View ValuationUnited Microelectronics 将来の成長Future 基準チェック /36United Microelectronics利益と収益がそれぞれ年間13%と9.4%増加すると予測されています。EPS は年間 増加すると予想されています。自己資本利益率は 3 年後に16.9% 12.9%なると予測されています。主要情報13.0%収益成長率12.92%EPS成長率Semiconductor 収益成長0%収益成長率9.4%将来の株主資本利益率16.92%アナリストカバレッジGood最終更新日08 May 2026今後の成長に関する最新情報更新なしすべての更新を表示Recent updatesお知らせ • Feb 26United Microelectronics Corporation, Annual General Meeting, May 27, 2026United Microelectronics Corporation, Annual General Meeting, May 27, 2026. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwanお知らせ • Feb 24United Microelectronics Corporation Announces Change of Representative of Juristic-Person Director, Effective February 24, 2026United Microelectronics Corporation announced a change of representative of juristic-person director for Hsun Chieh Investment Co. Ltd. The previous position holder, SC Chien, served as Director of UMC. The new position holder, Ming Hsu, is Executive Vice President of UMC. The reason for the change is replacement of the representative. The original term is from May 30, 2024 to May 29, 2027. The effective date of the new appointment is February 24, 2026. United Microelectronics Corporation announced the board resolution to convene a 2026 shareholders meeting for United Semiconductor (Xiamen) Co. Ltd. The shareholders meeting date is March 12, 2026.お知らせ • Feb 13United Microelectronics Corporation to Report Q4, 2025 Results on Feb 25, 2026United Microelectronics Corporation announced that they will report Q4, 2025 results on Feb 25, 2026お知らせ • Jan 15Silicon Storage Technology and United Microelectronics Corporation Announce Immediate Availability of 28nm SuperFlash®? Gen 4 Automotive Grade 1 PlatformSilicon Storage Technology®? (SST®?) and United Microelectronics Corporation announced that they have completed full qualification and release to production of SST's embedded SuperFlash®? Gen 4 (ESF4) with full automotive grade 1 (AG1) capability on UMC's 28HPC+ foundry process platform. SST developed ESF4 in close partnership with UMC to deliver enhanced embedded non-volatile memory (eNVM) performance and demonstrated reliability for automotive controllers while simultaneously significantly reducing the number of additional masking steps versus other foundries' 28nm High-k/Metal-Gate Stack (HKMG) eFlash offerings, bringing customers cost advantages and greater manufacturing efficiency. Customers currently manufacturing automotive controller products using foundry 40nm ESF3 AG1 platforms are encouraged to explore the UMC 28nm ESF4 AG1 platform as they look to scale to the next process node. Key SuperFlash performance and reliability metrics for UMC's 28HPC + ESF4 AG1 platform include: Automotive Electronics Council (AEC) Q-100 Grade 1 qualified for temperatures of -40degC to +150degC (Tj); Read access time < 12.5ns; 100K+ endurance cycles; Data retention of > 10 years @ 125degC; Only 1-bit ECC required; Qualification of 32Mb macro at auto grade 1 conditions: Zero bit failures (no ECC applied); Peak yield reached 100%. Automotive controller shipment volumes continue to rapidly increase year after year, as the transportation industry demands innovative solutions for a widening variety of vehicle applications.お知らせ • Jan 05+ 2 more updatesUnited Microelectronics Corporation to Report Q3, 2026 Results on Oct 28, 2026United Microelectronics Corporation announced that they will report Q3, 2026 results on Oct 28, 2026お知らせ • Nov 13Metalenz and United Microelectronics Corporation Bring Breakthrough Face Authentication Solution Polar ID to Mass ProductionMetalenz and United Microelectronics Corporation announced Metalenz's its breakthrough face authentication solution, Polar ID, is now ready for mass production through UMC. Polar ID is a compact, polarization-based biometric solution that leverages Metalenz's metasurface technology to bring payment-grade security and advanced sensing capabilities to any device, even the most challenging of form factors. UMC manufactures the meta-optic layer using its 40nm process and achieves sensor integration utilizing its wafer-on-wafer bonding technology. Leveraging UMC's 300mm wafer manufacturing capabilities, as well as the qualification of this supply chain, Metalenz is ready to ramp into volume positioning Polar ID for widespread adoption across consumer electronics, mobile, and IoT platforms. With demand for secure and convenient biometrics rapidly expanding across consumer devices and IoT, Polar ID delivers secure face authentication in the smallest, simple form factor, making advanced sensing accessible beyond premium tiers and in places it wasn't previously possible. UMC's state-of-the art 12-inch facilities and comprehensive portfolio of semiconductor manufacturing process technologies have made the foundry partner of choice for some of the most advanced fabless semiconductor companies in the world.