お知らせ • Jun 23
United Microelectronics Corporation Announces Cash Dividend, Payable on July 30, 2026 United Microelectronics Corporation announced an adjustment to the cash dividend per share. Type and monetary amount of original dividend distribution: Cash dividend TWD 32,704,164,009, each common share is entitled to receive TWD 2.60. Type and monetary amount of dividend distribution after the change: Cash dividend TWD 32,704,164,009, each common share is entitled to receive TWD 2.60808262. Reason for the change: Due to the Company’s share repurchases and the cancellation of restricted stock awards, the number of outstanding common shares has changed accordingly, resulting in an adjustment to the cash dividend per share. Ex-rights (ex-dividend) trading date: July 8, 2026. Ex-rights (ex-dividend) record date: July 14, 2026. Payment date of common stock cash dividend distribution: July 30, 2026. お知らせ • Feb 26
United Microelectronics Corporation, Annual General Meeting, May 27, 2026 United Microelectronics Corporation, Annual General Meeting, May 27, 2026. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwan お知らせ • Feb 24
United Microelectronics Corporation Announces Change of Representative of Juristic-Person Director, Effective February 24, 2026 United Microelectronics Corporation announced a change of representative of juristic-person director for Hsun Chieh Investment Co. Ltd. The previous position holder, SC Chien, served as Director of UMC. The new position holder, Ming Hsu, is Executive Vice President of UMC. The reason for the change is replacement of the representative. The original term is from May 30, 2024 to May 29, 2027. The effective date of the new appointment is February 24, 2026. United Microelectronics Corporation announced the board resolution to convene a 2026 shareholders meeting for United Semiconductor (Xiamen) Co. Ltd. The shareholders meeting date is March 12, 2026. お知らせ • Feb 13
United Microelectronics Corporation to Report Q4, 2025 Results on Feb 25, 2026 United Microelectronics Corporation announced that they will report Q4, 2025 results on Feb 25, 2026 お知らせ • Jan 15
Silicon Storage Technology and United Microelectronics Corporation Announce Immediate Availability of 28nm SuperFlash®? Gen 4 Automotive Grade 1 Platform Silicon Storage Technology®? (SST®?) and United Microelectronics Corporation announced that they have completed full qualification and release to production of SST's embedded SuperFlash®? Gen 4 (ESF4) with full automotive grade 1 (AG1) capability on UMC's 28HPC+ foundry process platform. SST developed ESF4 in close partnership with UMC to deliver enhanced embedded non-volatile memory (eNVM) performance and demonstrated reliability for automotive controllers while simultaneously significantly reducing the number of additional masking steps versus other foundries' 28nm High-k/Metal-Gate Stack (HKMG) eFlash offerings, bringing customers cost advantages and greater manufacturing efficiency. Customers currently manufacturing automotive controller products using foundry 40nm ESF3 AG1 platforms are encouraged to explore the UMC 28nm ESF4 AG1 platform as they look to scale to the next process node. Key SuperFlash performance and reliability metrics for UMC's 28HPC + ESF4 AG1 platform include: Automotive Electronics Council (AEC) Q-100 Grade 1 qualified for temperatures of -40degC to +150degC (Tj); Read access time < 12.5ns; 100K+ endurance cycles; Data retention of > 10 years @ 125degC; Only 1-bit ECC required; Qualification of 32Mb macro at auto grade 1 conditions: Zero bit failures (no ECC applied); Peak yield reached 100%. Automotive controller shipment volumes continue to rapidly increase year after year, as the transportation industry demands innovative solutions for a widening variety of vehicle applications. お知らせ • Nov 13
Metalenz and United Microelectronics Corporation Bring Breakthrough Face Authentication Solution Polar ID to Mass Production Metalenz and United Microelectronics Corporation announced Metalenz's its breakthrough face authentication solution, Polar ID, is now ready for mass production through UMC. Polar ID is a compact, polarization-based biometric solution that leverages Metalenz's metasurface technology to bring payment-grade security and advanced sensing capabilities to any device, even the most challenging of form factors. UMC manufactures the meta-optic layer using its 40nm process and achieves sensor integration utilizing its wafer-on-wafer bonding technology. Leveraging UMC's 300mm wafer manufacturing capabilities, as well as the qualification of this supply chain, Metalenz is ready to ramp into volume positioning Polar ID for widespread adoption across consumer electronics, mobile, and IoT platforms. With demand for secure and convenient biometrics rapidly expanding across consumer devices and IoT, Polar ID delivers secure face authentication in the smallest, simple form factor, making advanced sensing accessible beyond premium tiers and in places it wasn't previously possible. UMC's state-of-the art 12-inch facilities and comprehensive portfolio of semiconductor manufacturing process technologies have made the foundry partner of choice for some of the most advanced fabless semiconductor companies in the world. お知らせ • Oct 22
