/A9/30/2024202,93860,30414,98617,563N/A6/30/2024213,50659,07629,78533,317N/A3/31/2024230,60466,96928,10830,981N/A12/31/2023192,72154,78036,01540,361N/A9/30/2023174,41447,13537,32041,706N/A6/30/2023152,83246,16420,00340,548N/A3/31/2023116,24332,5662,43924,782N/A12/31/2022108,54928,697-3,16817,578N/A9/30/2022106,99130,014-13,0747,184N/A6/30/202290,37824,850-8,828-3,464N/A3/31/202271,86818,77312,15215,363N/A12/31/202174,94620,6238,92112,017N/A9/30/202166,19317,65213,10218,975N/A6/30/202170,24819,2506,85010,488N/A3/31/202168,91617,990-2,1211,390N/A12/31/202054,85513,5925,5038,981N/A9/30/202050,19512,9956,9688,088N/A6/30/202042,57210,82314,68816,486N/A3/31/202032,8917,94713,04814,807N/A12/31/201931,8807,678N/A3,256N/A9/30/201928,1306,143N/A6,353N/A6/30/201928,7695,933N/A5,800N/A3/31/201926,9965,304N/A7,513N/A12/31/201827,6385,799N/A6,450N/A9/30/201824,7144,952N/A3,013N/A6/30/201821,2524,366N/A2,916N/A3/31/201821,2914,244N/A6,284N/A12/31/201719,0104,031N/A7,259N/A9/30/201718,2143,797N/A4,827N/A6/30/201717,3693,554N/A3,549N/A3/31/201716,5434,218N/A1,166N/A12/31/201617,4084,231N/A1,181N/A9/30/201615,4433,426N/A4,146N/A6/30/201615,2913,227N/A3,083N/A3/31/201614,6962,640N/A2,504N/A12/31/201515,7012,705N/A4,390N/A9/30/201515,1622,626N/A2,535N/A6/30/201515,1872,953N/A1,032N/Aもっと見るアナリストによる今後の成長予測収入対貯蓄率: LSRC.Fの予測収益成長率 (年間14.5% ) は 貯蓄率 ( 3.5% ) を上回っています。収益対市場: LSRC.Fの収益 ( 14.5% ) US市場 ( 16.8% ) よりも低い成長が予測されています。高成長収益: LSRC.Fの収益は増加すると予測されていますが、大幅には増加しません。収益対市場: LSRC.Fの収益 ( 14% ) US市場 ( 11.8% ) よりも速いペースで成長すると予測されています。高い収益成長: LSRC.Fの収益 ( 14% ) 20%よりも低い成長が予測されています。一株当たり利益成長率予想将来の株主資本利益率将来のROE: LSRC.Fの 自己資本利益率 は、3年後には高くなると予測されています ( 33.2 %)成長企業の発掘7D1Y7D1Y7D1YSemiconductors 業界の高成長企業。View Past Performance企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/06/07 05:42終値2026/06/02 00:00収益2026/03/31年間収益2025/06/30データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレーク本レポートを生成するために使用した分析モデルの詳細は当社のGithubページでご覧いただけます。また、レポートの使用方法に関するガイドやYoutubeのチュートリアルも掲載しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋Lasertec Corporation 14 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。29 アナリスト機関Warren LauAletheia Analyst Network LimitedStacy RasgonBernsteinHao DaiBernstein26 その他のアナリストを表示
お知らせ • Jan 30+ 1 more updateLasertec Corporation Revises Consolidated Earnings Guidance for the Fiscal Year Ending June 30, 2026Lasertec Corporation revised consolidated earnings guidance for the fiscal year ending June 30, 2026. For the year, the company now expects net sales of JPY 220,000 million against previous guidance of JPY 200,000 million; operating income of JPY 100,000 million against previous guidance of JPY 85,000 million; Net income attributable to owners of parents of JPY 72,000 million against previous guidance of JPY 60,000 million and net income per share of JPY 801.89 against previous guidance of JPY 665.27. Reason for the revision: The company has revised the full-year forecast for the fiscal year ending June 30, 2026, considering customer acceptance of some products occurring earlier than expected and the trend of foreign exchange fluctuations. The assumed exchange rate for the forecast has been revised to 145 yen/USD (the previous assumption was 135 yen/USD).
