Global Digitalization Will Drive Advanced Packaging And Wafer Bonding

Published
28 Jul 25
Updated
21 Aug 25
AnalystHighTarget's Fair Value
€60.00
54.0% undervalued intrinsic discount
21 Aug
€27.58
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1Y
-48.7%
7D
0.5%

Author's Valuation

€60.0

54.0% undervalued intrinsic discount

AnalystHighTarget Fair Value