View Financial HealthSTMicroelectronics 配当と自社株買い配当金 基準チェック /06STMicroelectronics配当を支払う会社であり、現在の利回りは0.69%です。主要情報0.7%配当利回り0.5%バイバック利回り総株主利回り1.1%将来の配当利回り0.7%配当成長4.1%次回配当支払日n/a配当落ち日n/a一株当たり配当金n/a配当性向69%最近の配当と自社株買いの更新更新なしすべての更新を表示Recent updatesお知らせ • Jul 24Stmicroelectronics N.V. Provides Earnings Guidance for the Third Quarter Ending September 26, 2026 and Fourth Quarter of 2026STMicroelectronics N.V. provided earnings guidance for the third quarter ending September 26, 2026 and fourth quarter of 2026. For the third quarter, business outlook, at the mid-point, is for net revenues of $3.70 billion, increasing about 6.2% sequentially and about 16.2% year-over-year. For the fourth quarter, the company expects revenues to be above $4 billion, this translates into a H2 vs H1 growth above normal 15% seasonality.お知らせ • Jun 24STMicroelectronics Unveils ST54M Secure Mobile Chip with Post-Quantum Cryptography for Next-Generation Connected ServicesSTMicroelectronics introduced the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready security requirements while supporting a seamless user experience across connected services. ST54M brings to the market a single-die device featuring an innovative hardware accelerator for post-quantum cryptography (PQC), combined with NFC, secure element and eSIM functionality, delivering a powerful future-ready solution for secure mobile connectivity and services. The solution supports a wide range of use cases, including contactless payments, transit ticketing, access control, digital identity, driving licenses, connectivity services, and digital car keys. ST54M addresses this need by enabling OEMs and ecosystem partners to support multiple applications on one platform while preparing for the transition toward PQC. The device is designed for use across personal electronics ecosystems involving mobile network operators, banks, governments, transit operators, car manufacturers, digital-wallet and service providers. It helps manufacturers create devices that preserve a stable and familiar user experience while meeting stronger long-term security expectations. ST54M enables customers and partners to deliver post-quantum-ready implementations with enough time to meet demanding industry-driven market deployment requirements, which are expected to be mandated around 2030. ST54M is an advanced single-die solution that integrates an NFC controller with a secure element supporting secure applications, eSIM and NFC-compliant products. A key feature is its hardware accelerator for post-quantum cryptography algorithms, including ML-KEM and ML-DSA, supporting the transition from hybrid cryptographic approaches toward full post-quantum deployment. The hardware engine is designed to address emerging PQC requirements while helping protect against side-channel and fault-injection attacks and is the latest result from ST’s long-term commitment that also includes certified software libraries NesLib-PQML and X-CUBE-PQC in STM32 microcontrollers. In addition to its security architecture, the device integrates large memory capacity to support multiple applications and includes an enhanced RF front end. These capabilities can help improve performance with smaller antennas and single-ended configurations, support more stable reader-writer operation, and enable demanding use cases such as mobile Point-of-Sale (mPOS) and wireless charging. The platform has completed certification testing under Common Criteria 2022 EUCC and EMVCo, underscoring its suitability for security-sensitive mobile applications. ST54M sampling is available for customers, with production and certification targeted for July 2026.