STMicroelectronics（SGMR）株式概要STMicroelectronics N.V.は、その子会社とともに、欧州、中東、アフリカ、米州、アジア太平洋地域で半導体製品の設計、開発、製造、販売を行っています。 詳細SGMR ファンダメンタル分析スノーフレーク・スコア評価0/6将来の成長4/6過去の実績0/6財務の健全性6/6配当金0/6報酬収益は年間37.79%増加すると予測されています リスク分析株式の流動性は非常に低い 利益率(3.6%)は昨年より低い(5.5%) 財務結果に影響を与える大きな一時的項目 すべてのリスクチェックを見るSGMR Community Fair Values Create NarrativeSee what others think this stock is worth. Follow their fair value or set your own to get alerts.NEW485,942 membersJoin community and earn perksGain real feedbackFrom our editorial team, personally. Not silence.Grow your followingReal investors. The kind who actually invest, not scroll past.Unlock free accessFree premium subscription for consistent and quality authors.Learn moreCreate NarrativeBLINRODA485,942 investors already sharing narrativesYour Fair ValueCHF Current PriceCHF 58.1613.9% 割高 内在価値ディスカウントGrowth estimate overAnnual revenue growth rate5 Yearstime period%/yrDecreaseIncreasePastFuture023b2016201920222025202620282031Revenue US$23.1bEarnings US$821.7mAdvancedSet Fair ValueView all narrativesSTMicroelectronics N.V. 競合他社United MicroelectronicsSymbol: TWSE:2303Market cap: NT$1.5tON SemiconductorSymbol: NasdaqGS:ONMarket cap: US$31.3bRenesas ElectronicsSymbol: TSE:6723Market cap: JP¥7.1tAstera LabsSymbol: NasdaqGS:ALABMarket cap: US$55.0b価格と性能株価の高値、安値、推移の概要STMicroelectronics過去の株価現在の株価€58.1652週高値€58.1652週安値€58.16ベータ1.521ヶ月の変化-0.35%3ヶ月変化n/a1年変化n/a3年間の変化n/a5年間の変化n/aIPOからの変化-3.86%最新ニュースお知らせ • Jul 24Stmicroelectronics N.V. Provides Earnings Guidance for the Third Quarter Ending September 26, 2026 and Fourth Quarter of 2026STMicroelectronics N.V. provided earnings guidance for the third quarter ending September 26, 2026 and fourth quarter of 2026. For the third quarter, business outlook, at the mid-point, is for net revenues of $3.70 billion, increasing about 6.2% sequentially and about 16.2% year-over-year. For the fourth quarter, the company expects revenues to be above $4 billion, this translates into a H2 vs H1 growth above normal 15% seasonality.お知らせ • Jun 24STMicroelectronics Unveils ST54M Secure Mobile Chip with Post-Quantum Cryptography for Next-Generation Connected ServicesSTMicroelectronics introduced the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready security requirements while supporting a seamless user experience across connected services. ST54M brings to the market a single-die device featuring an innovative hardware accelerator for post-quantum cryptography (PQC), combined with NFC, secure element and eSIM functionality, delivering a powerful future-ready solution for secure mobile connectivity and services. The solution supports a wide range of use cases, including contactless payments, transit ticketing, access control, digital identity, driving licenses, connectivity services, and digital car keys. ST54M addresses this need by enabling OEMs and ecosystem partners to support multiple applications on one platform while preparing for the transition toward PQC. The device is designed for use across personal electronics ecosystems involving mobile network operators, banks, governments, transit operators, car manufacturers, digital-wallet and service providers. It helps manufacturers create devices that preserve a stable and familiar user experience while meeting stronger long-term security expectations. ST54M enables customers and partners to deliver post-quantum-ready implementations with enough time to meet demanding industry-driven market deployment requirements, which are expected to be mandated around 2030. ST54M is an advanced single-die solution that integrates an NFC controller with a secure element supporting secure applications, eSIM and NFC-compliant products. A key feature is its hardware accelerator for post-quantum cryptography algorithms, including ML-KEM and ML-DSA, supporting the transition from hybrid cryptographic approaches toward full post-quantum deployment. The hardware engine is designed to address emerging PQC requirements