UMC Introduces 55Nm BCD Platform to Elevate Power Efficiency for Smartphones, Consumer Electronics, and Automotive Applications United Microelectronics Corporation announced the release of its 55nm Bipolar-CMOS-DMOS (BCD) platform, enabling a new level of performance and power efficiency in next-generation mobile devices, consumer electronics, automotive, and industrial applications. Designed to address the growing complexity of power management in electronic devices, the new 55nm BCD platform delivers smaller chip area, lower power consumption, and superior noise reduction, enabling greater flexibility and reliability in power circuit designs. Combining analog, digital, and power functions on a single chip, BCD technology is widely used in power management and mixed-signal ICs. UMC's new 55nm BCD platform offers comprehensive solutions to serve diversified power IC applications: Non-Epitaxy (Non-EPI) process: A cost-effective solution with unique device architecture, providing power efficiency and analog performance for mobile and consumer devices. Epitaxy (EPI) process: Compliant with the most stringent AEC-Q100 Grade 0 automotive standards, the 55nm EPI solution supports operating voltage up to 150V, enhancing automotive electronic reliability even under extreme environments. Silicon-on-Insulator (SOI) process: Ideal for high-grade automotive and industrial uses, this solution is AEC-Q100 Grade 1 automotive compliant, featuring superior noise reduction, high speeds, and low leakage. The platform also integrated ultra-thick metal (UTM), embedded flash, and resistive random-access memory (RRAM) technologies for enhanced performance and functionalities. UMC now offers one of the industry's most comprehensive and mature BCD portfolios, spanning process nodes from 0.35um, 0.25um, 0.18um, and 0.11um down to 55nm. Leveraging extensive voltage capabilities, broad IP resources, and robust design support, UMC delivers differentiated solutions that align with customers' technology roadmaps and enhance their product competitiveness. お知らせ • Jun 04
United Microelectronics Corporation Announces Cash Dividend, Payable on July 16, 2025 United Microelectronics Corporation at its board meeting held on June 04, 2025 resolved to adjust cash dividend ratio. Type and monetary amount of original dividend distribution: Cash dividend TWD 35,787,597,878, each common share is entitled to receive TWD 2.85. Type and monetary amount of dividend distribution after the change: Cash dividend TWD 35,787,597,878, each common share is entitled to receive TWD 2.85016443. Reason for the change: Due to the recall of RSA, the number of outstanding common shares changed accordingly, resulting in the adjustment of cash dividend ratio. Ex-rights (ex-dividend) trading date: June 24, 2025; Ex-rights (ex-dividend) record date: June 30, 2025; Payment date of common stock cash dividend distribution: July 16, 2025. お知らせ • May 01
United Microelectronics Corporation to Report Q4, 2025 Results on Jan 28, 2026 United Microelectronics Corporation announced that they will report Q4, 2025 results on Jan 28, 2026 お知らせ • Apr 02
GlobalFoundries, United Microelectronics Reportedly Consider Merger Taiwan's major chipmaker United Microelectronics Corporation (TWSE:2303) and U.S.-based GlobalFoundries Inc. (NasdaqGS:GFS) are looking into the possibility of a merger, two sources familiar with the matter told Reuters on March 31, 2025. A combined company would establish a larger U.S.-based firm with a global manufacturing footprint spanning Asia, the United States and Europe. The potential deal comes as the U.S. seeks to strengthen its semiconductor supply chain amid rising geopolitical tensions in the Taiwan Strait and increasing competition from China in the mature chip market. The merged company would prioritize research and development investments in the U.S. and could possibly emerge as a viable alternative to Taiwan Semiconductor Manufacturing Co (2330.TW), the world's leading chipmaker. UMC said the "company policy is not to comment on market rumours", while GlobalFoundries did not immediately respond to a Reuters' request for comment. お知らせ • Feb 27
United Microelectronics Corporation, Annual General Meeting, May 28, 2025 United Microelectronics Corporation, Annual General Meeting, May 28, 2025. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwan お知らせ • Feb 19
