Duyuru • Jun 19
Synopsys Announces Availability of the First Wave of Multiphysics Fusion Solutions Synopsys, Inc. announced availability of its first Multiphysics Fusion solutions for customer deployment. The Multiphysics Fusion portfolio combines Synopsys' AI-powered EDA solutions with Ansys golden signoff analysis across timing signoff, design closure, multi-die design, and analog workflows. The first Multiphysics Fusion solutions include targeted GPU-accelerated flows powered by NVIDIA CUDA-X libraries such as cuDSS. Multiphysics Fusion for Timing Signoff enables up to 3x faster runtimes, SPICE-accurate multiphysics timing analysis. Integrates Synopsys PrimeTime with RedHawk-SC and RedHawk-SC Electrothermal, along with unified full-spectrum RC extraction using Synopsys StarRC and multiphysics HFSS-IC, to incorporate IR, thermal, and stress effects, improving margins and reducing IR-induced timing escapes. Multiphysics Fusion for Design Closure delivers up to 10x faster design closure with higher engineering change order (ECO) success rates and improved power, performance and area (PPA). Combines Synopsys PrimeClosure with RedHawk-SC to embed power integrity into golden signoff optimization, accelerating convergence with fewer iterations. Multiphysics Fusion for Multi-die Designs provides unified Synopsys 3DIC Compiler platform with RedHawk-SC, RedHawk-SC Electrothermal and multiphysics HFSS-IC for concurrent power integrity, thermal, and electromagnetic analysis, providing early system insights from exploration to golden signoff with correct-by-construction design. Multiphysics Fusion for Analog & Photonic Design integrates Synopsys Custom Compiler with multiphysics HFSS-IC for on-chip, high accuracy electromagnetic analysis into the analog design flow, and Synopsys OptoCompiler with Lumerical enabling end-to-end photonic IC and co-packaged optics systems. Early engagements with semiconductor and systems companies validate the value of Multiphysics Fusion solutions. Synopsys Multiphysics Fusion solutions enable up to 5x faster design closure and up to 86% IR fix rates in selected pilot designs. Synopsys' Multiphysics Fusion technology provides a unified, all-aware timing signoff platform by integrating PrimeTime with multiphysics insight, delivering SPICE-accurate correlation and enabling margin recovery. The Cisco Silicon One group is leveraging Synopsys Multiphysics Fusion technology to unify IR drop effects within signoff design closure to gain earlier, more accurate visibility into real-world conditions. Combined with signoff-accurate, timing-aware IR fixing, this enables predictive optimization—helping Cisco Silicon One converge on power integrity issues faster, deliver better PPA, and achieve significantly faster runtime. Multiphysics Fusion solutions for timing signoff, design closure, multi-die design, and analog and photonic design are available. Duyuru • Jun 04
GlobalFoundries Inc. (NasdaqGS:GFS) completed the acquisition of Processor IP Solutions Business of Synopsys, Inc. (NasdaqGS:SNPS). GlobalFoundries Inc. (NasdaqGS:GFS) entered into a definitive agreement to acquire Processor IP Solutions Business of Synopsys, Inc. (NasdaqGS:SNPS) on January 14, 2026. GF is acquiring the Synopsys Processor IP portfolio, which consists of ARC-V™ (RISC-V) and ARC® CPU IP, DSP IP, Neural Network Processing Unit (NPU) IP, and related software development tools, including ARC MetaWare Development Toolkits. The transaction also includes Synopsys' ASIP Designer™ and ASIP Programmer™ tools for automating the design and implementation of application-specific instruction-set processors (ASIPs).
The transaction is expected to be completed in the second half of calendar year 2026, subject to the satisfaction of customary closing conditions, including the receipt of required regulatory approvals.
GlobalFoundries Inc. (NasdaqGS:GFS) completed the acquisition of Processor IP Solutions Business of Synopsys, Inc. (NasdaqGS:SNPS) on June 2, 2026. Duyuru • May 28
Synopsys, Inc. Provides Earnings Guidance for the Third Quarter Ending July 31, 2026 and Revises Earnings Guidance for the Fiscal Year Ending October 31, 2026 Synopsys, Inc. provided earnings guidance for the third quarter ending July 31, 2026. For the quarter, the company expects revenue to be in the range of $2,410 million to $2,460 million and GAAP EPS to be in the range of $0.84 to $0.98.
