Taiwan Semiconductor Manufacturing Dividend
Dividend criteria checks 4/6
Taiwan Semiconductor Manufacturing is a dividend paying company with a current yield of 2.41% that is well covered by earnings. Next payment date is on 11th January, 2024 with an ex-dividend date of 14th December, 2023.
Key information
2.4%
Dividend yield
35%
Payout ratio
Industry average yield | 0.7% |
Next dividend pay date | 11 Jan 24 |
Ex dividend date | 14 Dec 23 |
Dividend per share | n/a |
Earnings per share | US$34.54 |
Dividend yield forecast in 3Y | 2.4% |
Recent dividend updates
Recent updates
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: TSMW.F's dividends per share have been stable in the past 10 years.
Growing Dividend: TSMW.F's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
Taiwan Semiconductor Manufacturing Dividend Yield vs Market |
---|
Segment | Dividend Yield |
---|---|
Company (TSMW.F) | 2.4% |
Market Bottom 25% (US) | 1.5% |
Market Top 25% (US) | 4.6% |
Industry Average (Semiconductor) | 0.7% |
Analyst forecast in 3 Years (TSMW.F) | 2.4% |
Notable Dividend: TSMW.F's dividend (2.41%) is higher than the bottom 25% of dividend payers in the US market (1.57%).
High Dividend: TSMW.F's dividend (2.41%) is low compared to the top 25% of dividend payers in the US market (4.85%).
Earnings Payout to Shareholders
Earnings Coverage: With its reasonably low payout ratio (35.5%), TSMW.F's dividend payments are well covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its high cash payout ratio (170.7%), TSMW.F's dividend payments are not well covered by cash flows.