United Microelectronics Corporation to Report Fiscal Year 2024 Results on Feb 26, 2025 United Microelectronics Corporation announced that they will report fiscal year 2024 results on Feb 26, 2025 お知らせ • Dec 20
Pentamaster Corporation Berhad (KLSE:PENTA), Chen Chu-Wan, Chen Hsin-Yu, Chen Hsin-Tso, MediaTek Inc. (TWSE:2454) and United Microelectronics Corporation (TWSE:2303) agreed to acquire 36.10% stake in Pentamaster International Limited (SEHK:1665) for approximately HKD 810 million. Pentamaster Corporation Berhad (KLSE:PENTA), Chen Chu-Wan, Chen Hsin-Yu, Chen Hsin-Tso, MediaTek Inc. (TWSE:2454) and United Microelectronics Corporation (TWSE:2303) agreed to acquire 36.10% stake in Pentamaster International Limited (SEHK:1665) for approximately HKD 810 million on December 19, 2024. A cash consideration valued at HKD 0.93 per share will be paid by Pentamaster Corporation Berhad, MediaTek Inc. and United Microelectronics Corporation. As part of consideration, HKD 805.8 million is paid towards common equity of Pentamaster International Limited. The transaction will be funded using internal resources. Upon completion, Pentamaster Corporation Berhad will own 71% stake in Pentamaster International Limited. The transaction is subject to approval by regulatory board / committee, approval of offer by target shareholders, subject to court approval and subject to statutory approval. The expected completion of the transaction is June 19, 2025. Altus Capital Limited acted as financial advisor for Pentamaster International Limited. お知らせ • Oct 08
United Microelectronics Corporation to Report Q4, 2024 Results on Jan 21, 2025 United Microelectronics Corporation announced that they will report Q4, 2024 results on Jan 21, 2025 お知らせ • Jun 13
United Microelectronics Corporation Announces Cash Dividend, Payable on July 24, 2024 United Microelectronics Corporation announced cash dividend of TWD 37,587,101,925, each common share is entitled to receive TWD 3.00011747. Ex-rights (ex-dividend) trading date is 2 July 2024. Ex-rights (ex-dividend) record date is July 8, 2024; Payment date of cash dividend distribution is July 24, 2024. お知らせ • May 03
UMC Introduces Industry’s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era United Microelectronics Corporation announced the industry’s first 3D IC solution for RFSOI technology. Available on UMC’s 55nm RFSOI platform, the stacked silicon technology reduces die size by more than 45% without any degradation of radio frequency (RF) performance, enabling customers to efficiently integrate more RF components to address the greater bandwidth requirements of 5G. As mobile device manufacturers pack more frequency bands in newer generations of smartphones, the company’s 3D IC solution for RFSOI addresses the challenge of integrating more RF front-end modules (RF-FEM) - critical components in devices to transmit and receive data – in a device by vertically stacking dies to reduce surface area. RFSOI is the foundry process used for RF chips such as low noise amplifiers, switches, and antenna tuners. Utilizing wafer-to-wafer bonding technology, UMC’s 3D IC solution for RFSOI resolves the common issue of RF interference between stacked dies. The company has received multiple patents for this process, which is now ready for production. UMC offers the most comprehensive RF front-end module IC solutions in the industry, catering to a broad range of applications including mobile, Wi-Fi, automotive, IoT, and satellite communications. With over 500 product tape-outs completed and more than 38 billion RFSOI chips shipped, UMC’s family of RFSOI solutions are available in 8-inch and 12-inch wafers, as well as in a variety of technology nodes from 130nm to 40nm. In addition to RFSOI technologies, UMC’s 6-inch fab (Wavetek Microelectronics Corporation) offers compound semiconductor technologies gallium arsenide (GaAs) and gallium nitride (GaN) as well as RF filters to supplement the needs of RF-FEM applications. お知らせ • Feb 29
United Microelectronics Corporation Approves Cash Dividend for the Year Ended December 31, 2023 United Microelectronics Corporation announced that at its board meeting held on February 27, 2024, approved cash dividend for the year ended December 31, 2023 of TWD 3.00 per share. Total amount of cash distributed to shareholders is TWD 37,587,101,925. お知らせ • Feb 28
United Microelectronics Corporation, Annual General Meeting, May 30, 2024 United Microelectronics Corporation, Annual General Meeting, May 30, 2024, at 09:00 Taipei Standard Time. Location: No. 16, Creation Rd. 1, Hsinchu Science Park Hsinchu City Taiwan Agenda: To consider 2023 business report; to consider audit Committee's report of the 2023 audited financial reports; to consider 2023 distributable compensation for employees and directors; to consider the issuance of the corporate bonds; and to consider other matters.