United Microelectronics（UMC N）株式概要ユナイテッド・マイクロエレクトロニクス・コーポレーションは、台湾、中国、香港、日本、韓国、米国、ヨーロッパ、そして国際的な半導体ウェハー・ファウンドリーとして事業を展開している。 詳細UMC N ファンダメンタル分析スノーフレーク・スコア評価2/6将来の成長3/6過去の実績4/6財務の健全性6/6配当金4/6報酬株価収益率（ 22.9 x）は、 Semiconductor業界平均（ 52.6 x）を下回っています。収益は年間13.03%増加すると予測されています 過去1年間で収益は12.5%増加しました リスク分析株式の流動性は非常に低い 不安定な配当実績 すべてのリスクチェックを見るUMC N Community Fair Values Create NarrativeSee what others think this stock is worth. Follow their fair value or set your own to get alerts.Your Fair ValueMex$Current PriceMex$178.00413.6% 割高 内在価値ディスカウントGrowth estimate overAnnual revenue growth rate5 Yearstime period%/yrDecreaseIncreasePastFuture0377b2016201920222025202620282031Revenue NT$377.5bEarnings NT$78.6bAdvancedSet Fair ValueView all narrativesUnited Microelectronics Corporation 競合他社Astera LabsSymbol: NasdaqGS:ALABMarket cap: US$36.7bGLOBALFOUNDRIESSymbol: NasdaqGS:GFSMarket cap: US$39.7bON SemiconductorSymbol: NasdaqGS:ONMarket cap: US$40.4bTower SemiconductorSymbol: NasdaqGS:TSEMMarket cap: US$24.4b価格と性能株価の高値、安値、推移の概要United Microelectronics過去の株価現在の株価NT$178.0052週高値NT$200.0052週安値NT$123.75ベータ1.191ヶ月の変化0%3ヶ月変化-2.73%1年変化21.98%3年間の変化n/a5年間の変化n/aIPOからの変化32.84%最新ニュースお知らせ • Feb 26United Microelectronics Corporation, Annual General Meeting, May 27, 2026United Microelectronics Corporation, Annual General Meeting, May 27, 2026. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwanお知らせ • Feb 24United Microelectronics Corporation Announces Change of Representative of Juristic-Person Director, Effective February 24, 2026United Microelectronics Corporation announced a change of representative of juristic-person director for Hsun Chieh Investment Co. Ltd. The previous position holder, SC Chien, served as Director of UMC. The new position holder, Ming Hsu, is Executive Vice President of UMC. The reason for the change is replacement of the representative. The original term is from May 30, 2024 to May 29, 2027. The effective date of the new appointment is February 24, 2026. United Microelectronics Corporation announced the board resolution to convene a 2026 shareholders meeting for United Semiconductor (Xiamen) Co. Ltd. The shareholders meeting date is March 12, 2026.お知らせ • Feb 13United Microelectronics Corporation to Report Q4, 2025 Results on Feb 25, 2026United Microelectronics Corporation announced that they will report Q4, 2025 results on Feb 25, 2026お知らせ • Jan 15Silicon Storage Technology and United Microelectronics Corporation Announce Immediate Availability of 28nm SuperFlash®? Gen 4 Automotive Grade 1 PlatformSilicon Storage Technology®? (SST®?) and United Microelectronics Corporation announced that they have completed full qualification and release to production of SST's embedded SuperFlash®? Gen 4 (ESF4) with full automotive grade 1 (AG1) capability on UMC's 28HPC+ foundry process platform. SST developed ESF4 in close partnership with UMC to deliver enhanced embedded non-volatile memory (eNVM) performance and demonstrated reliability for automotive controllers while simultaneously significantly reducing the number of additional masking steps versus other foundries' 28nm High-k/Metal-Gate Stack (HKMG) eFlash offerings, bringing customers cost advantages and greater manufacturing efficiency. Customers currently manufacturing automotive controller products using foundry 40nm ESF3 AG1 platforms are encouraged to explore the UMC 28nm ESF4 AG1 platform as they look to scale to the next process node. Key SuperFlash performance and reliability metrics for UMC's 28HPC + ESF4 AG1 platform include: Automotive Electronics Council (AEC) Q-100 Grade 1 qualified for temperatures of -40degC to +150degC (Tj); Read access time < 12.5ns; 100K+ endurance cycles; Data retention of > 10 years @ 125degC; Only 1-bit ECC required; Qualification of 32Mb macro at auto grade 1 conditions: Zero bit failures (no ECC applied); Peak yield reached 100%. Automotive controller shipment volumes continue to rapidly increase year after year, as the transportation industry demands innovative solutions for a widening variety of vehicle applications.お知らせ • Jan 05+ 2 more updatesUnited Microelectronics Corporation to Report Q3, 2026 Results on Oct 28, 2026United Microelectronics Corporation announced that they will report Q3, 2026 results on Oct 28, 2026お知らせ • Nov 13Metalenz and United Microelectronics Corporation Bring Breakthrough Face Authentication Solution Polar ID to Mass ProductionMetalenz and United Microelectronics Corporation announced Metalenz's its breakthrough face authentication solution, Polar ID, is now ready for mass production through UMC. Polar ID is a compact, polarization-based biometric solution that leverages Metalenz's metasurface technology to bring payment-grade security and advanced sensing capabilities to any device, even the most challenging of form factors. UMC manufactures the meta-optic layer using its 40nm process and achieves sensor integration utilizing its wafer-on-wafer bonding technology. Leveraging UMC's 300mm wafer manufacturing capabilities, as well as the qualification of this supply chain, Metalenz is ready to ramp into volume positioning Polar ID for widespread adoption across consumer electronics, mobile, and IoT platforms. With demand for secure and convenient biometrics rapidly expanding across consumer devices and IoT, Polar ID delivers secure face authentication in the smallest, simple form factor, making advanced sensing accessible beyond premium tiers and in places it wasn't previously possible. UMC's state-of-the art 12-inch facilities and comprehensive portfolio of semiconductor manufacturing process technologies have made the foundry partner of choice for some of the most advanced fabless semiconductor companies in the world.