お知らせ • Oct 22UMC Introduces 55Nm BCD Platform to Elevate Power Efficiency for Smartphones, Consumer Electronics, and Automotive ApplicationsUnited Microelectronics Corporation announced the release of its 55nm Bipolar-CMOS-DMOS (BCD) platform, enabling a new level of performance and power efficiency in next-generation mobile devices, consumer electronics, automotive, and industrial applications. Designed to address the growing complexity of power management in electronic devices, the new 55nm BCD platform delivers smaller chip area, lower power consumption, and superior noise reduction, enabling greater flexibility and reliability in power circuit designs. Combining analog, digital, and power functions on a single chip, BCD technology is widely used in power management and mixed-signal ICs. UMC's new 55nm BCD platform offers comprehensive solutions to serve diversified power IC applications: Non-Epitaxy (Non-EPI) process: A cost-effective solution with unique device architecture, providing power efficiency and analog performance for mobile and consumer devices. Epitaxy (EPI) process: Compliant with the most stringent AEC-Q100 Grade 0 automotive standards, the 55nm EPI solution supports operating voltage up to 150V, enhancing automotive electronic reliability even under extreme environments. Silicon-on-Insulator (SOI) process: Ideal for high-grade automotive and industrial uses, this solution is AEC-Q100 Grade 1 automotive compliant, featuring superior noise reduction, high speeds, and low leakage. The platform also integrated ultra-thick metal (UTM), embedded flash, and resistive random-access memory (RRAM) technologies for enhanced performance and functionalities. UMC now offers one of the industry's most comprehensive and mature BCD portfolios, spanning process nodes from 0.35um, 0.25um, 0.18um, and 0.11um down to 55nm. Leveraging extensive voltage capabilities, broad IP resources, and robust design support, UMC delivers differentiated solutions that align with customers' technology roadmaps and enhance their product competitiveness.お知らせ • Jun 04United Microelectronics Corporation Announces Cash Dividend, Payable on July 16, 2025United Microelectronics Corporation at its board meeting held on June 04, 2025 resolved to adjust cash dividend ratio. Type and monetary amount of original dividend distribution: Cash dividend TWD 35,787,597,878, each common share is entitled to receive TWD 2.85. Type and monetary amount of dividend distribution after the change: Cash dividend TWD 35,787,597,878, each common share is entitled to receive TWD 2.85016443. Reason for the change: Due to the recall of RSA, the number of outstanding common shares changed accordingly, resulting in the adjustment of cash dividend ratio. Ex-rights (ex-dividend) trading date: June 24, 2025; Ex-rights (ex-dividend) record date: June 30, 2025; Payment date of common stock cash dividend distribution: July 16, 2025.お知らせ • May 01United Microelectronics Corporation to Report Q4, 2025 Results on Jan 28, 2026United Microelectronics Corporation announced that they will report Q4, 2025 results on Jan 28, 2026お知らせ • Apr 02GlobalFoundries, United Microelectronics Reportedly Consider MergerTaiwan's major chipmaker United Microelectronics Corporation (TWSE:2303) and U.S.-based GlobalFoundries Inc. (NasdaqGS:GFS) are looking into the possibility of a merger, two sources familiar with the matter told Reuters on March 31, 2025. A combined company would establish a larger U.S.-based firm with a global manufacturing footprint spanning Asia, the United States and Europe. The potential deal comes as the U.S. seeks to strengthen its semiconductor supply chain amid rising geopolitical tensions in the Taiwan Strait and increasing competition from China in the mature chip market. The merged company would prioritize research and development investments in the U.S. and could possibly emerge as a viable alternative to Taiwan Semiconductor Manufacturing Co (2330.TW), the world's leading chipmaker. UMC said the "company policy is not to comment on market rumours", while GlobalFoundries did not immediately respond to a Reuters' request for comment.