| Snowflake Score | |
|---|---|
| Valuation | 5/6 |
| Future Growth | 0/6 |
| Past Performance | 4/6 |
| Financial Health | 6/6 |
| Dividends | 5/6 |
6147 Stock Overview
Chipbond Technology Corporation, together with its subsidiaries, provides services for backend assembly processing of LCD driver integrated circuits (ICs) in Taiwan, the United States, and internationally.
Chipbond Technology Competitors
Price History & Performance
| Historical stock prices | |
|---|---|
| Current Share Price | NT$67.50 |
| 52 Week High | NT$88.30 |
| 52 Week Low | NT$60.30 |
| Beta | 0.66 |
| 1 Month Change | 2.58% |
| 3 Month Change | -9.27% |
| 1 Year Change | 1.35% |
| 3 Year Change | 12.50% |
| 5 Year Change | 51.35% |
| Change since IPO | 278.77% |
Recent News & Updates
Investors Will Want Chipbond Technology's (GTSM:6147) Growth In ROCE To Persist
Finding a business that has the potential to grow substantially is not easy, but it is possible if we look at a few key...
Shareholder Returns
| 6147 | TW Semiconductor | TW Market | |
|---|---|---|---|
| 7D | 1.4% | 2.2% | 2.1% |
| 1Y | 1.4% | 26.2% | 24.9% |
Return vs Industry: 6147 underperformed the TW Semiconductor industry which returned 29.5% over the past year.
Return vs Market: 6147 underperformed the TW Market which returned 25.8% over the past year.
Price Volatility
| 6147 volatility | |
|---|---|
| 6147 Average Weekly Movement | 3.3% |
| Semiconductor Industry Average Movement | 6.6% |
| Market Average Movement | 4.6% |
| 10% most volatile stocks in TW Market | 8.5% |
| 10% least volatile stocks in TW Market | 1.9% |
Stable Share Price: 6147 is not significantly more volatile than the rest of TW stocks over the past 3 months, typically moving +/- 3% a week.
Volatility Over Time: 6147's weekly volatility (3%) has been stable over the past year.
About the Company
| Founded | Employees | CEO | Website |
|---|---|---|---|
| 1997 | n/a | Fei-Jain Wu | https://www.chipbond.com.tw |
Chipbond Technology Corporation, together with its subsidiaries, provides services for backend assembly processing of LCD driver integrated circuits (ICs) in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. It also invests in, develops, manufactures, and sells electronic components, as well as tape automated bonding, tape carrier, and others.
Chipbond Technology Fundamentals Summary
| 6147 fundamental statistics | |
|---|---|
| Market Cap | NT$49.86b |
| Earnings (TTM) | NT$5.46b |
| Revenue (TTM) | NT$26.66b |
9.1x
P/E Ratio1.9x
P/S RatioIs 6147 overvalued?
See Fair Value and valuation analysisEarnings & Revenue
| 6147 income statement (TTM) | |
|---|---|
| Revenue | NT$26.66b |
| Cost of Revenue | NT$18.32b |
| Gross Profit | NT$8.33b |
| Expenses | NT$2.87b |
| Earnings | NT$5.46b |
Last Reported Earnings
Sep 30, 2021
Next Earnings Date
n/a
| Earnings per share (EPS) | 7.40 |
| Gross Margin | 31.26% |
| Net Profit Margin | 20.50% |
| Debt/Equity Ratio | 16.7% |
How did 6147 perform over the long term?
See historical performance and comparisonDividends
5.6%
Current Dividend Yield46%
Payout RatioValuation
Is Chipbond Technology undervalued compared to its fair value and its price relative to the market?
>50%
Undervalued compared to fair value
Share Price vs. Fair Value
Below Fair Value: 6147 (NT$67.5) is trading below our estimate of fair value (NT$156.41)
Significantly Below Fair Value: 6147 is trading below fair value by more than 20%.
Price To Earnings Ratio
PE vs Industry: 6147 is good value based on its PE Ratio (9.1x) compared to the TW Semiconductor industry average (21.3x).
PE vs Market: 6147 is good value based on its PE Ratio (9.1x) compared to the TW market (16.8x).
Price to Earnings Growth Ratio
PEG Ratio: 6147's earnings are forecast to decline next year, so we can't calculate its PEG ratio.
Price to Book Ratio
PB vs Industry: 6147 is good value based on its PB Ratio (1.4x) compared to the TW Semiconductor industry average (3.1x).
Future Growth
How is Chipbond Technology forecast to perform in the next 1 to 3 years based on estimates from 10 analysts?
-0.6%
Forecasted annual earnings growth
Earnings and Revenue Growth Forecasts
Analyst Future Growth Forecasts
Earnings vs Savings Rate: 6147's earnings are forecast to decline over the next 3 years (-0.6% per year).
