Chipbond Technology (6147) Stock Overview
Engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. More details
| Snowflake Score | |
|---|---|
| Valuation | 5/6 |
| Future Growth | 1/6 |
| Past Performance | 1/6 |
| Financial Health | 6/6 |
| Dividends | 3/6 |
6147 Community Fair Values
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Chipbond Technology Corporation Competitors
Price History & Performance
| Historical stock prices | |
|---|---|
| Current Share Price | NT$53.20 |
| 52 Week High | NT$67.40 |
| 52 Week Low | NT$50.60 |
| Beta | 0.35 |
| 1 Month Change | -9.83% |
| 3 Month Change | -0.75% |
| 1 Year Change | -17.52% |
| 3 Year Change | -10.44% |
| 5 Year Change | -21.07% |
| Change since IPO | 198.53% |
Recent News & Updates
Recent updates
Investors Will Want Chipbond Technology's (GTSM:6147) Growth In ROCE To Persist
Apr 17
These 4 Measures Indicate That Chipbond Technology (GTSM:6147) Is Using Debt Reasonably Well
Apr 02An Intrinsic Calculation For Chipbond Technology Corporation (GTSM:6147) Suggests It's 47% Undervalued
Mar 19Analysts Just Made A Neat Upgrade To Their Chipbond Technology Corporation (GTSM:6147) Forecasts
Mar 03Did You Participate In Any Of Chipbond Technology's (GTSM:6147) Respectable 69% Return?
Feb 23Investors In Chipbond Technology Corporation (GTSM:6147) Should Consider This, First
Feb 02Is Chipbond Technology (GTSM:6147) A Future Multi-bagger?
Dec 26We Think Chipbond Technology (GTSM:6147) Can Stay On Top Of Its Debt
Dec 08
Chipbond Technology (GTSM:6147) Has Compensated Shareholders With A Respectable 78% Return On Their Investment
Nov 23Shareholder Returns
| 6147 | TW Semiconductor | TW Market | |
|---|---|---|---|
| 7D | 3.3% | -0.1% | 0.7% |
| 1Y | -17.5% | 37.3% | 21.9% |
Return vs Industry: 6147 underperformed the TW Semiconductor industry which returned 37.3% over the past year.
Return vs Market: 6147 underperformed the TW Market which returned 21.9% over the past year.
Price Volatility
| 6147 volatility | |
|---|---|
| 6147 Average Weekly Movement | 3.6% |
| Semiconductor Industry Average Movement | 6.0% |
| Market Average Movement | 4.8% |
| 10% most volatile stocks in TW Market | 8.6% |
| 10% least volatile stocks in TW Market | 2.1% |
Stable Share Price: 6147 has not had significant price volatility in the past 3 months compared to the TW market.
Volatility Over Time: 6147's weekly volatility (4%) has been stable over the past year.
About the Company
| Founded | Employees | CEO | Website |
|---|---|---|---|
| 1997 | n/a | Huoo-Wen Gau | www.chipbond.com.tw |
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning,dicing, and tape-and-reel processes, as well as chip-on-film, chip on glass, chip-on-plastic, packaging attachment, and wafer level chip scale packaging services. It also provides compound semiconductors including SiGe, GaAs, GaN, SiC, and other wafers; flexible tape-and-reel circuit substrate; and chip tray.
Chipbond Technology Corporation Fundamentals Summary
| 6147 fundamental statistics | |
|---|---|
| Market cap | NT$39.02b |
| Earnings (TTM) | NT$2.87b |
| Revenue (TTM) | NT$21.41b |
Is 6147 overvalued?
See Fair Value and valuation analysisEarnings & Revenue
| 6147 income statement (TTM) | |
|---|---|
| Revenue | NT$21.41b |
| Cost of Revenue | NT$16.68b |
| Gross Profit | NT$4.73b |
| Other Expenses | NT$1.86b |
| Earnings | NT$2.87b |
Last Reported Earnings
Sep 30, 2025
Next Earnings Date
n/a
| Earnings per share (EPS) | 3.85 |
| Gross Margin | 22.09% |
| Net Profit Margin | 13.40% |
| Debt/Equity Ratio | 2.4% |
How did 6147 perform over the long term?
See historical performance and comparisonDividends
Company Analysis and Financial Data Status
| Data | Last Updated (UTC time) |
|---|---|
| Company Analysis | 2025/11/28 08:44 |
| End of Day Share Price | 2025/11/28 00:00 |
| Earnings | 2025/09/30 |
| Annual Earnings | 2024/12/31 |
Data Sources
The data used in our company analysis is from S&P Global Market Intelligence LLC. The following data is used in our analysis model to generate this report. Data is normalised which can introduce a delay from the source being available.
| Package | Data | Timeframe | Example US Source * |
|---|---|---|---|
| Company Financials | 10 years |
| |
| Analyst Consensus Estimates | +3 years |
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| Market Prices | 30 years |
| |
| Ownership | 10 years |
| |
| Management | 10 years |
| |
| Key Developments | 10 years |
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* Example for US securities, for non-US equivalent regulatory forms and sources are used.
Unless specified all financial data is based on a yearly period but updated quarterly. This is known as Trailing Twelve Month (TTM) or Last Twelve Month (LTM) Data. Learn more.
Analysis Model and Snowflake
Details of the analysis model used to generate this report is available on our Github page, we also have guides on how to use our reports and tutorials on Youtube.
Learn about the world class team who designed and built the Simply Wall St analysis model.
Industry and Sector Metrics
Our industry and section metrics are calculated every 6 hours by Simply Wall St, details of our process are available on Github.
Analyst Sources
Chipbond Technology Corporation is covered by 20 analysts. 2 of those analysts submitted the estimates of revenue or earnings used as inputs to our report. Analysts submissions are updated throughout the day.
| Analyst | Institution |
|---|---|
| Wanping Yeh | Barclays |
| Daniel Heyler | BofA Global Research |
| Jeffrey Toder | CGS International |