お知らせ • Feb 27United Microelectronics Corporation, Annual General Meeting, May 28, 2025United Microelectronics Corporation, Annual General Meeting, May 28, 2025. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwanお知らせ • Feb 19United Microelectronics Corporation to Report Fiscal Year 2024 Results on Feb 26, 2025United Microelectronics Corporation announced that they will report fiscal year 2024 results on Feb 26, 2025お知らせ • Jan 03+ 2 more updatesUnited Microelectronics Corporation to Report Q1, 2025 Results on Apr 23, 2025United Microelectronics Corporation announced that they will report Q1, 2025 results at 1:30 PM, Taipei Standard Time on Apr 23, 2025お知らせ • Dec 20Pentamaster Corporation Berhad (KLSE:PENTA), Chen Chu-Wan, Chen Hsin-Yu, Chen Hsin-Tso, MediaTek Inc. (TWSE:2454) and United Microelectronics Corporation (TWSE:2303) agreed to acquire 36.10% stake in Pentamaster International Limited (SEHK:1665) for approximately HKD 810 million.Pentamaster Corporation Berhad (KLSE:PENTA), Chen Chu-Wan, Chen Hsin-Yu, Chen Hsin-Tso, MediaTek Inc. (TWSE:2454) and United Microelectronics Corporation (TWSE:2303) agreed to acquire 36.10% stake in Pentamaster International Limited (SEHK:1665) for approximately HKD 810 million on December 19, 2024. A cash consideration valued at HKD 0.93 per share will be paid by Pentamaster Corporation Berhad, MediaTek Inc. and United Microelectronics Corporation. As part of consideration, HKD 805.8 million is paid towards common equity of Pentamaster International Limited. The transaction will be funded using internal resources. Upon completion, Pentamaster Corporation Berhad will own 71% stake in Pentamaster International Limited. The transaction is subject to approval by regulatory board / committee, approval of offer by target shareholders, subject to court approval and subject to statutory approval. The expected completion of the transaction is June 19, 2025. Altus Capital Limited acted as financial advisor for Pentamaster International Limited.お知らせ • Oct 08United Microelectronics Corporation to Report Q4, 2024 Results on Jan 21, 2025United Microelectronics Corporation announced that they will report Q4, 2024 results on Jan 21, 2025お知らせ • Jun 13United Microelectronics Corporation Announces Cash Dividend, Payable on July 24, 2024United Microelectronics Corporation announced cash dividend of TWD 37,587,101,925, each common share is entitled to receive TWD 3.00011747. Ex-rights (ex-dividend) trading date is 2 July 2024. Ex-rights (ex-dividend) record date is July 8, 2024; Payment date of cash dividend distribution is July 24, 2024.お知らせ • May 31+ 3 more updatesUnited Microelectronics Corporation Announces Audit Committee ChangesUnited Microelectronics Corporation announced newly appoint members of the 6th term of Audit Committee. Name of the previous position holder: Wenyi Chu, Professor, Department of Business Administration, National Taiwan University, Lih J. Chen, Distinguished Chair Professor, National Tsing Hua University, Jyuo-Min Shyu, Emeritus Professor, National Tsing Hua University, Independent Director, Qisda Corporation, Kuang Si Shiu, Independent Director, Yuanta Financial Holdings Co. Ltd., Independent Director, Yuanta Commercial Bank Co. Ltd., Wen-Hsin Hsu, Professor, Department of Accounting, National Taiwan University, Independent Director, Unitech Printed Circuit Board Corp. Name of the new position holder: Lih J. Chen, Distinguished Chair Professor, National Tsing Hua University, Jyuo-Min Shyu, Emeritus Professor, National Tsing Hua University, Independent Director, Qisda Corporation Kuang Si Shiu, Independent Director, Yuanta Financial Holdings Co. Ltd., Independent Director, Yuanta Commercial Bank Co. Ltd. Wen-Hsin Hsu, Professor, Department of Accounting, National Taiwan University, Independent Director, Unitech Printed Circuit Board Corp. Ling-Ling Wu, Professor, Department of Information Management, College of Management, National Taiwan University, Independent director, Hycon Technology Corp., Su Lin Wang, Independent director, Jess-Link products Co., Ltd, Independent director, AVerMedia Technologies Inc. Effective date of the new member is May 30, 2024.