Earnings vs Market: 6147's earnings are forecast to decline over the next 3 years (-0.6% per year).
High Growth Earnings: 6147's earnings are forecast to decline over the next 3 years.
Revenue vs Market: 6147's revenue (2.8% per year) is forecast to grow slower than the TW market (9.7% per year).
High Growth Revenue: 6147's revenue (2.8% per year) is forecast to grow slower than 20% per year.
Earnings per Share Growth Forecasts
Future Return on Equity
Future ROE: 6147's Return on Equity is forecast to be low in 3 years time (15.4%).
Past Performance
How has Chipbond Technology performed over the past 5 years?
21.8%
Historical annual earnings growth
Earnings and Revenue History
Quality Earnings: 6147 has high quality earnings.
Growing Profit Margin: 6147's current net profit margins (20.5%) are higher than last year (16.6%).
Past Earnings Growth Analysis
Earnings Trend: 6147's earnings have grown significantly by 21.8% per year over the past 5 years.
Accelerating Growth: 6147's earnings growth over the past year (53.7%) exceeds its 5-year average (21.8% per year).
Earnings vs Industry: 6147 earnings growth over the past year (53.7%) underperformed the Semiconductor industry 66.2%.
Return on Equity
High ROE: 6147's Return on Equity (15.7%) is considered low.
Financial Health
How is Chipbond Technology's financial position?
Financial Position Analysis
Short Term Liabilities: 6147's short term assets (NT$12.0B) exceed its short term liabilities (NT$7.5B).
Long Term Liabilities: 6147's short term assets (NT$12.0B) exceed its long term liabilities (NT$4.5B).
Debt to Equity History and Analysis
Debt Level: 6147's net debt to equity ratio (6%) is considered satisfactory.
Reducing Debt: 6147's debt to equity ratio has reduced from 30% to 16.7% over the past 5 years.
Debt Coverage: 6147's debt is well covered by operating cash flow (153.2%).
Interest Coverage: 6147's interest payments on its debt are well covered by EBIT (243.7x coverage).
Balance Sheet
Dividend
What is Chipbond Technology current dividend yield, its reliability and sustainability?
5.63%
Current Dividend Yield
Dividend Yield vs Market
Notable Dividend: 6147's dividend (5.63%) is higher than the bottom 25% of dividend payers in the TW market (1.83%).
High Dividend: 6147's dividend (5.63%) is in the top 25% of dividend payers in the TW market (5.12%)
Stability and Growth of Payments
Stable Dividend: 6147's dividend payments have been volatile in the past 10 years.
Growing Dividend: 6147's dividend payments have increased over the past 10 years.
Current Payout to Shareholders
Dividend Coverage: With its reasonably low payout ratio (46.4%), 6147's dividend payments are well covered by earnings.
Future Payout to Shareholders
Future Dividend Coverage: 6147's dividends in 3 years are forecast to be covered by earnings (70.5% payout ratio).
Next Steps
Management
How experienced are the management team and are they aligned to shareholders interests?
15.5yrs
Average management tenure
CEO
Fei-Jain Wu
15.5yrs
Tenure
Mr. Fei-Jain Wu serves as the Chief Executive Officer of Chipbond Technology Corp since June 14, 2006 and has been its Research & Development Officer since May 29, 2020. Mr. Wu serves as Director of Packag...
Leadership Team
Experienced Management: 6147's management team is seasoned and experienced (15.5 years average tenure).
Board Members
Experienced Board: 6147's board of directors are considered experienced (9.5 years average tenure).
Ownership
Who are the major shareholders and have insiders been buying or selling?
Insider Trading Volume
Insider Buying: Insufficient data to determine if insiders have bought more shares than they have sold in the past 3 months.
Ownership Breakdown
Dilution of Shares: Shareholders have been diluted in the past year, with total shares outstanding growing by 12.9%.
Top Shareholders
Company Information
Chipbond Technology Corporation's employee growth, exchange listings and data sources
Key Information
- Name: Chipbond Technology Corporation
- Ticker: 6147
- Exchange: TPEX
- Founded: 1997
- Industry: Semiconductors
- Sector: Semiconductors
- Market Cap: NT$49.861b
- Shares outstanding: 738.68m
- Website: https://www.chipbond.com.tw
Location
- Chipbond Technology Corporation
- No. 3, Lising 5 Road
- Hsinchu Science Park
- Hsinchu City
- 300
- Taiwan
Listings
Company Analysis and Financial Data Status
| Data | Last Updated (UTC time) |
|---|---|
| Company Analysis | 2021/12/06 15:40 |
| End of Day Share Price | 2021/12/06 00:00 |
| Earnings | 2021/09/30 |
| Annual Earnings | 2020/12/31 |
Unless specified all financial data is based on a yearly period but updated quarterly. This is known as Trailing Twelve Month (TTM) or Last Twelve Month (LTM) Data. Learn more here.