Chipbond Technology Dividends and Buybacks
Dividend criteria checks 5/6
Chipbond Technology is a dividend paying company with a current yield of 5.86% that is well covered by earnings.
Key information
5.9%
Dividend yield
n/a
Buyback Yield
| Total Shareholder Yield | n/a |
| Future Dividend Yield | 5.8% |
| Dividend Growth | 5.1% |
| Next dividend pay date | n/a |
| Ex dividend date | n/a |
| Dividend per share | NT$3.750 |
| Payout ratio | 70% |
Recent dividend and buyback updates
Recent updates
Investors Will Want Chipbond Technology's (GTSM:6147) Growth In ROCE To Persist
Apr 17
These 4 Measures Indicate That Chipbond Technology (GTSM:6147) Is Using Debt Reasonably Well
Apr 02An Intrinsic Calculation For Chipbond Technology Corporation (GTSM:6147) Suggests It's 47% Undervalued
Mar 19Analysts Just Made A Neat Upgrade To Their Chipbond Technology Corporation (GTSM:6147) Forecasts
Mar 03Did You Participate In Any Of Chipbond Technology's (GTSM:6147) Respectable 69% Return?
Feb 23Investors In Chipbond Technology Corporation (GTSM:6147) Should Consider This, First
Feb 02Is Chipbond Technology (GTSM:6147) A Future Multi-bagger?
Dec 26We Think Chipbond Technology (GTSM:6147) Can Stay On Top Of Its Debt
Dec 08
Chipbond Technology (GTSM:6147) Has Compensated Shareholders With A Respectable 78% Return On Their Investment
Nov 23Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 6147's dividend payments have been volatile in the past 10 years.
Growing Dividend: 6147's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
| Chipbond Technology Dividend Yield vs Market |
|---|
| Segment | Dividend Yield |
|---|---|
| Company (6147) | 5.9% |
| Market Bottom 25% (TW) | 1.8% |
| Market Top 25% (TW) | 4.5% |
| Industry Average (Semiconductor) | 2.0% |
| Analyst forecast (6147) (up to 3 years) | 5.8% |
Notable Dividend: 6147's dividend (5.86%) is higher than the bottom 25% of dividend payers in the TW market (1.76%).
High Dividend: 6147's dividend (5.86%) is in the top 25% of dividend payers in the TW market (4.52%)
Earnings Payout to Shareholders
Earnings Coverage: With its reasonable payout ratio (70%), 6147's dividend payments are covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: At its current cash payout ratio (78.1%), 6147's dividend payments are covered by cash flows.
Discover strong dividend paying companies
Company Analysis and Financial Data Status
| Data | Last Updated (UTC time) |
|---|---|
| Company Analysis | 2024/12/31 12:53 |
| End of Day Share Price | 2024/12/31 00:00 |
| Earnings | 2024/09/30 |
| Annual Earnings | 2023/12/31 |
Data Sources
The data used in our company analysis is from S&P Global Market Intelligence LLC. The following data is used in our analysis model to generate this report. Data is normalised which can introduce a delay from the source being available.
| Package | Data | Timeframe | Example US Source * |
|---|---|---|---|
| Company Financials | 10 years |
| |
| Analyst Consensus Estimates | +3 years |
|
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| Market Prices | 30 years |
| |
| Ownership | 10 years |
| |
| Management | 10 years |
| |
| Key Developments | 10 years |
|
* example for US securities, for non-US equivalent regulatory forms and sources are used.
Unless specified all financial data is based on a yearly period but updated quarterly. This is known as Trailing Twelve Month (TTM) or Last Twelve Month (LTM) Data. Learn more here.
Analysis Model and Snowflake
Details of the analysis model used to generate this report is available on our Github page, we also have guides on how to use our reports and tutorials on Youtube.
Learn about the world class team who designed and built the Simply Wall St analysis model.
Industry and Sector Metrics
Our industry and section metrics are calculated every 6 hours by Simply Wall St, details of our process are available on .
Analyst Sources
Chipbond Technology Corporation is covered by 26 analysts. 3 of those analysts submitted the estimates of revenue or earnings used as inputs to our report. Analysts submissions are updated throughout the day.
| Analyst | Institution |
|---|---|
| Wanping Yeh | Barclays |
| Daniel Heyler | BofA Global Research |
| Jack Lu | CGS International |