TESEC Dividends and Buybacks
Dividend criteria checks 5/6
TESEC is a dividend paying company with a current yield of 4.7% that is well covered by earnings. Next payment date is on 11th June, 2025 with an ex-dividend date of 28th March, 2025.
Key information
4.7%
Dividend yield
1.7%
Buyback Yield
| Total Shareholder Yield | 6.4% |
| Future Dividend Yield | 4.7% |
| Dividend Growth | 8.6% |
| Next dividend pay date | 11 Jun 25 |
| Ex dividend date | 28 Mar 25 |
| Dividend per share | JP¥70.000 |
| Payout ratio | 44% |
Recent dividend and buyback updates
Recent updates
Should You Think About Buying TESEC Corporation (TSE:6337) Now?
Oct 30
The Market Doesn't Like What It Sees From TESEC Corporation's (TSE:6337) Earnings Yet As Shares Tumble 27%
Aug 01Do Investors Have Good Reason To Be Wary Of TESEC Corporation's (TYO:6337) 0.8% Dividend Yield?
Jan 26
Introducing TESEC (TYO:6337), A Stock That Climbed 60% In The Last Five Years
Dec 03Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 6337's dividend payments have been volatile in the past 10 years.
Growing Dividend: 6337's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
| TESEC Dividend Yield vs Market |
|---|
| Segment | Dividend Yield |
|---|---|
| Company (6337) | 4.7% |
| Market Bottom 25% (JP) | 1.8% |
| Market Top 25% (JP) | 3.8% |
| Industry Average (Semiconductor) | 1.7% |
| Analyst forecast (6337) (up to 3 years) | 4.7% |
Notable Dividend: 6337's dividend (4.7%) is higher than the bottom 25% of dividend payers in the JP market (1.83%).
High Dividend: 6337's dividend (4.7%) is in the top 25% of dividend payers in the JP market (3.79%)
Earnings Payout to Shareholders
Earnings Coverage: With its reasonably low payout ratio (43.8%), 6337's dividend payments are well covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its reasonably low cash payout ratio (47.8%), 6337's dividend payments are well covered by cash flows.