HORIBA Dividend
Dividend criteria checks 3/6
HORIBA is a dividend paying company with a current yield of 1.71% that is well covered by earnings. Next payment date is on 4th September, 2024 with an ex-dividend date of 27th June, 2024.
Key information
1.7%
Dividend yield
27%
Payout ratio
Industry average yield | 1.5% |
Next dividend pay date | 04 Sep 24 |
Ex dividend date | 27 Jun 24 |
Dividend per share | n/a |
Earnings per share | JP¥958.95 |
Dividend yield forecast in 3Y | 2.0% |
Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 6856's dividend payments have been volatile in the past 10 years.
Growing Dividend: 6856's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
HORIBA Dividend Yield vs Market |
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Segment | Dividend Yield |
---|---|
Company (6856) | 1.7% |
Market Bottom 25% (JP) | 1.6% |
Market Top 25% (JP) | 3.2% |
Industry Average (Electronic) | 1.5% |
Analyst forecast in 3 Years (6856) | 2.0% |
Notable Dividend: 6856's dividend (1.71%) is higher than the bottom 25% of dividend payers in the JP market (1.61%).
High Dividend: 6856's dividend (1.71%) is low compared to the top 25% of dividend payers in the JP market (3.24%).
Earnings Payout to Shareholders
Earnings Coverage: With its reasonably low payout ratio (27.2%), 6856's dividend payments are well covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its high cash payout ratio (148.9%), 6856's dividend payments are not well covered by cash flows.