お知らせ • May 03UMC Introduces Industry’s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G EraUnited Microelectronics Corporation announced the industry’s first 3D IC solution for RFSOI technology. Available on UMC’s 55nm RFSOI platform, the stacked silicon technology reduces die size by more than 45% without any degradation of radio frequency (RF) performance, enabling customers to efficiently integrate more RF components to address the greater bandwidth requirements of 5G. As mobile device manufacturers pack more frequency bands in newer generations of smartphones, the company’s 3D IC solution for RFSOI addresses the challenge of integrating more RF front-end modules (RF-FEM) - critical components in devices to transmit and receive data – in a device by vertically stacking dies to reduce surface area. RFSOI is the foundry process used for RF chips such as low noise amplifiers, switches, and antenna tuners. Utilizing wafer-to-wafer bonding technology, UMC’s 3D IC solution for RFSOI resolves the common issue of RF interference between stacked dies. The company has received multiple patents for this process, which is now ready for production. UMC offers the most comprehensive RF front-end module IC solutions in the industry, catering to a broad range of applications including mobile, Wi-Fi, automotive, IoT, and satellite communications. With over 500 product tape-outs completed and more than 38 billion RFSOI chips shipped, UMC’s family of RFSOI solutions are available in 8-inch and 12-inch wafers, as well as in a variety of technology nodes from 130nm to 40nm. In addition to RFSOI technologies, UMC’s 6-inch fab (Wavetek Microelectronics Corporation) offers compound semiconductor technologies gallium arsenide (GaAs) and gallium nitride (GaN) as well as RF filters to supplement the needs of RF-FEM applications.お知らせ • Feb 29United Microelectronics Corporation Approves Cash Dividend for the Year Ended December 31, 2023United Microelectronics Corporation announced that at its board meeting held on February 27, 2024, approved cash dividend for the year ended December 31, 2023 of TWD 3.00 per share. Total amount of cash distributed to shareholders is TWD 37,587,101,925.お知らせ • Feb 28United Microelectronics Corporation, Annual General Meeting, May 30, 2024United Microelectronics Corporation, Annual General Meeting, May 30, 2024, at 09:00 Taipei Standard Time. Location: No. 16, Creation Rd. 1, Hsinchu Science Park Hsinchu City Taiwan Agenda: To consider 2023 business report; to consider audit Committee's report of the 2023 audited financial reports; to consider 2023 distributable compensation for employees and directors; to consider the issuance of the corporate bonds; and to consider other matters.お知らせ • Jan 02+ 2 more updatesUnited Microelectronics Corporation to Report Q2, 2024 Results on Jul 31, 2024United Microelectronics Corporation announced that they will report Q2, 2024 results on Jul 31, 2024業績と収益の成長予測BMV:UMC N - アナリストの将来予測と過去の財務データ ( )TWD Millions日付収益収益フリー・キャッシュフロー営業活動によるキャッシュ平均アナリスト数12/31/2028327,25575,76181,414128,7501312/31/2027305,08063,25872,456131,2252112/31/2026271,57953,87457,458109,026193/31/2026240,73250,11148,56098,020N/A12/31/2025237,55341,71649,13199,864N/A9/30/2025236,13040,15845,44699,838N/A6/30/2025237,48839,64831,79996,248N/A3/31/2025235,52944,53220,39696,878N/A12/31/2024232,30347,2112,52993,872N/A9/30/2024226,87551,909-6,18787,112N/A6/30/2024223,45953,408-5388,823N/A3/31/2024222,95655,263-13,22479,855N/A12/31/2023222,53360,990-8,02086,000N/A9/30/2023235,41069,143-8,565100,739N/A6/30/2023253,73380,1686,330121,376N/A3/31/2023269,49283,57440,762142,707N/A12/31/2022278,70589,47962,977145,861N/A9/30/2022269,96979,54670,428131,727N/A6/30/2022250,48470,01058,577114,157N/A3/31/2022229,33765,16048,978102,189N/A12/31/2021213,01151,24640,39290,352N/A9/30/2021199,20851,02732,41879,602N/A6/30/2021188,17242,67339,13676,015N/A3/31/2021181,65037,41037,05369,294N/A12/31/2020176,82122,86137,39165,745N/A9/30/2020173,37420,27866,44687,205N/A6/30/2020166,24214,10148,06865,588N/A3/31/2020157,88710,71344,50061,453N/A12/31/2019148,2028,155N/A54,904N/A9/30/2019141,8704,164N/A29,494N/A6/30/2019143,5182,956N/A48,345N/A3/31/2019146,3384,874N/A50,342N/A12/31/2018151,2537,678N/A50,935N/A9/30/2018152,36610,599N/A51,711N/A6/30/2018150,67812,351N/A47,387N/A3/31/2018149,36410,791N/A47,940N/A12/31/2017149,2859,677N/A52,474N/A9/30/2017150,96010,711N/A55,122N/A6/30/2017151,42510,213N/A57,563N/A3/31/2017150,88410,698N/A48,363N/A12/31/2016147,8708,621N/A46,450N/A9/30/2016143,4148,733N/A46,332N/A6/30/2016140,5707,467N/A48,722N/A3/31/2016141,5859,484N/A54,317N/A12/31/2015144,83013,254N/A59,788N/A9/30/2015148,21614,852N/A63,197N/A6/30/2015148,11016,060N/A58,958N/Aもっと見るアナリストによる今後の成長予測収入対貯蓄率: UMC Nの予測収益成長率 (年間13% ) は 貯蓄率 ( 9% ) を上回っています。