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6147

Chipbond TechnologyTPEX:6147 Stock Report

Market Cap

NT$49.9b

7D

1.4%

1Y

1.4%

Updated

06 Dec, 2021

Data

Company Financials +
6147 fundamental analysis
Snowflake Score
Valuation5/6
Future Growth0/6
Past Performance4/6
Financial Health6/6
Dividends5/6

6147 Stock Overview

Chipbond Technology Corporation, together with its subsidiaries, provides services for backend assembly processing of LCD driver integrated circuits (ICs) in Taiwan, the United States, and internationally.

Chipbond Technology Competitors

ASE Technology Holding

TWSE:3711

NT$453.7b

Powertech Technology

TWSE:6239

NT$74.5b

King Yuan Electronics

TWSE:2449

NT$55.0b

ChipMOS TECHNOLOGIES

TWSE:8150

NT$34.4b

Price History & Performance

Summary of all time highs, changes and price drops for Chipbond Technology
Historical stock prices
Current Share PriceNT$67.50
52 Week HighNT$88.30
52 Week LowNT$60.30
Beta0.66
1 Month Change2.58%
3 Month Change-9.27%
1 Year Change1.35%
3 Year Change12.50%
5 Year Change51.35%
Change since IPO278.77%

Recent News & Updates

Apr 17
Investors Will Want Chipbond Technology's (GTSM:6147) Growth In ROCE To Persist

Investors Will Want Chipbond Technology's (GTSM:6147) Growth In ROCE To Persist

Finding a business that has the potential to grow substantially is not easy, but it is possible if we look at a few key...

Shareholder Returns

6147TW SemiconductorTW Market
7D1.4%2.2%2.1%
1Y1.4%26.2%24.9%

Return vs Industry: 6147 underperformed the TW Semiconductor industry which returned 29.5% over the past year.

Return vs Market: 6147 underperformed the TW Market which returned 25.8% over the past year.

Price Volatility

Is 6147's price volatile compared to industry and market?
6147 volatility
6147 Average Weekly Movement3.3%
Semiconductor Industry Average Movement6.6%
Market Average Movement4.6%
10% most volatile stocks in TW Market8.5%
10% least volatile stocks in TW Market1.9%

Stable Share Price: 6147 is not significantly more volatile than the rest of TW stocks over the past 3 months, typically moving +/- 3% a week.

Volatility Over Time: 6147's weekly volatility (3%) has been stable over the past year.

About the Company

FoundedEmployeesCEOWebsite
1997n/aFei-Jain Wuhttps://www.chipbond.com.tw

Chipbond Technology Corporation, together with its subsidiaries, provides services for backend assembly processing of LCD driver integrated circuits (ICs) in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. It also invests in, develops, manufactures, and sells electronic components, as well as tape automated bonding, tape carrier, and others.

Chipbond Technology Fundamentals Summary

How do Chipbond Technology's earnings and revenue compare to its market cap?
6147 fundamental statistics
Market CapNT$49.86b
Earnings (TTM)NT$5.46b
Revenue (TTM)NT$26.66b

9.1x

P/E Ratio

1.9x

P/S Ratio

Earnings & Revenue

Key profitability statistics from the latest earnings report
6147 income statement (TTM)
RevenueNT$26.66b
Cost of RevenueNT$18.32b
Gross ProfitNT$8.33b
ExpensesNT$2.87b
EarningsNT$5.46b

Last Reported Earnings

Sep 30, 2021

Next Earnings Date

n/a

Earnings per share (EPS)7.40
Gross Margin31.26%
Net Profit Margin20.50%
Debt/Equity Ratio16.7%

How did 6147 perform over the long term?

See historical performance and comparison

Dividends

5.6%

Current Dividend Yield

46%

Payout Ratio

Valuation

Is Chipbond Technology undervalued compared to its fair value and its price relative to the market?

>50%

Undervalued compared to fair value


Share Price vs. Fair Value

Below Fair Value: 6147 (NT$67.5) is trading below our estimate of fair value (NT$156.41)

Significantly Below Fair Value: 6147 is trading below fair value by more than 20%.


Price To Earnings Ratio

PE vs Industry: 6147 is good value based on its PE Ratio (9.1x) compared to the TW Semiconductor industry average (21.3x).

PE vs Market: 6147 is good value based on its PE Ratio (9.1x) compared to the TW market (16.8x).


Price to Earnings Growth Ratio

PEG Ratio: 6147's earnings are forecast to decline next year, so we can't calculate its PEG ratio.


Price to Book Ratio

PB vs Industry: 6147 is good value based on its PB Ratio (1.4x) compared to the TW Semiconductor industry average (3.1x).


Future Growth

How is Chipbond Technology forecast to perform in the next 1 to 3 years based on estimates from 10 analysts?

-0.6%

Forecasted annual earnings growth


Earnings and Revenue Growth Forecasts


Analyst Future Growth Forecasts

Earnings vs Savings Rate: 6147's earnings are forecast to decline over the next 3 years (-0.6% per year).