お知らせ • Jun 22STMicroelectronics Unveils VL53L9 Direct Time-Of-Flight 3D LiDAR ModuleSTMicroelectronics unveiled the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module. VL53L9 is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,268 zones (54x42), wide 54°x42° field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters. VL53L9 combines features in a compact and cost-effective package, delivering AI-ready output data for low-compute edge AI systems on small microcontrollers (MCUs) and high-performance sensing across robotics, industrial automation, smart buildings, AR/VR, and healthcare. VL53L9 is designed for multiple industry use cases: Robotics: enhanced small object detection, SLAM (simultaneous localization and mapping) and obstacle avoidance for autonomous navigation. Industrial automation: accurate volume measurement in tanks and bins, improving operational efficiency and inventory management. Smart buildings and homes: reliable human presence detection and people counting while preserving user privacy. AR/VR and consumer electronics: advanced gesture recognition, body tracking and finger skeleton for immersive user experiences. Healthcare: fall detection and monitoring solutions for eldercare and patient safety. The VL53L9 offers an unprecedented 2,268 resolution zones (54x42) with a wide 54°x42° field of view, enabling detailed 3D depth mapping and precise detection of small objects, contours, and edges. Leveraging ST’s proprietary stacked BSI SPAD sensor technology and innovative metasurface optical elements (MOE), the module delivers fast and accurate ranging from less than 5 cm up to 9 meters with up to 1% accuracy and a frame rate of 100 frames per second. The VL53L9’s dual-scan flood illumination replaces traditional dot scanning, reducing motion artifacts, eliminating dead zones, improving small-object detection, and capturing complementary 2D infrared and 3D depth images. Compared to competition, this greatly simplifies post-processing and enables a broad range of edge AI use cases to run efficiently on small MCUs with low compute requirements. The all-in-one module further integrates on-chip dToF processing, a dedicated power management IC, and is fully calibration-free, simplifying integration and reducing system cost and complexity. Measuring just 12.8 mm x 6.1 mm x 4.6 mm, the VL53L9 is a reflowable, single-component module compatible with a wide range of cover glass materials. It supports dual power supply operation (1.2 V and 3.3 V) and outputs data via MIPI or I3C interfaces, ensuring compatibility with diverse CPU architectures. The module is certified as Class 1 laser safe, providing reliable and secure operation for end users. ST FlightSense VL53L9 in mass production in early July 2026 with samples and volume shipments available to customers globally.決済の安定と成長配当データの取得安定した配当: SGMRはSwiss市場で注目すべき配当金を支払っていないため、支払いが安定しているかどうかを確認する必要はありません。増加する配当: SGMRはSwiss市場で注目すべき配当金を支払っていないため、支払額が増加しているかどうかを確認する必要はありません。配当利回り対市場STMicroelectronics 配当利回り対市場SGMR 配当利回りは市場と比べてどうか？セグメント配当利回り会社 (SGMR)0.7%市場下位25% (CH)2.0%市場トップ25% (CH)3.6%業界平均 (Semiconductor)0.5%アナリスト予想 (SGMR) (最長3年)0.7%注目すべき配当: SGMRの配当金 ( 0.69% ) はSwiss市場の配当金支払者の下位 25% ( 2% ) と比べると目立ったものではありません。高配当: SGMRの配当金 ( 0.69% ) はSwiss市場の配当金支払者の上位 25% ( 3.62% ) と比較すると低いです。株主への利益配当収益カバレッジ: SGMR Swiss市場において目立った配当金を支払っていません。株主配当金キャッシュフローカバレッジ: SGMR Swiss市場において目立った配当金を支払っていません。高配当企業の発掘7D1Y7D1Y7D1YCH 市場の強力な配当支払い企業。View Management企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/08/04 07:36終値2026/07/10 00:00収益2026/06/27年間収益2025/12/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレークこのレポートを生成するために使用した分析モデルの詳細は、当社のGitHubページでご覧いただけます。また、レポートの活用方法に関するガイドやYouTubeのチュートリアルも用意しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋STMicroelectronics N.V. 19 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。45 アナリスト機関George ChangAletheia Analyst Network LimitedAlexi UngerArete Research Services LLPBrett SimpsonArete Research Services LLP42 その他のアナリストを表示
お知らせ • Jul 24Stmicroelectronics N.V. Provides Earnings Guidance for the Third Quarter Ending September 26, 2026 and Fourth Quarter of 2026STMicroelectronics N.V. provided earnings guidance for the third quarter ending September 26, 2026 and fourth quarter of 2026. For the third quarter, business outlook, at the mid-point, is for net revenues of $3.70 billion, increasing about 6.2% sequentially and about 16.2% year-over-year. For the fourth quarter, the company expects revenues to be above $4 billion, this translates into a H2 vs H1 growth above normal 15% seasonality.