収益対市場: UMC Nの収益 ( 13% ) はMX市場 ( 8.4% ) よりも速いペースで成長すると予測されています。高成長収益: UMC Nの収益は増加すると予測されていますが、大幅には増加しません。収益対市場: UMC Nの収益 ( 9.4% ) MX市場 ( 6% ) よりも速いペースで成長すると予測されています。高い収益成長: UMC Nの収益 ( 9.4% ) 20%よりも低い成長が予測されています。一株当たり利益成長率予想将来の株主資本利益率将来のROE: UMC Nの 自己資本利益率 は、3年後には低くなると予測されています ( 16.9 %)。成長企業の発掘7D1Y7D1Y7D1YSemiconductors 業界の高成長企業。View Past Performance企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/05/11 19:22終値2026/02/27 00:00収益2026/03/31年間収益2025/12/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレーク本レポートを生成するために使用した分析モデルの詳細は当社のGithubページでご覧いただけます。また、レポートの使用方法に関するガイドやYoutubeのチュートリアルも掲載しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋United Microelectronics Corporation 21 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。40 アナリスト機関Brett SimpsonArete Research Services LLPAndrew LuBarclaysMark LiBernstein37 その他のアナリストを表示
お知らせ • Feb 26United Microelectronics Corporation, Annual General Meeting, May 27, 2026United Microelectronics Corporation, Annual General Meeting, May 27, 2026. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwan
お知らせ • Feb 24United Microelectronics Corporation Announces Change of Representative of Juristic-Person Director, Effective February 24, 2026United Microelectronics Corporation announced a change of representative of juristic-person director for Hsun Chieh Investment Co. Ltd. The previous position holder, SC Chien, served as Director of UMC. The new position holder, Ming Hsu, is Executive Vice President of UMC. The reason for the change is replacement of the representative. The original term is from May 30, 2024 to May 29, 2027. The effective date of the new appointment is February 24, 2026. United Microelectronics Corporation announced the board resolution to convene a 2026 shareholders meeting for United Semiconductor (Xiamen) Co. Ltd. The shareholders meeting date is March 12, 2026.
お知らせ • Feb 13United Microelectronics Corporation to Report Q4, 2025 Results on Feb 25, 2026United Microelectronics Corporation announced that they will report Q4, 2025 results on Feb 25, 2026
お知らせ • Jan 15Silicon Storage Technology and United Microelectronics Corporation Announce Immediate Availability of 28nm SuperFlash®? Gen 4 Automotive Grade 1 PlatformSilicon Storage Technology®? (SST®?) and United Microelectronics Corporation announced that they have completed full qualification and release to production of SST's embedded SuperFlash®? Gen 4 (ESF4) with full automotive grade 1 (AG1) capability on UMC's 28HPC+ foundry process platform. SST developed ESF4 in close partnership with UMC to deliver enhanced embedded non-volatile memory (eNVM) performance and demonstrated reliability for automotive controllers while simultaneously significantly reducing the number of additional masking steps versus other foundries' 28nm High-k/Metal-Gate Stack (HKMG) eFlash offerings, bringing customers cost advantages and greater manufacturing efficiency. Customers currently manufacturing automotive controller products using foundry 40nm ESF3 AG1 platforms are encouraged to explore the UMC 28nm ESF4 AG1 platform as they look to scale to the next process node. Key SuperFlash performance and reliability metrics for UMC's 28HPC + ESF4 AG1 platform include: Automotive Electronics Council (AEC) Q-100 Grade 1 qualified for temperatures of -40degC to +150degC (Tj); Read access time < 12.5ns; 100K+ endurance cycles; Data retention of > 10 years @ 125degC; Only 1-bit ECC required; Qualification of 32Mb macro at auto grade 1 conditions: Zero bit failures (no ECC applied); Peak yield reached 100%. Automotive controller shipment volumes continue to rapidly increase year after year, as the transportation industry demands innovative solutions for a widening variety of vehicle applications.