while helping protect against side-channel and fault-injection attacks and is the latest result from ST’s long-term commitment that also includes certified software libraries NesLib-PQML and X-CUBE-PQC in STM32 microcontrollers. In addition to its security architecture, the device integrates large memory capacity to support multiple applications and includes an enhanced RF front end. These capabilities can help improve performance with smaller antennas and single-ended configurations, support more stable reader-writer operation, and enable demanding use cases such as mobile Point-of-Sale (mPOS) and wireless charging. The platform has completed certification testing under Common Criteria 2022 EUCC and EMVCo, underscoring its suitability for security-sensitive mobile applications. ST54M sampling is available for customers, with production and certification targeted for July 2026.お知らせ • Jun 22STMicroelectronics Unveils VL53L9 Direct Time-Of-Flight 3D LiDAR ModuleSTMicroelectronics unveiled the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module. VL53L9 is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,268 zones (54x42), wide 54°x42° field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters. VL53L9 combines features in a compact and cost-effective package, delivering AI-ready output data for low-compute edge AI systems on small microcontrollers (MCUs) and high-performance sensing across robotics, industrial automation, smart buildings, AR/VR, and healthcare. VL53L9 is designed for multiple industry use cases: Robotics: enhanced small object detection, SLAM (simultaneous localization and mapping) and obstacle avoidance for autonomous navigation. Industrial automation: accurate volume measurement in tanks and bins, improving operational efficiency and inventory management. Smart buildings and homes: reliable human presence detection and people counting while preserving user privacy. AR/VR and consumer electronics: advanced gesture recognition, body tracking and finger skeleton for immersive user experiences. Healthcare: fall detection and monitoring solutions for eldercare and patient safety. The VL53L9 offers an unprecedented 2,268 resolution zones (54x42) with a wide 54°x42° field of view, enabling detailed 3D depth mapping and precise detection of small objects, contours, and edges. Leveraging ST’s proprietary stacked BSI SPAD sensor technology and innovative metasurface optical elements (MOE), the module delivers fast and accurate ranging from less than 5 cm up to 9 meters with up to 1% accuracy and a frame rate of 100 frames per second. The VL53L9’s dual-scan flood illumination replaces traditional dot scanning, reducing motion artifacts, eliminating dead zones, improving small-object detection, and capturing complementary 2D infrared and 3D depth images. Compared to competition, this greatly simplifies post-processing and enables a broad range of edge AI use cases to run efficiently on small MCUs with low compute requirements. The all-in-one module further integrates on-chip dToF processing, a dedicated power management IC, and is fully calibration-free, simplifying integration and reducing system cost and complexity. Measuring just 12.8 mm x 6.1 mm x 4.6 mm, the VL53L9 is a reflowable, single-component module compatible with a wide range of cover glass materials. It supports dual power supply operation (1.2 V and 3.3 V) and outputs data via MIPI or I3C interfaces, ensuring compatibility with diverse CPU architectures. The module is certified as Class 1 laser safe, providing reliable and secure operation for end users. ST FlightSense VL53L9 in mass production in early July 2026 with samples and volume shipments available to customers globally.