最新情報をもっと見るRecent updatesお知らせ • Feb 26United Microelectronics Corporation, Annual General Meeting, May 27, 2026United Microelectronics Corporation, Annual General Meeting, May 27, 2026. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwanお知らせ • Feb 24United Microelectronics Corporation Announces Change of Representative of Juristic-Person Director, Effective February 24, 2026United Microelectronics Corporation announced a change of representative of juristic-person director for Hsun Chieh Investment Co. Ltd. The previous position holder, SC Chien, served as Director of UMC. The new position holder, Ming Hsu, is Executive Vice President of UMC. The reason for the change is replacement of the representative. The original term is from May 30, 2024 to May 29, 2027. The effective date of the new appointment is February 24, 2026. United Microelectronics Corporation announced the board resolution to convene a 2026 shareholders meeting for United Semiconductor (Xiamen) Co. Ltd. The shareholders meeting date is March 12, 2026.お知らせ • Feb 13United Microelectronics Corporation to Report Q4, 2025 Results on Feb 25, 2026United Microelectronics Corporation announced that they will report Q4, 2025 results on Feb 25, 2026お知らせ • Jan 15Silicon Storage Technology and United Microelectronics Corporation Announce Immediate Availability of 28nm SuperFlash®? Gen 4 Automotive Grade 1 PlatformSilicon Storage Technology®? (SST®?) and United Microelectronics Corporation announced that they have completed full qualification and release to production of SST's embedded SuperFlash®? Gen 4 (ESF4) with full automotive grade 1 (AG1) capability on UMC's 28HPC+ foundry process platform. SST developed ESF4 in close partnership with UMC to deliver enhanced embedded non-volatile memory (eNVM) performance and demonstrated reliability for automotive controllers while simultaneously significantly reducing the number of additional masking steps versus other foundries' 28nm High-k/Metal-Gate Stack (HKMG) eFlash offerings, bringing customers cost advantages and greater manufacturing efficiency. Customers currently manufacturing automotive controller products using foundry 40nm ESF3 AG1 platforms are encouraged to explore the UMC 28nm ESF4 AG1 platform as they look to scale to the next process node. Key SuperFlash performance and reliability metrics for UMC's 28HPC + ESF4 AG1 platform include: Automotive Electronics Council (AEC) Q-100 Grade 1 qualified for temperatures of -40degC to +150degC (Tj); Read access time < 12.5ns; 100K+ endurance cycles; Data retention of > 10 years @ 125degC; Only 1-bit ECC required; Qualification of 32Mb macro at auto grade 1 conditions: Zero bit failures (no ECC applied); Peak yield reached 100%. Automotive controller shipment volumes continue to rapidly increase year after year, as the transportation industry demands innovative solutions for a widening variety of vehicle applications.お知らせ • Jan 05+ 2 more updatesUnited Microelectronics Corporation to Report Q3, 2026 Results on Oct 28, 2026United Microelectronics Corporation announced that they will report Q3, 2026 results on Oct 28, 2026お知らせ • Nov 13Metalenz and United Microelectronics Corporation Bring Breakthrough Face Authentication Solution Polar ID to Mass ProductionMetalenz and United Microelectronics Corporation announced Metalenz's its breakthrough face authentication solution, Polar ID, is now ready for mass production through UMC. Polar ID is a compact, polarization-based biometric solution that leverages Metalenz's metasurface technology to bring payment-grade security and advanced sensing capabilities to any device, even the most challenging of form factors. UMC manufactures the meta-optic layer using its 40nm process and achieves sensor integration utilizing its wafer-on-wafer bonding technology. Leveraging UMC's 300mm wafer manufacturing capabilities, as well as the qualification of this supply chain, Metalenz is ready to ramp into volume positioning Polar ID for widespread adoption across consumer electronics, mobile, and IoT platforms. With demand for secure and convenient biometrics rapidly expanding across consumer devices and IoT, Polar ID delivers secure face authentication in the smallest, simple form factor, making advanced sensing accessible beyond premium tiers and in places it wasn't previously possible. UMC's state-of-the art 12-inch facilities and comprehensive portfolio of semiconductor manufacturing process technologies have made the foundry partner of choice for some of the most advanced fabless semiconductor companies in the world.