お知らせ • Nov 01Lasertec Corporation Provides Consolidated Earnings Guidance for the Year Ending June 30, 2026Lasertec Corporation provided consolidated earnings guidance for the year ending June 30, 2026. For the year, the company expects net sales of JPY 200,000 million; operating income of JPY 85,000 million; Net income attributable to owners of parents of 60,000 million and net income per share of JPY 665.75.
お知らせ • Feb 01+ 2 more updatesLasertec Corporation Provides Consolidated Earnings Guidance for the Fiscal Year Ending June 30, 2024Lasertec Corporation provided consolidated earnings guidance for the fiscal year ending June 30, 2024. For the year, the company expects net sales of JPY 195,000 million, operating income of JPY 67,000 million, net income attributable to owners of parent of JPY 67,000 million and net income per share of JPY 543.32.
お知らせ • Mar 13Lasertec Corporation to Report Q3, 2026 Results on Apr 30, 2026Lasertec Corporation announced that they will report Q3, 2026 results on Apr 30, 2026
お知らせ • Jan 30+ 1 more updateLasertec Corporation Revises Consolidated Earnings Guidance for the Fiscal Year Ending June 30, 2026Lasertec Corporation revised consolidated earnings guidance for the fiscal year ending June 30, 2026. For the year, the company now expects net sales of JPY 220,000 million against previous guidance of JPY 200,000 million; operating income of JPY 100,000 million against previous guidance of JPY 85,000 million; Net income attributable to owners of parents of JPY 72,000 million against previous guidance of JPY 60,000 million and net income per share of JPY 801.89 against previous guidance of JPY 665.27. Reason for the revision: The company has revised the full-year forecast for the fiscal year ending June 30, 2026, considering customer acceptance of some products occurring earlier than expected and the trend of foreign exchange fluctuations. The assumed exchange rate for the forecast has been revised to 145 yen/USD (the previous assumption was 135 yen/USD).
お知らせ • Dec 12Lasertec Corporation to Report Q2, 2026 Results on Jan 30, 2026Lasertec Corporation announced that they will report Q2, 2026 results on Jan 30, 2026
お知らせ • Nov 01Lasertec Corporation Provides Consolidated Earnings Guidance for the Year Ending June 30, 2026Lasertec Corporation provided consolidated earnings guidance for the year ending June 30, 2026. For the year, the company expects net sales of JPY 200,000 million; operating income of JPY 85,000 million; Net income attributable to owners of parents of 60,000 million and net income per share of JPY 665.75.
お知らせ • Aug 07+ 1 more updateLasertec Corporation, Annual General Meeting, Sep 26, 2025Lasertec Corporation, Annual General Meeting, Sep 26, 2025.
お知らせ • Mar 26Lasertec Corporation Appoints Hiroki Miyai as Executive Officer, Effective April 1, 2025Lasertec Corporation announced the appointment of Hiroki Miyai as Executive Officer concurrently, General Manager, Technology Department 5, previously he was General Manager,Technology Department 5, Effective April 1, 2025.
お知らせ • Mar 15+ 2 more updatesLasertec Corporation to Report Q3, 2025 Results on Apr 28, 2025Lasertec Corporation announced that they will report Q3, 2025 results on Apr 28, 2025
お知らせ • Jan 03Lasertec Corporation to Report Q2, 2025 Results on Jan 31, 2025Lasertec Corporation announced that they will report Q2, 2025 results on Jan 31, 2025
お知らせ • Sep 24Lasertec Releases SICA108, SiC Wafer Inspection and Review SystemLasertec Corporation announced the release of SICA108, the latest model of its SiC wafer inspection and review systems. Featuring both surface and photoluminescence (PL) inspection capabilities in one body, SICA108 enables customers to concurrently perform high-speed inspection and high-accuracy classification of surface defects as well as crystallographic defects. SiC power devices are used in a variety of applications, including electric vehicles, air conditioners, solar cells, and railway cars, and facilitate the realization of a carbon-neutral society. However, SiC wafer production processes are technically demanding, and there are still many defects that impact device yields. It therefore remains a challenge to manufacture high-quality SiC wafers stably at a lower cost. Lasertec has released SICA108 to help overcome this challenge. Renewing the inspection optics from SICA88, the current de facto standard tool widely used among many customers, SICA108 provides higher throughput and improved performance in quality analysis of SiC wafers with a lower cost of ownership. Like its predecessor, SICA108 performs surface inspection for detecting scratches, crystal defects, and particles on the wafer surface and PL inspection for detecting basal plane dislocations (BPD) inside Epi layers and stacking faults (SF), concurrently and with high sensitivity. It also features a high-accuracy defect classification capability based on proprietary deep learning algorithm to enable the early detection and analysis of killer defects. It is also compatible with various automation systems used in smart fabs, such as automatic guided vehicles (AGV) and overhead hoist transports (OHT). Lasertec will continue to pursue the development of defect inspection technologies to address customer needs and contribute to the improvement of power device quality and productivity. Features: Concurrent inspection of surface defects and BPD/SF at high speed and with high sensitivity. Detailed classification of various defect types using high-accuracy Automatic Defect Classification (ADC) and high-resolution review images. Compatible with various automation systems, including AGV and OHT. Applications: Incoming and outgoing inspection of SiC bare wafers and SiC Epi wafers. Monitoring of SiC epitaxial growth processes. Monitoring of SiC polishing processes. Management of SiC device manufacturing processes.