最新情報をもっと見るRecent updatesお知らせ • Jul 24Stmicroelectronics N.V. Provides Earnings Guidance for the Third Quarter Ending September 26, 2026 and Fourth Quarter of 2026STMicroelectronics N.V. provided earnings guidance for the third quarter ending September 26, 2026 and fourth quarter of 2026. For the third quarter, business outlook, at the mid-point, is for net revenues of $3.70 billion, increasing about 6.2% sequentially and about 16.2% year-over-year. For the fourth quarter, the company expects revenues to be above $4 billion, this translates into a H2 vs H1 growth above normal 15% seasonality.お知らせ • Jun 24STMicroelectronics Unveils ST54M Secure Mobile Chip with Post-Quantum Cryptography for Next-Generation Connected ServicesSTMicroelectronics introduced the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready security requirements while supporting a seamless user experience across connected services. ST54M brings to the market a single-die device featuring an innovative hardware accelerator for post-quantum cryptography (PQC), combined with NFC, secure element and eSIM functionality, delivering a powerful future-ready solution for secure mobile connectivity and services. The solution supports a wide range of use cases, including contactless payments, transit ticketing, access control, digital identity, driving licenses, connectivity services, and digital car keys. ST54M addresses this need by enabling OEMs and ecosystem partners to support multiple applications on one platform while preparing for the transition toward PQC. The device is designed for use across personal electronics ecosystems involving mobile network operators, banks, governments, transit operators, car manufacturers, digital-wallet and service providers. It helps manufacturers create devices that preserve a stable and familiar user experience while meeting stronger long-term security expectations. ST54M enables customers and partners to deliver post-quantum-ready implementations with enough time to meet demanding industry-driven market deployment requirements, which are expected to be mandated around 2030. ST54M is an advanced single-die solution that integrates an NFC controller with a secure element supporting secure applications, eSIM and NFC-compliant products. A key feature is its hardware accelerator for post-quantum cryptography algorithms, including ML-KEM and ML-DSA, supporting the transition from hybrid cryptographic approaches toward full post-quantum deployment. The hardware engine is designed to address emerging PQC requirements while helping protect against side-channel and fault-injection attacks and is the latest result from ST’s long-term commitment that also includes certified software libraries NesLib-PQML and X-CUBE-PQC in STM32 microcontrollers. In addition to its security architecture, the device integrates large memory capacity to support multiple applications and includes an enhanced RF front end. These capabilities can help improve performance with smaller antennas and single-ended configurations, support more stable reader-writer operation, and enable demanding use cases such as mobile Point-of-Sale (mPOS) and wireless charging. The platform has completed certification testing under Common Criteria 2022 EUCC and EMVCo, underscoring its suitability for security-sensitive mobile applications. ST54M sampling is available for customers, with production and certification targeted for July 2026.お知らせ • Jun 22STMicroelectronics Unveils VL53L9 Direct Time-Of-Flight 3D LiDAR ModuleSTMicroelectronics unveiled the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module. VL53L9 is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,268 zones (54x42), wide 54°x42° field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters. VL53L9 combines features in a compact and cost-effective package, delivering AI-ready output data for low-compute edge AI systems on small microcontrollers (MCUs) and high-performance sensing across robotics, industrial automation, smart buildings, AR/VR, and healthcare. VL53L9 is designed for multiple industry use cases: Robotics: enhanced small object detection, SLAM (simultaneous localization