お知らせ • Oct 22UMC Introduces 55Nm BCD Platform to Elevate Power Efficiency for Smartphones, Consumer Electronics, and Automotive ApplicationsUnited Microelectronics Corporation announced the release of its 55nm Bipolar-CMOS-DMOS (BCD) platform, enabling a new level of performance and power efficiency in next-generation mobile devices, consumer electronics, automotive, and industrial applications. Designed to address the growing complexity of power management in electronic devices, the new 55nm BCD platform delivers smaller chip area, lower power consumption, and superior noise reduction, enabling greater flexibility and reliability in power circuit designs. Combining analog, digital, and power functions on a single chip, BCD technology is widely used in power management and mixed-signal ICs. UMC's new 55nm BCD platform offers comprehensive solutions to serve diversified power IC applications: Non-Epitaxy (Non-EPI) process: A cost-effective solution with unique device architecture, providing power efficiency and analog performance for mobile and consumer devices. Epitaxy (EPI) process: Compliant with the most stringent AEC-Q100 Grade 0 automotive standards, the 55nm EPI solution supports operating voltage up to 150V, enhancing automotive electronic reliability even under extreme environments. Silicon-on-Insulator (SOI) process: Ideal for high-grade automotive and industrial uses, this solution is AEC-Q100 Grade 1 automotive compliant, featuring superior noise reduction, high speeds, and low leakage. The platform also integrated ultra-thick metal (UTM), embedded flash, and resistive random-access memory (RRAM) technologies for enhanced performance and functionalities. UMC now offers one of the industry's most comprehensive and mature BCD portfolios, spanning process nodes from 0.35um, 0.25um, 0.18um, and 0.11um down to 55nm. Leveraging extensive voltage capabilities, broad IP resources, and robust design support, UMC delivers differentiated solutions that align with customers' technology roadmaps and enhance their product competitiveness.お知らせ • Jun 04United Microelectronics Corporation Announces Cash Dividend, Payable on July 16, 2025United Microelectronics Corporation at its board meeting held on June 04, 2025 resolved to adjust cash dividend ratio. Type and monetary amount of original dividend distribution: Cash dividend TWD 35,787,597,878, each common share is entitled to receive TWD 2.85. Type and monetary amount of dividend distribution after the change: Cash dividend TWD 35,787,597,878, each common share is entitled to receive TWD 2.85016443. Reason for the change: Due to the recall of RSA, the number of outstanding common shares changed accordingly, resulting in the adjustment of cash dividend ratio. Ex-rights (ex-dividend) trading date: June 24, 2025; Ex-rights (ex-dividend) record date: June 30, 2025; Payment date of common stock cash dividend distribution: July 16, 2025.お知らせ • May 01United Microelectronics Corporation to Report Q4, 2025 Results on Jan 28, 2026United Microelectronics Corporation announced that they will report Q4, 2025 results on Jan 28, 2026お知らせ • Apr 02GlobalFoundries, United Microelectronics Reportedly Consider MergerTaiwan's major chipmaker United Microelectronics Corporation (TWSE:2303) and U.S.-based GlobalFoundries Inc. (NasdaqGS:GFS) are looking into the possibility of a merger, two sources familiar with the matter told Reuters on March 31, 2025. A combined company would establish a larger U.S.-based firm with a global manufacturing footprint spanning Asia, the United States and Europe. The potential deal comes as the U.S. seeks to strengthen its semiconductor supply chain amid rising geopolitical tensions in the Taiwan Strait and increasing competition from China in the mature chip market. The merged company would prioritize research and development investments in the U.S. and could possibly emerge as a viable alternative to Taiwan Semiconductor Manufacturing Co (2330.TW), the world's leading chipmaker. UMC said the "company policy is not to comment on market rumours", while GlobalFoundries did not immediately respond to a Reuters' request for comment.お知らせ • Feb 27United Microelectronics Corporation, Annual General Meeting, May 28, 2025United Microelectronics Corporation, Annual General Meeting, May 28, 2025. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwanお知らせ • Feb 19United Microelectronics Corporation to Report Fiscal Year 2024 Results on Feb 26, 2025United Microelectronics Corporation announced that they will report fiscal year 2024 results on Feb 26, 2025お知らせ • Jan 03+ 2 more updatesUnited Microelectronics Corporation to Report Q1, 2025 Results on Apr 23, 2025United Microelectronics Corporation announced that they will report Q1, 2025 results at 1:30 PM, Taipei Standard Time on Apr 23, 2025お知らせ • Dec 20Pentamaster Corporation Berhad (KLSE:PENTA), Chen Chu-Wan, Chen Hsin-Yu, Chen Hsin-Tso, MediaTek Inc. (TWSE:2454) and United Microelectronics Corporation (TWSE:2303) agreed to acquire 36.10% stake in Pentamaster International Limited (SEHK:1665) for approximately HKD 810 million.Pentamaster Corporation Berhad (KLSE:PENTA), Chen Chu-Wan, Chen Hsin-Yu, Chen Hsin-Tso, MediaTek Inc. (TWSE:2454) and United Microelectronics Corporation (TWSE:2303) agreed to acquire 36.10% stake in Pentamaster International Limited (SEHK:1665) for approximately HKD 810 million on December 19, 2024. A cash consideration valued at HKD 0.93 per share will be paid by Pentamaster Corporation Berhad, MediaTek Inc. and United Microelectronics Corporation. As part of consideration, HKD 805.8 million is paid towards common equity of Pentamaster International Limited. The transaction will be funded using internal resources. Upon completion, Pentamaster Corporation Berhad will own 71% stake in Pentamaster International Limited. The transaction is subject to approval by regulatory board / committee, approval of offer by target shareholders, subject to court approval and subject to statutory approval. The expected completion of the transaction is June 19, 2025. Altus Capital Limited acted as financial advisor for Pentamaster International Limited.