Earnings vs Market: 6147's earnings are forecast to decline over the next 3 years (-0.6% per year).

High Growth Earnings: 6147's earnings are forecast to decline over the next 3 years.

Revenue vs Market: 6147's revenue (2.8% per year) is forecast to grow slower than the TW market (9.7% per year).

High Growth Revenue: 6147's revenue (2.8% per year) is forecast to grow slower than 20% per year.


Earnings per Share Growth Forecasts


Future Return on Equity

Future ROE: 6147's Return on Equity is forecast to be low in 3 years time (15.4%).


Past Performance

How has Chipbond Technology performed over the past 5 years?

21.8%

Historical annual earnings growth


Earnings and Revenue History

Quality Earnings: 6147 has high quality earnings.

Growing Profit Margin: 6147's current net profit margins (20.5%) are higher than last year (16.6%).


Past Earnings Growth Analysis

Earnings Trend: 6147's earnings have grown significantly by 21.8% per year over the past 5 years.

Accelerating Growth: 6147's earnings growth over the past year (53.7%) exceeds its 5-year average (21.8% per year).

Earnings vs Industry: 6147 earnings growth over the past year (53.7%) underperformed the Semiconductor industry 66.2%.


Return on Equity

High ROE: 6147's Return on Equity (15.7%) is considered low.


Financial Health

How is Chipbond Technology's financial position?


Financial Position Analysis

Short Term Liabilities: 6147's short term assets (NT$12.0B) exceed its short term liabilities (NT$7.5B).

Long Term Liabilities: 6147's short term assets (NT$12.0B) exceed its long term liabilities (NT$4.5B).


Debt to Equity History and Analysis

Debt Level: 6147's net debt to equity ratio (6%) is considered satisfactory.

Reducing Debt: 6147's debt to equity ratio has reduced from 30% to 16.7% over the past 5 years.

Debt Coverage: 6147's debt is well covered by operating cash flow (153.2%).

Interest Coverage: 6147's interest payments on its debt are well covered by EBIT (243.7x coverage).


Balance Sheet


Dividend

What is Chipbond Technology current dividend yield, its reliability and sustainability?

5.63%

Current Dividend Yield


Dividend Yield vs Market

Notable Dividend: 6147's dividend (5.63%) is higher than the bottom 25% of dividend payers in the TW market (1.83%).

High Dividend: 6147's dividend (5.63%) is in the top 25% of dividend payers in the TW market (5.12%)


Stability and Growth of Payments

Stable Dividend: 6147's dividend payments have been volatile in the past 10 years.

Growing Dividend: 6147's dividend payments have increased over the past 10 years.


Current Payout to Shareholders

Dividend Coverage: With its reasonably low payout ratio (46.4%), 6147's dividend payments are well covered by earnings.


Future Payout to Shareholders

Future Dividend Coverage: 6147's dividends in 3 years are forecast to be covered by earnings (70.5% payout ratio).


Next Steps

Management

How experienced are the management team and are they aligned to shareholders interests?

15.5yrs

Average management tenure


CEO

Fei-Jain Wu

15.5yrs

Tenure

Mr. Fei-Jain Wu serves as the Chief Executive Officer of Chipbond Technology Corp since June 14, 2006 and has been its Research & Development Officer since May 29, 2020. Mr. Wu serves as Director of Packag...


Leadership Team

Experienced Management: 6147's management team is seasoned and experienced (15.5 years average tenure).


Board Members

Experienced Board: 6147's board of directors are considered experienced (9.5 years average tenure).


Ownership

Who are the major shareholders and have insiders been buying or selling?


Insider Trading Volume

Insider Buying: Insufficient data to determine if insiders have bought more shares than they have sold in the past 3 months.


Ownership Breakdown

Dilution of Shares: Shareholders have been diluted in the past year, with total shares outstanding growing by 12.9%.


Top Shareholders

Company Information

Chipbond Technology Corporation's employee growth, exchange listings and data sources


Key Information

  • Name: Chipbond Technology Corporation
  • Ticker: 6147
  • Exchange: TPEX
  • Founded: 1997
  • Industry: Semiconductors
  • Sector: Semiconductors
  • Market Cap: NT$49.861b
  • Shares outstanding: 738.68m
  • Website: https://www.chipbond.com.tw

Location

  • Chipbond Technology Corporation
  • No. 3, Lising 5 Road
  • Hsinchu Science Park
  • Hsinchu City
  • 300
  • Taiwan

Listings


Company Analysis and Financial Data Status

All financial data provided by Standard & Poor's Capital IQ.
DataLast Updated (UTC time)
Company Analysis2021/12/06 15:40
End of Day Share Price2021/12/06 00:00
Earnings2021/09/30
Annual Earnings2020/12/31


Unless specified all financial data is based on a yearly period but updated quarterly. This is known as Trailing Twelve Month (TTM) or Last Twelve Month (LTM) Data. Learn more here.