and mapping) and obstacle avoidance for autonomous navigation. Industrial automation: accurate volume measurement in tanks and bins, improving operational efficiency and inventory management. Smart buildings and homes: reliable human presence detection and people counting while preserving user privacy. AR/VR and consumer electronics: advanced gesture recognition, body tracking and finger skeleton for immersive user experiences. Healthcare: fall detection and monitoring solutions for eldercare and patient safety. The VL53L9 offers an unprecedented 2,268 resolution zones (54x42) with a wide 54°x42° field of view, enabling detailed 3D depth mapping and precise detection of small objects, contours, and edges. Leveraging ST’s proprietary stacked BSI SPAD sensor technology and innovative metasurface optical elements (MOE), the module delivers fast and accurate ranging from less than 5 cm up to 9 meters with up to 1% accuracy and a frame rate of 100 frames per second. The VL53L9’s dual-scan flood illumination replaces traditional dot scanning, reducing motion artifacts, eliminating dead zones, improving small-object detection, and capturing complementary 2D infrared and 3D depth images. Compared to competition, this greatly simplifies post-processing and enables a broad range of edge AI use cases to run efficiently on small MCUs with low compute requirements. The all-in-one module further integrates on-chip dToF processing, a dedicated power management IC, and is fully calibration-free, simplifying integration and reducing system cost and complexity. Measuring just 12.8 mm x 6.1 mm x 4.6 mm, the VL53L9 is a reflowable, single-component module compatible with a wide range of cover glass materials. It supports dual power supply operation (1.2 V and 3.3 V) and outputs data via MIPI or I3C interfaces, ensuring compatibility with diverse CPU architectures. The module is certified as Class 1 laser safe, providing reliable and secure operation for end users. ST FlightSense VL53L9 in mass production in early July 2026 with samples and volume shipments available to customers globally.株主還元SGMRCH SemiconductorCH 市場7D0%2.9%-0.9%1Yn/a122.3%17.7%株主還元を見る業界別リターン: SGMRがSwiss Semiconductor業界に対してどのようなパフォーマンスを示したかを判断するにはデータが不十分です。リターン対市場: SGMR Swiss市場に対してどのようなパフォーマンスを示したかを判断するにはデータが不十分です。価格変動Is SGMR's price volatile compared to industry and market?SGMR volatilitySGMR Average Weekly Movementn/aSemiconductor Industry Average Movement10.3%Market Average Movement4.1%10% most volatile stocks in CH Market7.8%10% least volatile stocks in CH Market2.2%安定した株価: SGMRの株価は、 Swiss市場と比較して過去 3 か月間で変動しています。時間の経過による変動: 過去 1 年間のSGMRのボラティリティの変化を判断するには データが不十分です。会社概要設立従業員CEO（最高経営責任者ウェブサイト198749,000Jean-Marc Cherywww.st.com/content/st_com/en.htmlSTMicroelectronics N.V.は、その子会社とともに、欧州、中東、アフリカ、米州、アジア太平洋地域で半導体製品の設計、開発、製造、販売を行っている。アナログ製品、MEMSおよびセンサー・グループ（AM&S）、パワーおよびディスクリート製品（P&D）、エンベデッド・プロセッシング（EMP）、RF製品（D&RF）の各セグメントを通じて事業を展開している。産業用特定用途向け集積回路（ASIC）および特定用途向け標準製品（ASSP）、電源管理ソリューション、カスタムアナログIC、ワイヤレス充電ソリューション、ガルバニック絶縁ゲートおよびLEDドライバ、コンバータ、トランジスタ、インテリジェントパワースイッチ、クロックおよびタイマー、コンパレータ、電流センスアンプなどを提供している；加速度センサー、ジャイロスコープ、磁気センサー、圧力、温度、存在検知、バイオセンサー、機械学習、エッジAI処理スマートセンサーを含むマイクロ電気機械システム（MEMS）センサー、サーマルアクチュエーター、圧電アクチュエーター、光学センシングソリューション。また、シリコンMOSFET、SiC MOSFET、IGBT、サイリスタ、整流器、パワーモジュールとバイポーラトランジスタ、マイクロコントローラ、車載用マイクロコントローラとセキュア、無線周波数（RF）通信とASIC、カーインフォテインメント製品、超広帯域とレーダーシステム、コネクテッドセキュリティ製品、自動車運転支援システムも提供している。自動車、産業、パーソナル・エレクトロニクスおよび通信機器、コンピュータおよび周辺機器市場にサービスを提供している。STMicroelectronics N.V.は1987年に設立され、オランダのスキポールに本社を置いている。もっと見るSTMicroelectronics N.V. 基礎のまとめSTMicroelectronics の収益と売上を時価総額と比較するとどうか。SGMR 基礎統計学時価総額CHF 37.66b収益（TTM）CHF 377.54m売上高(TTM)CHF 10.61b99.8xPER（株価収益率3.5xP/SレシオSGMR は割高か？公正価値と評価分析を参照収益と収入最新の決算報告書（TTM）に基づく主な収益性統計SGMR 損益計算書（TTM）収益US$13.10b売上原価US$8.61b売上総利益US$4.49bその他の費用US$4.03b収益US$466.00m直近の収益報告Jun 27, 2026次回決算日Oct 29, 2026一株当たり利益（EPS）0.52グロス・マージン34.29%純利益率3.56%有利子負債／自己資本比率21.8%SGMR の長期的なパフォーマンスは？過去の実績と比較を見る配当金0.7%現在の配当利回り69%配当性向View Valuation企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/08/04 02:24終値2026/07/10 00:00収益2026/06/27年間収益2025/12/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレークこのレポートを生成するために使用した分析モデルの詳細は、当社のGitHubページでご覧いただけます。また、レポートの活用方法に関するガイドやYouTubeのチュートリアルも用意しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋STMicroelectronics N.V. 19 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。45 アナリスト機関George ChangAletheia Analyst Network LimitedAlexi UngerArete Research Services LLPBrett SimpsonArete Research Services LLP42 その他のアナリストを表示
