Japan Electronic Materials Dividend
Dividend criteria checks 2/6
Japan Electronic Materials is a dividend paying company with a current yield of 1.49% that is well covered by earnings. Next payment date is on 2nd December, 2024 with an ex-dividend date of 27th September, 2024.
Key information
1.5%
Dividend yield
40%
Payout ratio
| Industry average yield | 1.5% |
| Next dividend pay date | 02 Dec 24 |
| Ex dividend date | 27 Sep 24 |
| Dividend per share | JP¥40.000 |
| Earnings per share | JP¥100.07 |
| Dividend yield forecast in 3Y | 1.5% |
Recent dividend updates
Japan Electronic Materials (TSE:6855) Is Paying Out A Dividend Of ¥20.00
Jul 25
Japan Electronic Materials (TSE:6855) Has Announced A Dividend Of ¥20.00
Jul 11Japan Electronic Materials (TSE:6855) Has Affirmed Its Dividend Of ¥20.00
Mar 12Japan Electronic Materials (TSE:6855) Has Affirmed Its Dividend Of ¥20.00
Feb 27Recent updates
Japan Electronic Materials Corporation (TSE:6855) Analysts Are Pretty Bullish On The Stock After Recent Results
Aug 10Take Care Before Jumping Onto Japan Electronic Materials Corporation (TSE:6855) Even Though It's 26% Cheaper
Aug 03Japan Electronic Materials (TSE:6855) Is Paying Out A Dividend Of ¥20.00
Jul 25Japan Electronic Materials (TSE:6855) Has Announced A Dividend Of ¥20.00
Jul 11Rainbows and Unicorns: The Japan Electronic Materials Corporation (TSE:6855) Analyst Just Became A Lot More Optimistic
May 25Subdued Growth No Barrier To Japan Electronic Materials Corporation (TSE:6855) With Shares Advancing 54%
May 21Here's Why Japan Electronic Materials (TSE:6855) Can Manage Its Debt Responsibly
Apr 22Japan Electronic Materials (TSE:6855) Has Affirmed Its Dividend Of ¥20.00
Mar 12Japan Electronic Materials Corporation (TSE:6855) Stock Rockets 35% As Investors Are Less Pessimistic Than Expected
Feb 28Japan Electronic Materials (TSE:6855) Has Affirmed Its Dividend Of ¥20.00
Feb 27Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 6855's dividend payments have been volatile in the past 10 years.
Growing Dividend: 6855's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
| Japan Electronic Materials Dividend Yield vs Market |
|---|
| Segment | Dividend Yield |
|---|---|
| Company (6855) | 1.5% |
| Market Bottom 25% (JP) | 1.9% |
| Market Top 25% (JP) | 3.9% |
| Industry Average (Semiconductor) | 1.5% |
| Analyst forecast in 3 Years (6855) | 1.5% |
Notable Dividend: 6855's dividend (1.49%) isn’t notable compared to the bottom 25% of dividend payers in the JP market (1.93%).
High Dividend: 6855's dividend (1.49%) is low compared to the top 25% of dividend payers in the JP market (3.89%).
Earnings Payout to Shareholders
Earnings Coverage: With its reasonably low payout ratio (40%), 6855's dividend payments are well covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its high cash payout ratio (127.3%), 6855's dividend payments are not well covered by cash flows.