The company revised earnings guidance for the fiscal year ending October 31, 2026. For the year, the company expects revenue to be in the range of $9,625 million to $9,705 million and GAAP EPS to be in the range of $2.49 to $2.91. The company is raising targets for revenue and EPS for the year, as the company drive greater efficiency across the business. Raising expectations for full-year total revenue to $9,665 million at the midpoint against previously expected total revenue midpoint of $9,610 million, driven by strong performance across the business and an EPS-neutral Ansys channel-related accounting impact, partly offset by the impending close of the Processor IP Solutions business. Duyuru • Apr 28
Synopsys, Inc. to Report Q2, 2026 Results on May 27, 2026 Synopsys, Inc. announced that they will report Q2, 2026 results at 4:00 PM, US Eastern Standard Time on May 27, 2026 Duyuru • Apr 09
Ultra Accelerator Link Consortium Publishes Four Specifications Defining In-Network Compute, Chiplets, Manageability and 200G Performance Ultra Accelerator Link Consortium, the industry standards organization developing the open scale-up interconnect for next-generation AI workloads, announced the ratification of the next UALink Specification, which encompasses three major additions – In-Network Compute, Chiplet Definition, and Manageability. The new specifications support the deployment of UALink solutions in multi-workload environments, while simultaneously helping improve UALink technology efficiency, performance for AI workloads and ease of implementation. The UALink Consortium provides a standardized foundation for accelerator connectivity at scale, helping drive innovation, increase deployment flexibility and support the rapidly growing performance demands of next-generation AI workloads. The new specification update is facilitated through UALink Consortium’s open governance model, which fosters innovation while enabling a robust, multi-vendor supply chain, providing system designers and cloud providers with the necessary flexibility to deploy interoperable solutions without vendor lock-in. New UALink Specifications: UALink Common Specification 2.0 introduces In-Network Compute for UALink technology, facilitating computation and communication between accelerators. Reduces latency, saves bandwidth, and improves scaling efficiency for distributed training and inference for AI solutions for complex and multi-workload environments for UALink systems. UALink 200G Data Link and Physical Layers (DL/PL) Specification 2.0 split the DL/PL Specification from the UALink Common Specification to enable UALink to move quickly as new physical layers and speeds are needed by the industry without requiring changes to the other specifications. UALink Manageability Specification 1.0 introduces UALink as a system with centralized control and management planes. Utilizes standardized protocols, modeling and APIs like gNMI, Yang, SAI and Redfish. UALink Chiplet Specification 1.0 defines the necessary information to integrate UALink technology into chiplet-based SoCs, including interfaces, form factors, flow control and chiplet management standardization. Fully compliant with the UCIe 3.0 Specification for simplified integration into existing chiplet ecosystems. All of the UALink specifications are available for public download. Duyuru • Mar 30
Synopsys, Inc. announced that it has received funding from Elliott Investment Management L.P. Synopsys, Inc announced a private placement to issue several billion dollars on March 28, 2026. The transaction included participation from new investor Elliott Investment Management L.P and issued common shares. Duyuru • Mar 10
Synopsys Launches Electronics Digital Twin Platform For Physical AI System Development Synopsys, Inc. launched the Synopsys Electronics Digital Twin (eDT) Platform, a first-of-its-kind, open solution to accelerate the creation, management, deployment, and use of electronics digital twins (eDTs) critical for software-defined product development enabling physical AI systems. The platform enables users to configure cloud-based eDT Labs, a collection of pre-integrated assets including Synopsys technologies, open-ecosystem tools, models, software, and scalable compute for high-value automotive use cases. The eDT Platform includes Synopsys and partner capabilities that can be used to establish eDT Labs such as Synopsys' virtualization and AI technologies, advanced debug, test tools, ecosystem integration, and blueprints to rapidly build and validate eDTs. System composition uses the open-source SIL Kit by Vector and Synopsys, enabling teams to rapidly assemble and connect virtual ECUs, models, and software components. A broad set of pre-integrated ecosystem partner technologies including silicon models; simulation, debug and analysis tools; and software IP; among others. eDT Labs can be deployed and managed easily using platform capabilities, including provisioning, role-based user management, secure access and encryption, administrative analytics, global license provisioning, and a workflow editor. User interfaces, applications, and APIs (CLI and TEST APIs) integrate with commercial and customer software factory solutions. Flexible compute options with SaaS or BYOC deployment options leverage flexible compute in the cloud, powered by AWS cloud infrastructure and AWS Graviton4 processors delivering computational performance and flexibility required for modern automotive development. The platform enables OEMs to achieve up to 90% of software validation prior to hardware availability by shifting software development and system integration "left," reducing vehicle development cost and time-to-market. The platform enables seamless collaboration between customer teams, suppliers and tool vendors to accelerate time to market. Integration in continuous integration/testing workflows with rapid provisioning of eDTs reduces validation effort while improving software quality. 
