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Chipbond Technology CorporationTPEX:6147 Stock Report

Market Cap NT$206.3b
Share Price
NT$258.50
NT$235.67
9.7% overvalued intrinsic discount
1Y370.0%
7D13.6%
1D
Portfolio Value
View

Chipbond Technology Corporation

TPEX:6147 Stock Report

Market Cap: NT$206.3b

Chipbond Technology (6147) Stock Overview

Engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. More details

6147 fundamental analysis
Snowflake Score
Valuation1/6
Future Growth3/6
Past Performance1/6
Financial Health6/6
Dividends2/6

6147 Community Fair Values

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Chipbond Technology Corporation Competitors

Price History & Performance

Summary of share price highs, lows and changes for Chipbond Technology
Historical stock prices
Current Share PriceNT$258.50
52 Week HighNT$313.50
52 Week LowNT$50.20
Beta1.65
1 Month Change19.95%
3 Month Change265.11%
1 Year Change370.00%
3 Year Change310.97%
5 Year Change259.53%
Change since IPO1,350.55%

Recent News & Updates

Recent updates

Shareholder Returns

6147TW SemiconductorTW Market
7D13.6%4.1%2.8%
1Y370.0%157.9%110.4%

Return vs Industry: 6147 exceeded the TW Semiconductor industry which returned 167.2% over the past year.

Return vs Market: 6147 exceeded the TW Market which returned 117.9% over the past year.

Price Volatility

Is 6147's price volatile compared to industry and market?
6147 volatility
6147 Average Weekly Movement13.8%
Semiconductor Industry Average Movement9.7%
Market Average Movement6.3%
10% most volatile stocks in TW Market12.0%
10% least volatile stocks in TW Market2.6%

Stable Share Price: 6147's share price has been volatile over the past 3 months compared to the TW market.

Volatility Over Time: 6147's weekly volatility has increased from 8% to 14% over the past year.

About the Company

FoundedEmployeesCEOWebsite
1997n/aHuoo-Wen Gauwww.chipbond.com.tw

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning, dicing, and tape-and-reel processes, as well as chip-on-film, chip on glass, chip-on-plastic, packaging attachment, and wafer level chip scale packaging services. It also provides compound semiconductors including SiGe, GaAs, GaN, SiC, and other wafers; flexible tape-and-reel circuit substrate; and chip tray.

Chipbond Technology Corporation Fundamentals Summary

How do Chipbond Technology's earnings and revenue compare to its market cap?
6147 fundamental statistics
Market capNT$206.25b
Earnings (TTM)NT$2.54b
Revenue (TTM)NT$22.07b
75.7x
P/E Ratio
8.7x
P/S Ratio

Earnings & Revenue

Key profitability statistics from the latest earnings report (TTM)
6147 income statement (TTM)
RevenueNT$22.07b
Cost of RevenueNT$17.31b
Gross ProfitNT$4.76b
Other ExpensesNT$2.22b
EarningsNT$2.54b

Last Reported Earnings

Mar 31, 2026

Next Earnings Date

n/a

Earnings per share (EPS)3.42
Gross Margin21.57%
Net Profit Margin11.53%
Debt/Equity Ratio2.7%

How did 6147 perform over the long term?

See historical performance and comparison

Dividends

1.1%
Current Dividend Yield
82%
Payout Ratio

Does 6147 pay a reliable dividends?

See 6147 dividend history and benchmarks
When do you need to buy 6147 by to receive an upcoming dividend?
Chipbond Technology dividend dates
Ex Dividend DateJun 17 2026
Dividend Pay DateJul 15 2026
Days until Ex dividend7 days
Days until Dividend pay date21 days

Does 6147 pay a reliable dividends?

See 6147 dividend history and benchmarks

Company Analysis and Financial Data Status

DataLast Updated (UTC time)
Company Analysis2026/06/23 03:23
End of Day Share Price 2026/06/23 00:00
Earnings2026/03/31
Annual Earnings2025/12/31

Data Sources

The data used in our company analysis is from S&P Global Market Intelligence LLC. The following data is used in our analysis model to generate this report. Data is normalised which can introduce a delay from the source being available.

PackageDataTimeframeExample US Source *
Company Financials10 years
  • Income statement
  • Cash flow statement
  • Balance sheet
Analyst Consensus Estimates+3 years
  • Forecast financials
  • Analyst price targets
Market Prices30 years
  • Stock prices
  • Dividends, Splits and Actions
Ownership10 years
  • Top shareholders
  • Insider trading
Management10 years
  • Leadership team
  • Board of directors
Key Developments10 years
  • Company announcements

* Example for US securities, for non-US equivalent regulatory forms and sources are used.

Unless specified all financial data is based on a yearly period but updated quarterly. This is known as Trailing Twelve Month (TTM) or Last Twelve Month (LTM) Data. Learn more.

Analysis Model and Snowflake

Details of the analysis model used to generate this report is available on our Github page, we also have guides on how to use our reports and tutorials on Youtube.

Learn about the world class team who designed and built the Simply Wall St analysis model.

Industry and Sector Metrics

Our industry and section metrics are calculated every 6 hours by Simply Wall St, details of our process are available on Github.

Analyst Sources

Chipbond Technology Corporation is covered by 20 analysts. 6 of those analysts submitted the estimates of revenue or earnings used as inputs to our report. Analysts submissions are updated throughout the day.

AnalystInstitution
Wanping YehBarclays
Daniel HeylerBofA Global Research
Liyen ChenCapital Securities Corporation