お知らせ • Oct 08United Microelectronics Corporation to Report Q4, 2024 Results on Jan 21, 2025United Microelectronics Corporation announced that they will report Q4, 2024 results on Jan 21, 2025お知らせ • Jun 13United Microelectronics Corporation Announces Cash Dividend, Payable on July 24, 2024United Microelectronics Corporation announced cash dividend of TWD 37,587,101,925, each common share is entitled to receive TWD 3.00011747. Ex-rights (ex-dividend) trading date is 2 July 2024. Ex-rights (ex-dividend) record date is July 8, 2024; Payment date of cash dividend distribution is July 24, 2024.お知らせ • May 31+ 3 more updatesUnited Microelectronics Corporation Announces Audit Committee ChangesUnited Microelectronics Corporation announced newly appoint members of the 6th term of Audit Committee. Name of the previous position holder: Wenyi Chu, Professor, Department of Business Administration, National Taiwan University, Lih J. Chen, Distinguished Chair Professor, National Tsing Hua University, Jyuo-Min Shyu, Emeritus Professor, National Tsing Hua University, Independent Director, Qisda Corporation, Kuang Si Shiu, Independent Director, Yuanta Financial Holdings Co. Ltd., Independent Director, Yuanta Commercial Bank Co. Ltd., Wen-Hsin Hsu, Professor, Department of Accounting, National Taiwan University, Independent Director, Unitech Printed Circuit Board Corp. Name of the new position holder: Lih J. Chen, Distinguished Chair Professor, National Tsing Hua University, Jyuo-Min Shyu, Emeritus Professor, National Tsing Hua University, Independent Director, Qisda Corporation Kuang Si Shiu, Independent Director, Yuanta Financial Holdings Co. Ltd., Independent Director, Yuanta Commercial Bank Co. Ltd. Wen-Hsin Hsu, Professor, Department of Accounting, National Taiwan University, Independent Director, Unitech Printed Circuit Board Corp. Ling-Ling Wu, Professor, Department of Information Management, College of Management, National Taiwan University, Independent director, Hycon Technology Corp., Su Lin Wang, Independent director, Jess-Link products Co., Ltd, Independent director, AVerMedia Technologies Inc. Effective date of the new member is May 30, 2024.お知らせ • May 03UMC Introduces Industry’s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G EraUnited Microelectronics Corporation announced the industry’s first 3D IC solution for RFSOI technology. Available on UMC’s 55nm RFSOI platform, the stacked silicon technology reduces die size by more than 45% without any degradation of radio frequency (RF) performance, enabling customers to efficiently integrate more RF components to address the greater bandwidth requirements of 5G. As mobile device manufacturers pack more frequency bands in newer generations of smartphones, the company’s 3D IC solution for RFSOI addresses the challenge of integrating more RF front-end modules (RF-FEM) - critical components in devices to transmit and receive data – in a device by vertically stacking dies to reduce surface area. RFSOI is the foundry process used for RF chips such as low noise amplifiers, switches, and antenna tuners. Utilizing wafer-to-wafer bonding technology, UMC’s 3D IC solution for RFSOI resolves the common issue of RF interference between stacked dies. The company has received multiple patents for this process, which is now ready for production. UMC offers the most comprehensive RF front-end module IC solutions in the industry, catering to a broad range of applications including mobile, Wi-Fi, automotive, IoT, and satellite communications. With over 500 product tape-outs completed and more than 38 billion RFSOI chips shipped, UMC’s family of RFSOI solutions are available in 8-inch and 12-inch wafers, as well as in a variety of technology nodes from 130nm to 40nm. In addition to RFSOI technologies, UMC’s 6-inch fab (Wavetek Microelectronics Corporation) offers compound semiconductor technologies gallium arsenide (GaAs) and gallium nitride (GaN) as well as RF filters to supplement the needs of RF-FEM applications.お知らせ • Feb 29United Microelectronics Corporation Approves Cash Dividend for the Year Ended December 31, 2023United Microelectronics Corporation announced that at its board meeting held on February 27, 2024, approved cash dividend for the year ended December 31, 2023 of TWD 3.00 per share. Total amount of cash distributed to shareholders is TWD 37,587,101,925.