お知らせ • Jan 05+ 2 more updatesUnited Microelectronics Corporation to Report Q3, 2026 Results on Oct 28, 2026United Microelectronics Corporation announced that they will report Q3, 2026 results on Oct 28, 2026
お知らせ • Nov 13Metalenz and United Microelectronics Corporation Bring Breakthrough Face Authentication Solution Polar ID to Mass ProductionMetalenz and United Microelectronics Corporation announced Metalenz's its breakthrough face authentication solution, Polar ID, is now ready for mass production through UMC. Polar ID is a compact, polarization-based biometric solution that leverages Metalenz's metasurface technology to bring payment-grade security and advanced sensing capabilities to any device, even the most challenging of form factors. UMC manufactures the meta-optic layer using its 40nm process and achieves sensor integration utilizing its wafer-on-wafer bonding technology. Leveraging UMC's 300mm wafer manufacturing capabilities, as well as the qualification of this supply chain, Metalenz is ready to ramp into volume positioning Polar ID for widespread adoption across consumer electronics, mobile, and IoT platforms. With demand for secure and convenient biometrics rapidly expanding across consumer devices and IoT, Polar ID delivers secure face authentication in the smallest, simple form factor, making advanced sensing accessible beyond premium tiers and in places it wasn't previously possible. UMC's state-of-the art 12-inch facilities and comprehensive portfolio of semiconductor manufacturing process technologies have made the foundry partner of choice for some of the most advanced fabless semiconductor companies in the world.
お知らせ • Oct 22UMC Introduces 55Nm BCD Platform to Elevate Power Efficiency for Smartphones, Consumer Electronics, and Automotive ApplicationsUnited Microelectronics Corporation announced the release of its 55nm Bipolar-CMOS-DMOS (BCD) platform, enabling a new level of performance and power efficiency in next-generation mobile devices, consumer electronics, automotive, and industrial applications. Designed to address the growing complexity of power management in electronic devices, the new 55nm BCD platform delivers smaller chip area, lower power consumption, and superior noise reduction, enabling greater flexibility and reliability in power circuit designs. Combining analog, digital, and power functions on a single chip, BCD technology is widely used in power management and mixed-signal ICs. UMC's new 55nm BCD platform offers comprehensive solutions to serve diversified power IC applications: Non-Epitaxy (Non-EPI) process: A cost-effective solution with unique device architecture, providing power efficiency and analog performance for mobile and consumer devices. Epitaxy (EPI) process: Compliant with the most stringent AEC-Q100 Grade 0 automotive standards, the 55nm EPI solution supports operating voltage up to 150V, enhancing automotive electronic reliability even under extreme environments. Silicon-on-Insulator (SOI) process: Ideal for high-grade automotive and industrial uses, this solution is AEC-Q100 Grade 1 automotive compliant, featuring superior noise reduction, high speeds, and low leakage. The platform also integrated ultra-thick metal (UTM), embedded flash, and resistive random-access memory (RRAM) technologies for enhanced performance and functionalities. UMC now offers one of the industry's most comprehensive and mature BCD portfolios, spanning process nodes from 0.35um, 0.25um, 0.18um, and 0.11um down to 55nm. Leveraging extensive voltage capabilities, broad IP resources, and robust design support, UMC delivers differentiated solutions that align with customers' technology roadmaps and enhance their product competitiveness.