お知らせ • Jun 24STMicroelectronics Unveils ST54M Secure Mobile Chip with Post-Quantum Cryptography for Next-Generation Connected ServicesSTMicroelectronics introduced the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready security requirements while supporting a seamless user experience across connected services. ST54M brings to the market a single-die device featuring an innovative hardware accelerator for post-quantum cryptography (PQC), combined with NFC, secure element and eSIM functionality, delivering a powerful future-ready solution for secure mobile connectivity and services. The solution supports a wide range of use cases, including contactless payments, transit ticketing, access control, digital identity, driving licenses, connectivity services, and digital car keys. ST54M addresses this need by enabling OEMs and ecosystem partners to support multiple applications on one platform while preparing for the transition toward PQC. The device is designed for use across personal electronics ecosystems involving mobile network operators, banks, governments, transit operators, car manufacturers, digital-wallet and service providers. It helps manufacturers create devices that preserve a stable and familiar user experience while meeting stronger long-term security expectations. ST54M enables customers and partners to deliver post-quantum-ready implementations with enough time to meet demanding industry-driven market deployment requirements, which are expected to be mandated around 2030. ST54M is an advanced single-die solution that integrates an NFC controller with a secure element supporting secure applications, eSIM and NFC-compliant products. A key feature is its hardware accelerator for post-quantum cryptography algorithms, including ML-KEM and ML-DSA, supporting the transition from hybrid cryptographic approaches toward full post-quantum deployment. The hardware engine is designed to address emerging PQC requirements while helping protect against side-channel and fault-injection attacks and is the latest result from ST’s long-term commitment that also includes certified software libraries NesLib-PQML and X-CUBE-PQC in STM32 microcontrollers. In addition to its security architecture, the device integrates large memory capacity to support multiple applications and includes an enhanced RF front end. These capabilities can help improve performance with smaller antennas and single-ended configurations, support more stable reader-writer operation, and enable demanding use cases such as mobile Point-of-Sale (mPOS) and wireless charging. The platform has completed certification testing under Common Criteria 2022 EUCC and EMVCo, underscoring its suitability for security-sensitive mobile applications. ST54M sampling is available for customers, with production and certification targeted for July 2026.
お知らせ • Jun 22STMicroelectronics Unveils VL53L9 Direct Time-Of-Flight 3D LiDAR ModuleSTMicroelectronics unveiled the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module. VL53L9 is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,268 zones (54x42), wide 54°x42° field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters. VL53L9 combines features in a compact and cost-effective package, delivering AI-ready output data for low-compute edge AI systems on small microcontrollers (MCUs) and high-performance sensing across robotics, industrial automation, smart buildings, AR/VR, and healthcare. VL53L9 is designed for multiple industry use cases: Robotics: enhanced small object detection, SLAM (simultaneous localization and mapping) and obstacle avoidance for autonomous navigation. Industrial automation: accurate volume measurement in tanks and bins, improving operational efficiency and inventory management. Smart buildings and homes: reliable human presence detection and people counting while preserving user privacy. AR/VR and consumer electronics: advanced gesture recognition, body tracking and finger skeleton for immersive user experiences. Healthcare: fall detection and monitoring solutions for eldercare and patient safety. The VL53L9 offers an unprecedented 2,268 resolution zones (54x42) with a wide 54°x42° field of view, enabling detailed 3D depth mapping and precise detection of small objects, contours, and edges. Leveraging ST’s proprietary stacked BSI SPAD sensor technology and innovative metasurface optical elements (MOE), the module delivers fast and accurate ranging from less than 5 cm up to 9 meters with up to 1% accuracy and a frame rate of 100 frames per second. The VL53L9’s dual-scan flood illumination replaces traditional dot scanning, reducing motion artifacts, eliminating dead zones, improving small-object detection, and capturing complementary 2D infrared and 3D depth images. Compared to competition, this greatly simplifies post-processing and enables a broad range of edge AI use cases to run efficiently on small MCUs with low compute requirements. The all-in-one module further integrates on-chip dToF processing, a dedicated power management IC, and is fully calibration-free, simplifying integration and reducing system cost and complexity. Measuring just 12.8 mm x 6.1 mm x 4.6 mm, the VL53L9 is a reflowable, single-component module compatible with a wide range of cover glass materials. It supports dual power supply operation (1.2 V and 3.3 V) and outputs data via MIPI or I3C interfaces, ensuring compatibility with diverse CPU architectures. The module is certified as Class 1 laser safe, providing reliable and secure operation for end users. ST FlightSense VL53L9 in mass production in early July 2026 with samples and volume shipments available to customers globally.