お知らせ • Feb 28United Microelectronics Corporation, Annual General Meeting, May 30, 2024United Microelectronics Corporation, Annual General Meeting, May 30, 2024, at 09:00 Taipei Standard Time. Location: No. 16, Creation Rd. 1, Hsinchu Science Park Hsinchu City Taiwan Agenda: To consider 2023 business report; to consider audit Committee's report of the 2023 audited financial reports; to consider 2023 distributable compensation for employees and directors; to consider the issuance of the corporate bonds; and to consider other matters.お知らせ • Jan 02+ 2 more updatesUnited Microelectronics Corporation to Report Q2, 2024 Results on Jul 31, 2024United Microelectronics Corporation announced that they will report Q2, 2024 results on Jul 31, 2024株主還元UMC NMX SemiconductorMX 市場7D0%0%0%1Y22.0%0%0%株主還元を見る業界別リターン: UMC N過去 1 年間で135.4 % の収益を上げたMX Semiconductor業界を下回りました。リターン対市場: UMC N過去 1 年間で20.3 % の収益を上げたMX市場を上回りました。価格変動Is UMC N's price volatile compared to industry and market?UMC N volatilityUMC N Average Weekly Movementn/aSemiconductor Industry Average Movement0%Market Average Movement0%10% most volatile stocks in MX Market0%10% least volatile stocks in MX Market0%安定した株価: UMC Nの株価は、 MX市場と比較して過去 3 か月間で変動しています。時間の経過による変動: 過去 1 年間のUMC Nのボラティリティの変化を判断するには データが不十分です。会社概要設立従業員CEO（最高経営責任者ウェブサイト1980n/aJason S. Wangwww.umc.comユナイテッド・マイクロエレクトロニクス・コーポレーションは、台湾、中国、香港、日本、韓国、米国、ヨーロッパ、そして国際的に半導体ウェハー・ファウンドリーとして事業を展開している。同社は集積回路を製造・販売している。モバイルおよびワイヤレス通信、IoTおよびウェアラブル、コンピューティングおよびデータ処理、自動車市場向けにバックエンドおよび設計サポートサービスを提供している。また、ベンチャーキャピタルおよびマーケティング支援、コンサルティングおよびアドバイザリー、エネルギー技術、ソーラーエンジニアリング統合設計、研究開発サービス、保険サービスも提供している。ユナイテッド・マイクロエレクトロニクス・コーポレーションは1980年に設立され、台湾の新竹市に本社を置いている。もっと見るUnited Microelectronics Corporation 基礎のまとめUnited Microelectronics の収益と売上を時価総額と比較するとどうか。UMC N 基礎統計学時価総額Mex$630.07b収益（TTM）Mex$27.49b売上高(TTM)Mex$132.08b22.9xPER（株価収益率4.8xP/SレシオUMC N は割高か？公正価値と評価分析を参照収益と収入最新の決算報告書（TTM）に基づく主な収益性統計UMC N 損益計算書（TTM）収益NT$240.73b売上原価NT$169.45b売上総利益NT$71.28bその他の費用NT$21.17b収益NT$50.11b直近の収益報告Mar 31, 2026次回決算日Jul 29, 2026一株当たり利益（EPS）3.98グロス・マージン29.61%純利益率20.82%有利子負債／自己資本比率17.2%UMC N の長期的なパフォーマンスは？過去の実績と比較を見る配当金2.8%現在の配当利回り65%配当性向View Valuation企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/05/09 04:00終値2026/02/27 00:00収益2026/03/31年間収益2025/12/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレーク本レポートを生成するために使用した分析モデルの詳細は当社のGithubページでご覧いただけます。また、レポートの使用方法に関するガイドやYoutubeのチュートリアルも掲載しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋United Microelectronics Corporation 21 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。40 アナリスト機関Brett SimpsonArete Research Services LLPAndrew LuBarclaysMark LiBernstein37 その他のアナリストを表示
お知らせ • Feb 26United Microelectronics Corporation, Annual General Meeting, May 27, 2026United Microelectronics Corporation, Annual General Meeting, May 27, 2026. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwan
お知らせ • Feb 24United Microelectronics Corporation Announces Change of Representative of Juristic-Person Director, Effective February 24, 2026United Microelectronics Corporation announced a change of representative of juristic-person director for Hsun Chieh Investment Co. Ltd. The previous position holder, SC Chien, served as Director of UMC. The new position holder, Ming Hsu, is Executive Vice President of UMC. The reason for the change is replacement of the representative. The original term is from May 30, 2024 to May 29, 2027. The effective date of the new appointment is February 24, 2026. United Microelectronics Corporation announced the board resolution to convene a 2026 shareholders meeting for United Semiconductor (Xiamen) Co. Ltd. The shareholders meeting date is March 12, 2026.
お知らせ • Feb 13United Microelectronics Corporation to Report Q4, 2025 Results on Feb 25, 2026United Microelectronics Corporation announced that they will report Q4, 2025 results on Feb 25, 2026
お知らせ • Jan 15Silicon Storage Technology and United Microelectronics Corporation Announce Immediate Availability of 28nm SuperFlash®? Gen 4 Automotive Grade 1 PlatformSilicon Storage Technology®? (SST®?) and United Microelectronics Corporation announced that they have completed full qualification and release to production of SST's embedded SuperFlash®? Gen 4 (ESF4) with full automotive grade 1 (AG1) capability on UMC's 28HPC+ foundry process platform. SST developed ESF4 in close partnership with UMC to deliver enhanced embedded non-volatile memory (eNVM) performance and demonstrated reliability for automotive controllers while simultaneously significantly reducing the number of additional masking steps versus other foundries' 28nm High-k/Metal-Gate Stack (HKMG) eFlash offerings, bringing customers cost advantages and greater manufacturing efficiency. Customers currently manufacturing automotive controller products using foundry 40nm ESF3 AG1 platforms are encouraged to explore the UMC 28nm ESF4 AG1 platform as they look to scale to the next process node. Key SuperFlash performance and reliability metrics for UMC's 28HPC + ESF4 AG1 platform include: Automotive Electronics Council (AEC) Q-100 Grade 1 qualified for temperatures of -40degC to +150degC (Tj); Read access time < 12.5ns; 100K+ endurance cycles; Data retention of > 10 years @ 125degC; Only 1-bit ECC required; Qualification of 32Mb macro at auto grade 1 conditions: Zero bit failures (no ECC applied); Peak yield reached 100%. Automotive controller shipment volumes continue to rapidly increase year after year, as the transportation industry demands innovative solutions for a widening variety of vehicle applications.