お知らせ • May 03Lasertec Corporation Announces Chief Executive Officer Changes, as of July 1, 2024Lasertec Corporation announced that it has resolved at the board of directors meeting held on April 30, 2024 to make changes in its representative directors and executive officers as follows (as of July 1, 2024): Osamu Okabayashi: Previous position: Representative Director, President & Chief Executive Officer; New position: Representative Director, Chairman & Executive Officer. Tetsuya Sendoda: Previous position: Director, Vice President & Executive Officer concurrently, Chief Sales Officer; New position: Chief Executive Officer. Resume of New Representative Director: Tetsuya Sendoda (April 26, 1977); Career Summary: Jan. 2008, Joined Lasertec Corporation; June 2020, General Manager, Technology Department 2; July 2022, Sales Officer; General Manager, Technology Department 2; and General Manager, Solution Sales Department 1; Sept. 2022 Executive Officer; Sales Officer; General Manager, Technology Department 2; and General Manager, Solution Sales Department 1; April 2023 Executive Officer; Sales Officer; and General Manager, Solution Sales Department 1; Sept. 2023 Director, Vice President & Executive Officer (current); and Chief Sales Officer (current).
お知らせ • Mar 08+ 2 more updatesLasertec Corporation to Report Q1, 2025 Results on Oct 31, 2024Lasertec Corporation announced that they will report Q1, 2025 results on Oct 31, 2024
お知らせ • Feb 11Lasertec Corporation to Report Q3, 2024 Results on Apr 30, 2024Lasertec Corporation announced that they will report Q3, 2024 results on Apr 30, 2024
お知らせ • Feb 01+ 2 more updatesLasertec Corporation Provides Consolidated Earnings Guidance for the Fiscal Year Ending June 30, 2024Lasertec Corporation provided consolidated earnings guidance for the fiscal year ending June 30, 2024. For the year, the company expects net sales of JPY 195,000 million, operating income of JPY 67,000 million, net income attributable to owners of parent of JPY 67,000 million and net income per share of JPY 543.32.
お知らせ • Nov 25Lasertec Corporation Releases ACTIS “A300” Series Actinic EUV Patterned Mask Inspection SystemLasertec Corporation announced the release of ACTIS A300 series Actinic EUV Patterned Mask Inspection System for High-NA. ACTIS A150 actinic EUV patterned mask inspection system provided by Lasertec has been facilitating the adoption of EUV lithography to high-volume manufacturing. It is renowned for its excellent inspection performance in the industry. The newly released ACTIS A300 is a next-generation model that meets the requirements of manufacturing processes using high-NA EUV lithography to enable the further miniaturization of device geometries. The A300 series uses newly designed optics and high-brightness light source URASHIMA . It achieves a significant improvement in defect detection performance compared to the A150 series. The anamorphic optics used in high-NA lithography have adopted different magnifications of projection in the X and Y directions. Inspection of EUV masks for high-NA lithography, therefore, requires different levels of resolution in the two directions. The A300 series can also be used to inspect EUV masks for the current NA lithography as well as EUV masks for high-NA lithography. Lasertec is dedicated to supporting the needs of leading-edge semiconductor manufacturers, developing unique solutions, and facilitating quality and productivity improvement, thereby contributing to the advancement of the industry. Features: Inspection of EUV masks for high-NA lithography. Inspection of EUV masks for the current NA lithography. High productivity inspection with highly efficient optics and high-brightness light source URASHIMA. Applications: Quality assurance inspection during EUV mask manufacturing processes. Incoming EUV mask inspection and periodic quality assurance inspection at wafer fabs.
