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6147

Chipbond Technology TPEX:6147 Stock Report

Last Price

NT$60.70

Market Cap

NT$44.8b

7D

0%

1Y

-10.6%

Updated

26 Jan, 2023

Data

Company Financials +

Chipbond Technology Corporation

TPEX:6147 Stock Report

Mkt Cap: NT$44.8b

6147 Stock Overview

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally.

6147 fundamental analysis
Snowflake Score
Valuation4/6
Future Growth0/6
Past Performance3/6
Financial Health6/6
Dividends5/6

My Notes

New

Notes are coming soon

Chipbond Technology Corporation Competitors

Price History & Performance

Summary of all time highs, changes and price drops for Chipbond Technology
Historical stock prices
Current Share PriceNT$60.70
52 Week HighNT$73.40
52 Week LowNT$49.20
Beta0.61
1 Month Change2.88%
3 Month Change15.40%
1 Year Change-10.60%
3 Year Change0.66%
5 Year Change-6.76%
Change since IPO240.61%

Recent News & Updates

Recent updates

Investors Will Want Chipbond Technology's (GTSM:6147) Growth In ROCE To Persist

Apr 17
Investors Will Want Chipbond Technology's (GTSM:6147) Growth In ROCE To Persist

These 4 Measures Indicate That Chipbond Technology (GTSM:6147) Is Using Debt Reasonably Well

Apr 02
These 4 Measures Indicate That Chipbond Technology (GTSM:6147) Is Using Debt Reasonably Well

An Intrinsic Calculation For Chipbond Technology Corporation (GTSM:6147) Suggests It's 47% Undervalued

Mar 19
An Intrinsic Calculation For Chipbond Technology Corporation (GTSM:6147) Suggests It's 47% Undervalued

Analysts Just Made A Neat Upgrade To Their Chipbond Technology Corporation (GTSM:6147) Forecasts

Mar 03
Analysts Just Made A Neat Upgrade To Their Chipbond Technology Corporation (GTSM:6147) Forecasts

Did You Participate In Any Of Chipbond Technology's (GTSM:6147) Respectable 69% Return?

Feb 23
Did You Participate In Any Of Chipbond Technology's (GTSM:6147) Respectable 69% Return?

Investors In Chipbond Technology Corporation (GTSM:6147) Should Consider This, First

Feb 02
Investors In Chipbond Technology Corporation (GTSM:6147) Should Consider This, First

Is Chipbond Technology (GTSM:6147) A Future Multi-bagger?

Dec 26
Is Chipbond Technology (GTSM:6147) A Future Multi-bagger?

We Think Chipbond Technology (GTSM:6147) Can Stay On Top Of Its Debt

Dec 08
We Think Chipbond Technology (GTSM:6147) Can Stay On Top Of Its Debt

Chipbond Technology (GTSM:6147) Has Compensated Shareholders With A Respectable 78% Return On Their Investment

Nov 23
Chipbond Technology (GTSM:6147) Has Compensated Shareholders With A Respectable 78% Return On Their Investment

Shareholder Returns

6147TW SemiconductorTW Market
7D0%0%0.0004%
1Y-10.6%-23.8%-15.5%

Return vs Industry: 6147 exceeded the TW Semiconductor industry which returned -23.8% over the past year.

Return vs Market: 6147 exceeded the TW Market which returned -15.5% over the past year.

Price Volatility

Is 6147's price volatile compared to industry and market?
6147 volatility
6147 Average Weekly Movement2.7%
Semiconductor Industry Average Movement4.8%
Market Average Movement4.0%
10% most volatile stocks in TW Market7.2%
10% least volatile stocks in TW Market1.8%

Stable Share Price: 6147 is not significantly more volatile than the rest of TW stocks over the past 3 months, typically moving +/- 3% a week.

Volatility Over Time: 6147's weekly volatility (3%) has been stable over the past year.

About the Company

FoundedEmployeesCEOWebsite
1997n/an/ahttps://www.chipbond.com.tw

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. It also invests in, develops, manufactures, and sells electronic components; develops, produces, packages, tests, and sells integrated circuit products and semiconductor-specific materials, as well as provides after-sales services; and provides semiconductor components, semiconductor packaging and testing services, various electronics and computers, and communication circuit boards.

Chipbond Technology Corporation Fundamentals Summary

How do Chipbond Technology's earnings and revenue compare to its market cap?
6147 fundamental statistics
Market CapNT$44.84b
Earnings (TTM)NT$6.78b
Revenue (TTM)NT$25.21b

6.6x

P/E Ratio

1.8x

P/S Ratio

Earnings & Revenue

Key profitability statistics from the latest earnings report
6147 income statement (TTM)
RevenueNT$25.21b
Cost of RevenueNT$16.95b
Gross ProfitNT$8.27b
Other ExpensesNT$1.48b
EarningsNT$6.78b

Last Reported Earnings

Sep 30, 2022

Next Earnings Date

n/a

Earnings per share (EPS)9.18
Gross Margin32.79%
Net Profit Margin26.90%
Debt/Equity Ratio13.9%

How did 6147 perform over the long term?

See historical performance and comparison

Dividends

9.9%

Current Dividend Yield

65%

Payout Ratio