お知らせ • Jan 05+ 2 more updatesUnited Microelectronics Corporation to Report Q3, 2026 Results on Oct 28, 2026United Microelectronics Corporation announced that they will report Q3, 2026 results on Oct 28, 2026
お知らせ • Nov 13Metalenz and United Microelectronics Corporation Bring Breakthrough Face Authentication Solution Polar ID to Mass ProductionMetalenz and United Microelectronics Corporation announced Metalenz's its breakthrough face authentication solution, Polar ID, is now ready for mass production through UMC. Polar ID is a compact, polarization-based biometric solution that leverages Metalenz's metasurface technology to bring payment-grade security and advanced sensing capabilities to any device, even the most challenging of form factors. UMC manufactures the meta-optic layer using its 40nm process and achieves sensor integration utilizing its wafer-on-wafer bonding technology. Leveraging UMC's 300mm wafer manufacturing capabilities, as well as the qualification of this supply chain, Metalenz is ready to ramp into volume positioning Polar ID for widespread adoption across consumer electronics, mobile, and IoT platforms. With demand for secure and convenient biometrics rapidly expanding across consumer devices and IoT, Polar ID delivers secure face authentication in the smallest, simple form factor, making advanced sensing accessible beyond premium tiers and in places it wasn't previously possible. UMC's state-of-the art 12-inch facilities and comprehensive portfolio of semiconductor manufacturing process technologies have made the foundry partner of choice for some of the most advanced fabless semiconductor companies in the world.
お知らせ • Feb 26United Microelectronics Corporation, Annual General Meeting, May 27, 2026United Microelectronics Corporation, Annual General Meeting, May 27, 2026. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwan
お知らせ • Feb 24United Microelectronics Corporation Announces Change of Representative of Juristic-Person Director, Effective February 24, 2026United Microelectronics Corporation announced a change of representative of juristic-person director for Hsun Chieh Investment Co. Ltd. The previous position holder, SC Chien, served as Director of UMC. The new position holder, Ming Hsu, is Executive Vice President of UMC. The reason for the change is replacement of the representative. The original term is from May 30, 2024 to May 29, 2027. The effective date of the new appointment is February 24, 2026. United Microelectronics Corporation announced the board resolution to convene a 2026 shareholders meeting for United Semiconductor (Xiamen) Co. Ltd. The shareholders meeting date is March 12, 2026.
お知らせ • Feb 13United Microelectronics Corporation to Report Q4, 2025 Results on Feb 25, 2026United Microelectronics Corporation announced that they will report Q4, 2025 results on Feb 25, 2026
お知らせ • Jan 15Silicon Storage Technology and United Microelectronics Corporation Announce Immediate Availability of 28nm SuperFlash®? Gen 4 Automotive Grade 1 PlatformSilicon Storage Technology®? (SST®?) and United Microelectronics Corporation announced that they have completed full qualification and release to production of SST's embedded SuperFlash®? Gen 4 (ESF4) with full automotive grade 1 (AG1) capability on UMC's 28HPC+ foundry process platform. SST developed ESF4 in close partnership with UMC to deliver enhanced embedded non-volatile memory (eNVM) performance and demonstrated reliability for automotive controllers while simultaneously significantly reducing the number of additional masking steps versus other foundries' 28nm High-k/Metal-Gate Stack (HKMG) eFlash offerings, bringing customers cost advantages and greater manufacturing efficiency. Customers currently manufacturing automotive controller products using foundry 40nm ESF3 AG1 platforms are encouraged to explore the UMC 28nm ESF4 AG1 platform as they look to scale to the next process node. Key SuperFlash performance and reliability metrics for UMC's 28HPC + ESF4 AG1 platform include: Automotive Electronics Council (AEC) Q-100 Grade 1 qualified for temperatures of -40degC to +150degC (Tj); Read access time < 12.5ns; 100K+ endurance cycles; Data retention of > 10 years @ 125degC; Only 1-bit ECC required; Qualification of 32Mb macro at auto grade 1 conditions: Zero bit failures (no ECC applied); Peak yield reached 100%. Automotive controller shipment volumes continue to rapidly increase year after year, as the transportation industry demands innovative solutions for a widening variety of vehicle applications.
お知らせ • Jan 05+ 2 more updatesUnited Microelectronics Corporation to Report Q3, 2026 Results on Oct 28, 2026United Microelectronics Corporation announced that they will report Q3, 2026 results on Oct 28, 2026
お知らせ • Nov 13Metalenz and United Microelectronics Corporation Bring Breakthrough Face Authentication Solution Polar ID to Mass ProductionMetalenz and United Microelectronics Corporation announced Metalenz's its breakthrough face authentication solution, Polar ID, is now ready for mass production through UMC. Polar ID is a compact, polarization-based biometric solution that leverages Metalenz's metasurface technology to bring payment-grade security and advanced sensing capabilities to any device, even the most challenging of form factors. UMC manufactures the meta-optic layer using its 40nm process and achieves sensor integration utilizing its wafer-on-wafer bonding technology. Leveraging UMC's 300mm wafer manufacturing capabilities, as well as the qualification of this supply chain, Metalenz is ready to ramp into volume positioning Polar ID for widespread adoption across consumer electronics, mobile, and IoT platforms. With demand for secure and convenient biometrics rapidly expanding across consumer devices and IoT, Polar ID delivers secure face authentication in the smallest, simple form factor, making advanced sensing accessible beyond premium tiers and in places it wasn't previously possible. UMC's state-of-the art 12-inch facilities and comprehensive portfolio of semiconductor manufacturing process technologies have made the foundry partner of choice for some of the most advanced fabless semiconductor companies in the world.
