Chipbond Technology Corporation, together with its subsidiaries, provides services for backend assembly processing of LCD driver integrated circuits (ICs) in Taiwan, the United States, and internationally. More Details
Very undervalued with flawless balance sheet and pays a dividend.
Share Price & News
How has Chipbond Technology's share price performed over time and what events caused price changes?
Latest Share Price and Events
Stable Share Price: 6147 is not significantly more volatile than the rest of TW stocks over the past 3 months, typically moving +/- 4% a week.
Volatility Over Time: 6147's weekly volatility (4%) has been stable over the past year.
7 Day Return
1 Year Return
Return vs Industry: 6147 underperformed the TW Semiconductor industry which returned 112.4% over the past year.
Return vs Market: 6147 underperformed the TW Market which returned 63.5% over the past year.
Long-Term Price Volatility Vs. Market
How volatile is Chipbond Technology's share price compared to the market and industry in the last 5 years?
Simply Wall St News
1 week ago | Simply Wall StThese 4 Measures Indicate That Chipbond Technology (GTSM:6147) Is Using Debt Reasonably Well
3 weeks ago | Simply Wall StAn Intrinsic Calculation For Chipbond Technology Corporation (GTSM:6147) Suggests It's 47% Undervalued
1 month ago | Simply Wall StAnalysts Just Made A Neat Upgrade To Their Chipbond Technology Corporation (GTSM:6147) Forecasts
Is Chipbond Technology undervalued compared to its fair value and its price relative to the market?
Undervalued compared to fair value
Share Price vs. Fair Value
Below Fair Value: 6147 (NT$77.5) is trading below our estimate of fair value (NT$144.23)
Significantly Below Fair Value: 6147 is trading below fair value by more than 20%.
Price To Earnings Ratio
PE vs Industry: 6147 is good value based on its PE Ratio (13.8x) compared to the TW Semiconductor industry average (29x).
PE vs Market: 6147 is good value based on its PE Ratio (13.8x) compared to the TW market (20.6x).
Price to Earnings Growth Ratio
PEG Ratio: 6147 is good value based on its PEG Ratio (0.9x)
Price to Book Ratio
PB vs Industry: 6147 is good value based on its PB Ratio (1.6x) compared to the TW Semiconductor industry average (2.9x).
How is Chipbond Technology forecast to perform in the next 1 to 3 years based on estimates from 10 analysts?
Forecasted annual earnings growth
Earnings and Revenue Growth Forecasts
Analyst Future Growth Forecasts
Earnings vs Savings Rate: 6147's forecast earnings growth (16.2% per year) is above the savings rate (0.8%).
Earnings vs Market: 6147's earnings (16.2% per year) are forecast to grow faster than the TW market (16.1% per year).
High Growth Earnings: 6147's earnings are forecast to grow, but not significantly.
Revenue vs Market: 6147's revenue (6.9% per year) is forecast to grow slower than the TW market (10.1% per year).
High Growth Revenue: 6147's revenue (6.9% per year) is forecast to grow slower than 20% per year.
Earnings per Share Growth Forecasts
Future Return on Equity
Future ROE: 6147's Return on Equity is forecast to be low in 3 years time (14.1%).
How has Chipbond Technology performed over the past 5 years?
Historical annual earnings growth
Earnings and Revenue History
Quality Earnings: 6147 has high quality earnings.
Growing Profit Margin: 6147's current net profit margins (16.4%) are lower than last year (20%).
Past Earnings Growth Analysis
Earnings Trend: 6147's earnings have grown by 20% per year over the past 5 years.
Accelerating Growth: 6147's has had negative earnings growth over the past year, so it can't be compared to its 5-year average.
Earnings vs Industry: 6147 had negative earnings growth (-10.5%) over the past year, making it difficult to compare to the Semiconductor industry average (27.5%).
Return on Equity
High ROE: 6147's Return on Equity (11.4%) is considered low.
How is Chipbond Technology's financial position?
Financial Position Analysis
Short Term Liabilities: 6147's short term assets (NT$10.3B) exceed its short term liabilities (NT$6.8B).
Long Term Liabilities: 6147's short term assets (NT$10.3B) exceed its long term liabilities (NT$4.4B).
Debt to Equity History and Analysis
Debt Level: 6147's debt to equity ratio (14.1%) is considered satisfactory.
Reducing Debt: 6147's debt to equity ratio has reduced from 43.3% to 14.1% over the past 5 years.
Debt Coverage: 6147's debt is well covered by operating cash flow (136.4%).
Interest Coverage: 6147's interest payments on its debt are well covered by EBIT (133.9x coverage).
What is Chipbond Technology current dividend yield, its reliability and sustainability?
Current Dividend Yield
Dividend Yield vs Market
Notable Dividend: 6147's dividend (5.42%) is higher than the bottom 25% of dividend payers in the TW market (2%).
High Dividend: 6147's dividend (5.42%) is in the top 25% of dividend payers in the TW market (4.78%)
Stability and Growth of Payments
Stable Dividend: 6147's dividend payments have been volatile in the past 10 years.
Growing Dividend: 6147's dividend payments have increased over the past 10 years.
Current Payout to Shareholders
Dividend Coverage: With its reasonable payout ratio (74.9%), 6147's dividend payments are covered by earnings.
Future Payout to Shareholders
Future Dividend Coverage: 6147's dividends in 3 years are forecast to be covered by earnings (69.9% payout ratio).
How experienced are the management team and are they aligned to shareholders interests?
Average management tenure
Mr. Fei-Jain Wu serves as the Chief Executive Officer of Chipbond Technology Corp since June 14, 2006 and has been its Research & Development Officer since May 29, 2020. Mr. Wu serves as Director of Packag...
Experienced Management: 6147's management team is seasoned and experienced (14.8 years average tenure).
Experienced Board: 6147's board of directors are considered experienced (8.8 years average tenure).
Who are the major shareholders and have insiders been buying or selling?
Insider Trading Volume
Insider Buying: Insufficient data to determine if insiders have bought more shares than they have sold in the past 3 months.
Dilution of Shares: Shareholders have been diluted in the past year, with total shares outstanding growing by 2.6%.
Chipbond Technology Corporation's company bio, employee growth, exchange listings and data sources
- Name: Chipbond Technology Corporation
- Ticker: 6147
- Exchange: GTSM
- Founded: 1997
- Industry: Semiconductors
- Sector: Semiconductors
- Market Cap: NT$52.043b
- Shares outstanding: 671.52m
- Website: https://www.chipbond.com.tw
- Chipbond Technology Corporation
- No. 3, Lising 5 Road
- Hsinchu Science Park
- Hsinchu City
Chipbond Technology Corporation, together with its subsidiaries, provides services for backend assembly processing of LCD driver integrated circuits (ICs) in Taiwan, the United States, and internationally....
Company Analysis and Financial Data Status
|Data||Last Updated (UTC time)|
|Company Analysis||2021/04/13 08:33|
|End of Day Share Price||2021/04/12 00:00|
Unless specified all financial data is based on a yearly period but updated quarterly. This is known as Trailing Twelve Month (TTM) or Last Twelve Month (LTM) Data. Learn more here.