お知らせ • Jul 24Stmicroelectronics N.V. Provides Earnings Guidance for the Third Quarter Ending September 26, 2026 and Fourth Quarter of 2026STMicroelectronics N.V. provided earnings guidance for the third quarter ending September 26, 2026 and fourth quarter of 2026. For the third quarter, business outlook, at the mid-point, is for net revenues of $3.70 billion, increasing about 6.2% sequentially and about 16.2% year-over-year. For the fourth quarter, the company expects revenues to be above $4 billion, this translates into a H2 vs H1 growth above normal 15% seasonality.
お知らせ • Jun 24STMicroelectronics Unveils ST54M Secure Mobile Chip with Post-Quantum Cryptography for Next-Generation Connected ServicesSTMicroelectronics introduced the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready security requirements while supporting a seamless user experience across connected services. ST54M brings to the market a single-die device featuring an innovative hardware accelerator for post-quantum cryptography (PQC), combined with NFC, secure element and eSIM functionality, delivering a powerful future-ready solution for secure mobile connectivity and services. The solution supports a wide range of use cases, including contactless payments, transit ticketing, access control, digital identity, driving licenses, connectivity services, and digital car keys. ST54M addresses this need by enabling OEMs and ecosystem partners to support multiple applications on one platform while preparing for the transition toward PQC. The device is designed for use across personal electronics ecosystems involving mobile network operators, banks, governments, transit operators, car manufacturers, digital-wallet and service providers. It helps manufacturers create devices that preserve a stable and familiar user experience while meeting stronger long-term security expectations. ST54M enables customers and partners to deliver post-quantum-ready implementations with enough time to meet demanding industry-driven market deployment requirements, which are expected to be mandated around 2030. ST54M is an advanced single-die solution that integrates an NFC controller with a secure element supporting secure applications, eSIM and NFC-compliant products. A key feature is its hardware accelerator for post-quantum cryptography algorithms, including ML-KEM and ML-DSA, supporting the transition from hybrid cryptographic approaches toward full post-quantum deployment. The hardware engine is designed to address emerging PQC requirements while helping protect against side-channel and fault-injection attacks and is the latest result from ST’s long-term commitment that also includes certified software libraries NesLib-PQML and X-CUBE-PQC in STM32 microcontrollers. In addition to its security architecture, the device integrates large memory capacity to support multiple applications and includes an enhanced RF front end. These capabilities can help improve performance with smaller antennas and single-ended configurations, support more stable reader-writer operation, and enable demanding use cases such as mobile Point-of-Sale (mPOS) and wireless charging. The platform has completed certification testing under Common Criteria 2022 EUCC and EMVCo, underscoring its suitability for security-sensitive mobile applications. ST54M sampling is available for customers, with production and certification targeted for July 2026.