お知らせ • Jun 04United Microelectronics Corporation Announces Cash Dividend, Payable on July 16, 2025United Microelectronics Corporation at its board meeting held on June 04, 2025 resolved to adjust cash dividend ratio. Type and monetary amount of original dividend distribution: Cash dividend TWD 35,787,597,878, each common share is entitled to receive TWD 2.85. Type and monetary amount of dividend distribution after the change: Cash dividend TWD 35,787,597,878, each common share is entitled to receive TWD 2.85016443. Reason for the change: Due to the recall of RSA, the number of outstanding common shares changed accordingly, resulting in the adjustment of cash dividend ratio. Ex-rights (ex-dividend) trading date: June 24, 2025; Ex-rights (ex-dividend) record date: June 30, 2025; Payment date of common stock cash dividend distribution: July 16, 2025.
お知らせ • May 01United Microelectronics Corporation to Report Q4, 2025 Results on Jan 28, 2026United Microelectronics Corporation announced that they will report Q4, 2025 results on Jan 28, 2026
お知らせ • Apr 02GlobalFoundries, United Microelectronics Reportedly Consider MergerTaiwan's major chipmaker United Microelectronics Corporation (TWSE:2303) and U.S.-based GlobalFoundries Inc. (NasdaqGS:GFS) are looking into the possibility of a merger, two sources familiar with the matter told Reuters on March 31, 2025. A combined company would establish a larger U.S.-based firm with a global manufacturing footprint spanning Asia, the United States and Europe. The potential deal comes as the U.S. seeks to strengthen its semiconductor supply chain amid rising geopolitical tensions in the Taiwan Strait and increasing competition from China in the mature chip market. The merged company would prioritize research and development investments in the U.S. and could possibly emerge as a viable alternative to Taiwan Semiconductor Manufacturing Co (2330.TW), the world's leading chipmaker. UMC said the "company policy is not to comment on market rumours", while GlobalFoundries did not immediately respond to a Reuters' request for comment.
お知らせ • Feb 27United Microelectronics Corporation, Annual General Meeting, May 28, 2025United Microelectronics Corporation, Annual General Meeting, May 28, 2025. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwan
お知らせ • Feb 19United Microelectronics Corporation to Report Fiscal Year 2024 Results on Feb 26, 2025United Microelectronics Corporation announced that they will report fiscal year 2024 results on Feb 26, 2025
お知らせ • Jan 03+ 2 more updatesUnited Microelectronics Corporation to Report Q1, 2025 Results on Apr 23, 2025United Microelectronics Corporation announced that they will report Q1, 2025 results at 1:30 PM, Taipei Standard Time on Apr 23, 2025
お知らせ • Dec 20Pentamaster Corporation Berhad (KLSE:PENTA), Chen Chu-Wan, Chen Hsin-Yu, Chen Hsin-Tso, MediaTek Inc. (TWSE:2454) and United Microelectronics Corporation (TWSE:2303) agreed to acquire 36.10% stake in Pentamaster International Limited (SEHK:1665) for approximately HKD 810 million.Pentamaster Corporation Berhad (KLSE:PENTA), Chen Chu-Wan, Chen Hsin-Yu, Chen Hsin-Tso, MediaTek Inc. (TWSE:2454) and United Microelectronics Corporation (TWSE:2303) agreed to acquire 36.10% stake in Pentamaster International Limited (SEHK:1665) for approximately HKD 810 million on December 19, 2024. A cash consideration valued at HKD 0.93 per share will be paid by Pentamaster Corporation Berhad, MediaTek Inc. and United Microelectronics Corporation. As part of consideration, HKD 805.8 million is paid towards common equity of Pentamaster International Limited. The transaction will be funded using internal resources. Upon completion, Pentamaster Corporation Berhad will own 71% stake in Pentamaster International Limited. The transaction is subject to approval by regulatory board / committee, approval of offer by target shareholders, subject to court approval and subject to statutory approval. The expected completion of the transaction is June 19, 2025. Altus Capital Limited acted as financial advisor for Pentamaster International Limited.
お知らせ • Oct 08United Microelectronics Corporation to Report Q4, 2024 Results on Jan 21, 2025United Microelectronics Corporation announced that they will report Q4, 2024 results on Jan 21, 2025
お知らせ • Jun 13United Microelectronics Corporation Announces Cash Dividend, Payable on July 24, 2024United Microelectronics Corporation announced cash dividend of TWD 37,587,101,925, each common share is entitled to receive TWD 3.00011747. Ex-rights (ex-dividend) trading date is 2 July 2024. Ex-rights (ex-dividend) record date is July 8, 2024; Payment date of cash dividend distribution is July 24, 2024.