お知らせ • Nov 01+ 1 more updateLasertec Corporation to Report Q2, 2024 Results on Jan 31, 2024Lasertec Corporation announced that they will report Q2, 2024 results on Jan 31, 2024
お知らせ • Aug 08+ 1 more updateLasertec Corporation to Report Q1, 2024 Results on Oct 31, 2023Lasertec Corporation announced that they will report Q1, 2024 results on Oct 31, 2023
お知らせ • Jul 25+ 2 more updatesLasertec Corporation Provides Dividend Forecast for the Fiscal Year Ended June 2023Lasertec Corporation provided dividend forecast for the fiscal year ended June 2023. The company revised forecast of year-end dividend to JPY 126 per share against previous guidance of JPY 77 per share.
お知らせ • Feb 01+ 3 more updatesLasertec Corporation to Report Fiscal Year 2023 Results on Aug 07, 2023Lasertec Corporation announced that they will report fiscal year 2023 results on Aug 07, 2023
お知らせ • Nov 01Lasertec Corporation to Report Q2, 2023 Results on Jan 31, 2023Lasertec Corporation announced that they will report Q2, 2023 results on Jan 31, 2023
お知らせ • Aug 06+ 3 more updatesLasertec Corporation Provides Dividend Guidance for the Second Quarter and Year End of the Fiscal Year Ending June 30, 2023Lasertec Corporation provided dividend guidance for the second quarter and year end of the fiscal year ending June 30, 2023. For the quarter, the company expected dividend of JPY 52.00 per share.For the year, the company expected dividend of JPY 77.00 per share.
お知らせ • Feb 02+ 1 more updateLasertec Corporation to Report Q3, 2022 Results on Apr 28, 2022Lasertec Corporation announced that they will report Q3, 2022 results on Apr 28, 2022
お知らせ • Feb 01+ 2 more updatesLasertec Corporation Provides Year-End Dividend Guidance for the Fiscal Year Ending June 30, 2022Lasertec Corporation provided year-end dividend guidance for the fiscal year ending June 30, 2022. For the year, the company expects to pay year-end dividend of JPY 50.00 per share against JPY 55.00 per share paid for the same period a year ago.
お知らせ • Dec 02Lasertec Corporation Launches OPTELICS AI2 Automatic Inspection and Review SystemLasertec has launched OPTELICS AI2, a new type of confocal microscope designed to perform automatic defect inspection and review. AI2 provides high-speed automatic surface defect inspection, defect mapping, and high-magnification defect shape review from a single platform. There has been a rapid increase in demand for semiconductor devices due to growing need for 5G mobile communication, high-performance computing, and other applications. Semiconductor device manufacturers are expected to keep developing new devices with increased performance. For the development of new devices adopting new designs and new materials, various challenges need to be overcome with cross-organizational efforts. The evaluation of prototypes, quality control during production, and process improvement for higher yields are among those challenges. AI2 performs automatic surface defect inspection, defect review, and defect shape 3D profiling on a single platform, serving customer need in various situations of R&D and production. AI2 achieves both high-throughput, high-speed inspection and high-magnification surface shape profiling by integrating Lasertec's core technology in confocal optics, automatic inspection software perfected through the development of various semiconductor-related inspection systems, and newly designed high-speed motion hardware into a system. AI2 conducts AI-based inspection using deep learning and offers advanced inspection functions such as high-precision image classification, patterned sample inspection, and the extraction of specific types of defects. Lasertec is dedicated to addressing customer need and helping customers succeed in various R&D and yield improvement efforts. Automatic defect inspection, high-magnification review, and surface shape profiling on semiconductor wafer from a single platform, serving customer need in various situations of R&D and production. High-speed inspection capability: inspecting a whole 3-inch wafer in 15 minutes with sub-micron sensitivity.High-magnification review capability: high-magnification surface shape profiling available with switching of objective lens. Deep learning-based high-precision image classification, patterned sample inspection, and inspection of specific types of defects. Defect inspection, high-magnification review, and surface shape profiling of transparent samples, such as compound semiconductors and films, without interference of backside reflection. Lasertec providing a complete system including both hardware and software, making customization for specific need, and offering entire system support.