6147 Stock Overview
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally.
Notes are coming soon
Chipbond Technology Corporation Competitors
Price History & Performance
|Historical stock prices|
|Current Share Price||NT$60.70|
|52 Week High||NT$73.40|
|52 Week Low||NT$49.20|
|1 Month Change||2.88%|
|3 Month Change||15.40%|
|1 Year Change||-10.60%|
|3 Year Change||0.66%|
|5 Year Change||-6.76%|
|Change since IPO||240.61%|
Recent News & Updates
Investors Will Want Chipbond Technology's (GTSM:6147) Growth In ROCE To PersistApr 17
These 4 Measures Indicate That Chipbond Technology (GTSM:6147) Is Using Debt Reasonably WellApr 02
An Intrinsic Calculation For Chipbond Technology Corporation (GTSM:6147) Suggests It's 47% UndervaluedMar 19
Analysts Just Made A Neat Upgrade To Their Chipbond Technology Corporation (GTSM:6147) ForecastsMar 03
Did You Participate In Any Of Chipbond Technology's (GTSM:6147) Respectable 69% Return?Feb 23
Investors In Chipbond Technology Corporation (GTSM:6147) Should Consider This, FirstFeb 02
Is Chipbond Technology (GTSM:6147) A Future Multi-bagger?Dec 26
We Think Chipbond Technology (GTSM:6147) Can Stay On Top Of Its DebtDec 08
Chipbond Technology (GTSM:6147) Has Compensated Shareholders With A Respectable 78% Return On Their InvestmentNov 23
|6147||TW Semiconductor||TW Market|
Return vs Industry: 6147 exceeded the TW Semiconductor industry which returned -23.8% over the past year.
Return vs Market: 6147 exceeded the TW Market which returned -15.5% over the past year.
|6147 Average Weekly Movement||2.7%|
|Semiconductor Industry Average Movement||4.8%|
|Market Average Movement||4.0%|
|10% most volatile stocks in TW Market||7.2%|
|10% least volatile stocks in TW Market||1.8%|
Stable Share Price: 6147 is not significantly more volatile than the rest of TW stocks over the past 3 months, typically moving +/- 3% a week.
Volatility Over Time: 6147's weekly volatility (3%) has been stable over the past year.
About the Company
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. It also invests in, develops, manufactures, and sells electronic components; develops, produces, packages, tests, and sells integrated circuit products and semiconductor-specific materials, as well as provides after-sales services; and provides semiconductor components, semiconductor packaging and testing services, various electronics and computers, and communication circuit boards.
Chipbond Technology Corporation Fundamentals Summary
|6147 fundamental statistics|
Is 6147 overvalued?See Fair Value and valuation analysis
Earnings & Revenue
|6147 income statement (TTM)|
|Cost of Revenue||NT$16.95b|
Last Reported Earnings
Sep 30, 2022
Next Earnings Date
|Earnings per share (EPS)||9.18|
|Net Profit Margin||26.90%|
How did 6147 perform over the long term?See historical performance and comparison