お知らせ • May 31+ 3 more updatesUnited Microelectronics Corporation Announces Audit Committee ChangesUnited Microelectronics Corporation announced newly appoint members of the 6th term of Audit Committee. Name of the previous position holder: Wenyi Chu, Professor, Department of Business Administration, National Taiwan University, Lih J. Chen, Distinguished Chair Professor, National Tsing Hua University, Jyuo-Min Shyu, Emeritus Professor, National Tsing Hua University, Independent Director, Qisda Corporation, Kuang Si Shiu, Independent Director, Yuanta Financial Holdings Co. Ltd., Independent Director, Yuanta Commercial Bank Co. Ltd., Wen-Hsin Hsu, Professor, Department of Accounting, National Taiwan University, Independent Director, Unitech Printed Circuit Board Corp. Name of the new position holder: Lih J. Chen, Distinguished Chair Professor, National Tsing Hua University, Jyuo-Min Shyu, Emeritus Professor, National Tsing Hua University, Independent Director, Qisda Corporation Kuang Si Shiu, Independent Director, Yuanta Financial Holdings Co. Ltd., Independent Director, Yuanta Commercial Bank Co. Ltd. Wen-Hsin Hsu, Professor, Department of Accounting, National Taiwan University, Independent Director, Unitech Printed Circuit Board Corp. Ling-Ling Wu, Professor, Department of Information Management, College of Management, National Taiwan University, Independent director, Hycon Technology Corp., Su Lin Wang, Independent director, Jess-Link products Co., Ltd, Independent director, AVerMedia Technologies Inc. Effective date of the new member is May 30, 2024.
お知らせ • May 03UMC Introduces Industry’s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G EraUnited Microelectronics Corporation announced the industry’s first 3D IC solution for RFSOI technology. Available on UMC’s 55nm RFSOI platform, the stacked silicon technology reduces die size by more than 45% without any degradation of radio frequency (RF) performance, enabling customers to efficiently integrate more RF components to address the greater bandwidth requirements of 5G. As mobile device manufacturers pack more frequency bands in newer generations of smartphones, the company’s 3D IC solution for RFSOI addresses the challenge of integrating more RF front-end modules (RF-FEM) - critical components in devices to transmit and receive data – in a device by vertically stacking dies to reduce surface area. RFSOI is the foundry process used for RF chips such as low noise amplifiers, switches, and antenna tuners. Utilizing wafer-to-wafer bonding technology, UMC’s 3D IC solution for RFSOI resolves the common issue of RF interference between stacked dies. The company has received multiple patents for this process, which is now ready for production. UMC offers the most comprehensive RF front-end module IC solutions in the industry, catering to a broad range of applications including mobile, Wi-Fi, automotive, IoT, and satellite communications. With over 500 product tape-outs completed and more than 38 billion RFSOI chips shipped, UMC’s family of RFSOI solutions are available in 8-inch and 12-inch wafers, as well as in a variety of technology nodes from 130nm to 40nm. In addition to RFSOI technologies, UMC’s 6-inch fab (Wavetek Microelectronics Corporation) offers compound semiconductor technologies gallium arsenide (GaAs) and gallium nitride (GaN) as well as RF filters to supplement the needs of RF-FEM applications.
お知らせ • Feb 29United Microelectronics Corporation Approves Cash Dividend for the Year Ended December 31, 2023United Microelectronics Corporation announced that at its board meeting held on February 27, 2024, approved cash dividend for the year ended December 31, 2023 of TWD 3.00 per share. Total amount of cash distributed to shareholders is TWD 37,587,101,925.
お知らせ • Feb 28United Microelectronics Corporation, Annual General Meeting, May 30, 2024United Microelectronics Corporation, Annual General Meeting, May 30, 2024, at 09:00 Taipei Standard Time. Location: No. 16, Creation Rd. 1, Hsinchu Science Park Hsinchu City Taiwan Agenda: To consider 2023 business report; to consider audit Committee's report of the 2023 audited financial reports; to consider 2023 distributable compensation for employees and directors; to consider the issuance of the corporate bonds; and to consider other matters.
お知らせ • Jan 02+ 2 more updatesUnited Microelectronics Corporation to Report Q2, 2024 Results on Jul 31, 2024United Microelectronics Corporation announced that they will report Q2, 2024 results on Jul 31, 2024