お知らせ • Jun 22STMicroelectronics Unveils VL53L9 Direct Time-Of-Flight 3D LiDAR ModuleSTMicroelectronics unveiled the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module. VL53L9 is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,268 zones (54x42), wide 54°x42° field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters. VL53L9 combines features in a compact and cost-effective package, delivering AI-ready output data for low-compute edge AI systems on small microcontrollers (MCUs) and high-performance sensing across robotics, industrial automation, smart buildings, AR/VR, and healthcare. VL53L9 is designed for multiple industry use cases: Robotics: enhanced small object detection, SLAM (simultaneous localization and mapping) and obstacle avoidance for autonomous navigation. Industrial automation: accurate volume measurement in tanks and bins, improving operational efficiency and inventory management. Smart buildings and homes: reliable human presence detection and people counting while preserving user privacy. AR/VR and consumer electronics: advanced gesture recognition, body tracking and finger skeleton for immersive user experiences. Healthcare: fall detection and monitoring solutions for eldercare and patient safety. The VL53L9 offers an unprecedented 2,268 resolution zones (54x42) with a wide 54°x42° field of view, enabling detailed 3D depth mapping and precise detection of small objects, contours, and edges. Leveraging ST’s proprietary stacked BSI SPAD sensor technology and innovative metasurface optical elements (MOE), the module delivers fast and accurate ranging from less than 5 cm up to 9 meters with up to 1% accuracy and a frame rate of 100 frames per second. The VL53L9’s dual-scan flood illumination replaces traditional dot scanning, reducing motion artifacts, eliminating dead zones, improving small-object detection, and capturing complementary 2D infrared and 3D depth images. Compared to competition, this greatly simplifies post-processing and enables a broad range of edge AI use cases to run efficiently on small MCUs with low compute requirements. The all-in-one module further integrates on-chip dToF processing, a dedicated power management IC, and is fully calibration-free, simplifying integration and reducing system cost and complexity. Measuring just 12.8 mm x 6.1 mm x 4.6 mm, the VL53L9 is a reflowable, single-component module compatible with a wide range of cover glass materials. It supports dual power supply operation (1.2 V and 3.3 V) and outputs data via MIPI or I3C interfaces, ensuring compatibility with diverse CPU architectures. The module is certified as Class 1 laser safe, providing reliable and secure operation for end users. ST FlightSense VL53L9 in mass production in early July 2026 with samples and volume shipments available to customers globally.
お知らせ • Jul 24Stmicroelectronics N.V. Provides Earnings Guidance for the Third Quarter Ending September 26, 2026 and Fourth Quarter of 2026STMicroelectronics N.V. provided earnings guidance for the third quarter ending September 26, 2026 and fourth quarter of 2026. For the third quarter, business outlook, at the mid-point, is for net revenues of $3.70 billion, increasing about 6.2% sequentially and about 16.2% year-over-year. For the fourth quarter, the company expects revenues to be above $4 billion, this translates into a H2 vs H1 growth above normal 15% seasonality.