お知らせ • Oct 22UMC Introduces 55Nm BCD Platform to Elevate Power Efficiency for Smartphones, Consumer Electronics, and Automotive ApplicationsUnited Microelectronics Corporation announced the release of its 55nm Bipolar-CMOS-DMOS (BCD) platform, enabling a new level of performance and power efficiency in next-generation mobile devices, consumer electronics, automotive, and industrial applications. Designed to address the growing complexity of power management in electronic devices, the new 55nm BCD platform delivers smaller chip area, lower power consumption, and superior noise reduction, enabling greater flexibility and reliability in power circuit designs. Combining analog, digital, and power functions on a single chip, BCD technology is widely used in power management and mixed-signal ICs. UMC's new 55nm BCD platform offers comprehensive solutions to serve diversified power IC applications: Non-Epitaxy (Non-EPI) process: A cost-effective solution with unique device architecture, providing power efficiency and analog performance for mobile and consumer devices. Epitaxy (EPI) process: Compliant with the most stringent AEC-Q100 Grade 0 automotive standards, the 55nm EPI solution supports operating voltage up to 150V, enhancing automotive electronic reliability even under extreme environments. Silicon-on-Insulator (SOI) process: Ideal for high-grade automotive and industrial uses, this solution is AEC-Q100 Grade 1 automotive compliant, featuring superior noise reduction, high speeds, and low leakage. The platform also integrated ultra-thick metal (UTM), embedded flash, and resistive random-access memory (RRAM) technologies for enhanced performance and functionalities. UMC now offers one of the industry's most comprehensive and mature BCD portfolios, spanning process nodes from 0.35um, 0.25um, 0.18um, and 0.11um down to 55nm. Leveraging extensive voltage capabilities, broad IP resources, and robust design support, UMC delivers differentiated solutions that align with customers' technology roadmaps and enhance their product competitiveness.
お知らせ • Jun 04United Microelectronics Corporation Announces Cash Dividend, Payable on July 16, 2025United Microelectronics Corporation at its board meeting held on June 04, 2025 resolved to adjust cash dividend ratio. Type and monetary amount of original dividend distribution: Cash dividend TWD 35,787,597,878, each common share is entitled to receive TWD 2.85. Type and monetary amount of dividend distribution after the change: Cash dividend TWD 35,787,597,878, each common share is entitled to receive TWD 2.85016443. Reason for the change: Due to the recall of RSA, the number of outstanding common shares changed accordingly, resulting in the adjustment of cash dividend ratio. Ex-rights (ex-dividend) trading date: June 24, 2025; Ex-rights (ex-dividend) record date: June 30, 2025; Payment date of common stock cash dividend distribution: July 16, 2025.
お知らせ • May 01United Microelectronics Corporation to Report Q4, 2025 Results on Jan 28, 2026United Microelectronics Corporation announced that they will report Q4, 2025 results on Jan 28, 2026
お知らせ • Apr 02GlobalFoundries, United Microelectronics Reportedly Consider MergerTaiwan's major chipmaker United Microelectronics Corporation (TWSE:2303) and U.S.-based GlobalFoundries Inc. (NasdaqGS:GFS) are looking into the possibility of a merger, two sources familiar with the matter told Reuters on March 31, 2025. A combined company would establish a larger U.S.-based firm with a global manufacturing footprint spanning Asia, the United States and Europe. The potential deal comes as the U.S. seeks to strengthen its semiconductor supply chain amid rising geopolitical tensions in the Taiwan Strait and increasing competition from China in the mature chip market. The merged company would prioritize research and development investments in the U.S. and could possibly emerge as a viable alternative to Taiwan Semiconductor Manufacturing Co (2330.TW), the world's leading chipmaker. UMC said the "company policy is not to comment on market rumours", while GlobalFoundries did not immediately respond to a Reuters' request for comment.
お知らせ • Feb 27United Microelectronics Corporation, Annual General Meeting, May 28, 2025United Microelectronics Corporation, Annual General Meeting, May 28, 2025. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwan
お知らせ • Feb 19United Microelectronics Corporation to Report Fiscal Year 2024 Results on Feb 26, 2025United Microelectronics Corporation announced that they will report fiscal year 2024 results on Feb 26, 2025
お知らせ • Jan 03+ 2 more updatesUnited Microelectronics Corporation to Report Q1, 2025 Results on Apr 23, 2025United Microelectronics Corporation announced that they will report Q1, 2025 results at 1:30 PM, Taipei Standard Time on Apr 23, 2025
お知らせ • Dec 20Pentamaster Corporation Berhad (KLSE:PENTA), Chen Chu-Wan, Chen Hsin-Yu, Chen Hsin-Tso, MediaTek Inc. (TWSE:2454) and United Microelectronics Corporation (TWSE:2303) agreed to acquire 36.10% stake in Pentamaster International Limited (SEHK:1665) for approximately HKD 810 million.Pentamaster Corporation Berhad (KLSE:PENTA), Chen Chu-Wan, Chen Hsin-Yu, Chen Hsin-Tso, MediaTek Inc. (TWSE:2454) and United Microelectronics Corporation (TWSE:2303) agreed to acquire 36.10% stake in Pentamaster International Limited (SEHK:1665) for approximately HKD 810 million on December 19, 2024. A cash consideration valued at HKD 0.93 per share will be paid by Pentamaster Corporation Berhad, MediaTek Inc. and United Microelectronics Corporation. As part of consideration, HKD 805.8 million is paid towards common equity of Pentamaster International Limited. The transaction will be funded using internal resources. Upon completion, Pentamaster Corporation Berhad will own 71% stake in Pentamaster International Limited. The transaction is subject to approval by regulatory board / committee, approval of offer by target shareholders, subject to court approval and subject to statutory approval. The expected completion of the transaction is June 19, 2025. Altus Capital Limited acted as financial advisor for Pentamaster International Limited.
