JAPAN MATERIAL Dividend
Dividend criteria checks 0/6
JAPAN MATERIAL is a dividend paying company with a current yield of 0.86%.
Key information
0.9%
Dividend yield
39%
Payout ratio
Industry average yield | 0.9% |
Next dividend pay date | n/a |
Ex dividend date | n/a |
Dividend per share | n/a |
Earnings per share | JP¥51.07 |
Dividend yield forecast in 3Y | 1.0% |
Recent dividend updates
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 6055 is not paying a notable dividend for the JP market, therefore no need to check if payments are stable.
Growing Dividend: 6055 is not paying a notable dividend for the JP market, therefore no need to check if payments are increasing.
Dividend Yield vs Market
JAPAN MATERIAL Dividend Yield vs Market |
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Segment | Dividend Yield |
---|---|
Company (6055) | 0.9% |
Market Bottom 25% (JP) | 1.6% |
Market Top 25% (JP) | 3.2% |
Industry Average (Semiconductor) | 0.9% |
Analyst forecast in 3 Years (6055) | 1.0% |
Notable Dividend: 6055's dividend (0.86%) isn’t notable compared to the bottom 25% of dividend payers in the JP market (1.6%).
High Dividend: 6055's dividend (0.86%) is low compared to the top 25% of dividend payers in the JP market (3.23%).
Earnings Payout to Shareholders
Earnings Coverage: 6055 is not paying a notable dividend for the JP market.
Cash Payout to Shareholders
Cash Flow Coverage: 6055 is not paying a notable dividend for the JP market.