お知らせ • Jun 24STMicroelectronics Unveils ST54M Secure Mobile Chip with Post-Quantum Cryptography for Next-Generation Connected ServicesSTMicroelectronics introduced the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready security requirements while supporting a seamless user experience across connected services. ST54M brings to the market a single-die device featuring an innovative hardware accelerator for post-quantum cryptography (PQC), combined with NFC, secure element and eSIM functionality, delivering a powerful future-ready solution for secure mobile connectivity and services. The solution supports a wide range of use cases, including contactless payments, transit ticketing, access control, digital identity, driving licenses, connectivity services, and digital car keys. ST54M addresses this need by enabling OEMs and ecosystem partners to support multiple applications on one platform while preparing for the transition toward PQC. The device is designed for use across personal electronics ecosystems involving mobile network operators, banks, governments, transit operators, car manufacturers, digital-wallet and service providers. It helps manufacturers create devices that preserve a stable and familiar user experience while meeting stronger long-term security expectations. ST54M enables customers and partners to deliver post-quantum-ready implementations with enough time to meet demanding industry-driven market deployment requirements, which are expected to be mandated around 2030. ST54M is an advanced single-die solution that integrates an NFC controller with a secure element supporting secure applications, eSIM and NFC-compliant products. A key feature is its hardware accelerator for post-quantum cryptography algorithms, including ML-KEM and ML-DSA, supporting the transition from hybrid cryptographic approaches toward full post-quantum deployment. The hardware engine is designed to address emerging PQC requirements while helping protect against side-channel and fault-injection attacks and is the latest result from ST’s long-term commitment that also includes certified software libraries NesLib-PQML and X-CUBE-PQC in STM32 microcontrollers. In addition to its security architecture, the device integrates large memory capacity to support multiple applications and includes an enhanced RF front end. These capabilities can help improve performance with smaller antennas and single-ended configurations, support more stable reader-writer operation, and enable demanding use cases such as mobile Point-of-Sale (mPOS) and wireless charging. The platform has completed certification testing under Common Criteria 2022 EUCC and EMVCo, underscoring its suitability for security-sensitive mobile applications. ST54M sampling is available for customers, with production and certification targeted for July 2026.
お知らせ • Jun 22STMicroelectronics Unveils VL53L9 Direct Time-Of-Flight 3D LiDAR ModuleSTMicroelectronics unveiled the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module. VL53L9 is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,268 zones (54x42), wide 54°x42° field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters. VL53L9 combines features in a compact and cost-effective package, delivering AI-ready output data for low-compute edge AI systems on small microcontrollers (MCUs) and high-performance sensing across robotics, industrial automation, smart buildings, AR/VR, and healthcare. VL53L9 is designed for multiple industry use cases: Robotics: enhanced small object detection, SLAM (simultaneous localization and mapping) and obstacle avoidance for autonomous navigation. Industrial automation: accurate volume measurement in tanks and bins, improving operational efficiency and inventory management. Smart buildings and homes: reliable human presence detection and people counting while preserving user privacy. AR/VR and consumer electronics: advanced gesture recognition, body tracking and finger skeleton for immersive user experiences. Healthcare: fall detection and monitoring solutions for eldercare and patient safety. The VL53L9 offers an unprecedented 2,268 resolution zones (54x42) with a wide 54°x42° field of view, enabling detailed 3D depth mapping and precise detection of small objects, contours, and edges. Leveraging ST’s proprietary stacked BSI SPAD sensor technology and innovative metasurface optical elements (MOE), the module delivers fast and accurate ranging from less than 5 cm up to 9 meters with up to 1% accuracy and a frame rate of 100 frames per second. The VL53L9’s dual-scan flood illumination replaces traditional dot scanning, reducing motion artifacts, eliminating dead zones, improving small-object detection, and capturing complementary 2D infrared and 3D depth images. Compared to competition, this greatly simplifies post-processing and enables a broad range of edge AI use cases to run efficiently on small MCUs with low compute requirements. The all-in-one module further integrates on-chip dToF processing, a dedicated power management IC, and is fully calibration-free, simplifying integration and reducing system cost and complexity. Measuring just 12.8 mm x 6.1 mm x 4.6 mm, the VL53L9 is a reflowable, single-component module compatible with a wide range of cover glass materials. It supports dual power supply operation (1.2 V and 3.3 V) and outputs data via MIPI or I3C interfaces, ensuring compatibility with diverse CPU architectures. The module is certified as Class 1 laser safe, providing reliable and secure operation for end users. ST FlightSense VL53L9 in mass production in early July 2026 with samples and volume shipments available to customers globally.