お知らせ • Oct 08United Microelectronics Corporation to Report Q4, 2024 Results on Jan 21, 2025United Microelectronics Corporation announced that they will report Q4, 2024 results on Jan 21, 2025
お知らせ • Jun 13United Microelectronics Corporation Announces Cash Dividend, Payable on July 24, 2024United Microelectronics Corporation announced cash dividend of TWD 37,587,101,925, each common share is entitled to receive TWD 3.00011747. Ex-rights (ex-dividend) trading date is 2 July 2024. Ex-rights (ex-dividend) record date is July 8, 2024; Payment date of cash dividend distribution is July 24, 2024.
お知らせ • May 31+ 3 more updatesUnited Microelectronics Corporation Announces Audit Committee ChangesUnited Microelectronics Corporation announced newly appoint members of the 6th term of Audit Committee. Name of the previous position holder: Wenyi Chu, Professor, Department of Business Administration, National Taiwan University, Lih J. Chen, Distinguished Chair Professor, National Tsing Hua University, Jyuo-Min Shyu, Emeritus Professor, National Tsing Hua University, Independent Director, Qisda Corporation, Kuang Si Shiu, Independent Director, Yuanta Financial Holdings Co. Ltd., Independent Director, Yuanta Commercial Bank Co. Ltd., Wen-Hsin Hsu, Professor, Department of Accounting, National Taiwan University, Independent Director, Unitech Printed Circuit Board Corp. Name of the new position holder: Lih J. Chen, Distinguished Chair Professor, National Tsing Hua University, Jyuo-Min Shyu, Emeritus Professor, National Tsing Hua University, Independent Director, Qisda Corporation Kuang Si Shiu, Independent Director, Yuanta Financial Holdings Co. Ltd., Independent Director, Yuanta Commercial Bank Co. Ltd. Wen-Hsin Hsu, Professor, Department of Accounting, National Taiwan University, Independent Director, Unitech Printed Circuit Board Corp. Ling-Ling Wu, Professor, Department of Information Management, College of Management, National Taiwan University, Independent director, Hycon Technology Corp., Su Lin Wang, Independent director, Jess-Link products Co., Ltd, Independent director, AVerMedia Technologies Inc. Effective date of the new member is May 30, 2024.
お知らせ • May 03UMC Introduces Industry’s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G EraUnited Microelectronics Corporation announced the industry’s first 3D IC solution for RFSOI technology. Available on UMC’s 55nm RFSOI platform, the stacked silicon technology reduces die size by more than 45% without any degradation of radio frequency (RF) performance, enabling customers to efficiently integrate more RF components to address the greater bandwidth requirements of 5G. As mobile device manufacturers pack more frequency bands in newer generations of smartphones, the company’s 3D IC solution for RFSOI addresses the challenge of integrating more RF front-end modules (RF-FEM) - critical components in devices to transmit and receive data – in a device by vertically stacking dies to reduce surface area. RFSOI is the foundry process used for RF chips such as low noise amplifiers, switches, and antenna tuners. Utilizing wafer-to-wafer bonding technology, UMC’s 3D IC solution for RFSOI resolves the common issue of RF interference between stacked dies. The company has received multiple patents for this process, which is now ready for production. UMC offers the most comprehensive RF front-end module IC solutions in the industry, catering to a broad range of applications including mobile, Wi-Fi, automotive, IoT, and satellite communications. With over 500 product tape-outs completed and more than 38 billion RFSOI chips shipped, UMC’s family of RFSOI solutions are available in 8-inch and 12-inch wafers, as well as in a variety of technology nodes from 130nm to 40nm. In addition to RFSOI technologies, UMC’s 6-inch fab (Wavetek Microelectronics Corporation) offers compound semiconductor technologies gallium arsenide (GaAs) and gallium nitride (GaN) as well as RF filters to supplement the needs of RF-FEM applications.
お知らせ • Feb 29United Microelectronics Corporation Approves Cash Dividend for the Year Ended December 31, 2023United Microelectronics Corporation announced that at its board meeting held on February 27, 2024, approved cash dividend for the year ended December 31, 2023 of TWD 3.00 per share. Total amount of cash distributed to shareholders is TWD 37,587,101,925.
お知らせ • Feb 28United Microelectronics Corporation, Annual General Meeting, May 30, 2024United Microelectronics Corporation, Annual General Meeting, May 30, 2024, at 09:00 Taipei Standard Time. Location: No. 16, Creation Rd. 1, Hsinchu Science Park Hsinchu City Taiwan Agenda: To consider 2023 business report; to consider audit Committee's report of the 2023 audited financial reports; to consider 2023 distributable compensation for employees and directors; to consider the issuance of the corporate bonds; and to consider other matters.
お知らせ • Jan 02+ 2 more updatesUnited Microelectronics Corporation to Report Q2, 2024 Results on Jul 31, 2024United Microelectronics Corporation announced that they will report Q2, 2024 results on Jul 31, 2024
