JAPAN MATERIAL Co., Ltd.

TSE:6055 Stock Report

Market Cap: JP¥167.9b

JAPAN MATERIAL Dividends and Buybacks

Dividend criteria checks 4/6

JAPAN MATERIAL is a dividend paying company with a current yield of 1.35% that is well covered by earnings. Next payment date is on 27th June, 2025 with an ex-dividend date of 28th March, 2025.

Key information

1.3%

Dividend yield

n/a

Buyback Yield

Total Shareholder Yieldn/a
Future Dividend Yield1.6%
Dividend Growth-3.8%
Next dividend pay date27 Jun 25
Ex dividend date28 Mar 25
Dividend per shareJP¥22.000
Payout ratio33%

Recent dividend and buyback updates

JAPAN MATERIAL (TSE:6055) Will Pay A Larger Dividend Than Last Year At ¥22.00

Nov 14
JAPAN MATERIAL (TSE:6055) Will Pay A Larger Dividend Than Last Year At ¥22.00

Recent updates

Earnings Miss: JAPAN MATERIAL Co., Ltd. Missed EPS By 25% And Analysts Are Revising Their Forecasts

Nov 17
Earnings Miss: JAPAN MATERIAL Co., Ltd. Missed EPS By 25% And Analysts Are Revising Their Forecasts

JAPAN MATERIAL (TSE:6055) Will Pay A Larger Dividend Than Last Year At ¥22.00

Nov 14
JAPAN MATERIAL (TSE:6055) Will Pay A Larger Dividend Than Last Year At ¥22.00

Why We're Not Concerned About JAPAN MATERIAL Co., Ltd.'s (TSE:6055) Share Price

Nov 05
Why We're Not Concerned About JAPAN MATERIAL Co., Ltd.'s (TSE:6055) Share Price

JAPAN MATERIAL (TSE:6055) Will Be Hoping To Turn Its Returns On Capital Around

Oct 18
JAPAN MATERIAL (TSE:6055) Will Be Hoping To Turn Its Returns On Capital Around

JAPAN MATERIAL Co., Ltd.'s (TSE:6055) Popularity With Investors Is Clear

Jul 19
JAPAN MATERIAL Co., Ltd.'s (TSE:6055) Popularity With Investors Is Clear

Estimating The Intrinsic Value Of JAPAN MATERIAL Co., Ltd. (TSE:6055)

May 08
Estimating The Intrinsic Value Of JAPAN MATERIAL Co., Ltd. (TSE:6055)

What Does JAPAN MATERIAL Co., Ltd.'s (TSE:6055) Share Price Indicate?

Apr 17
What Does JAPAN MATERIAL Co., Ltd.'s (TSE:6055) Share Price Indicate?

Market Participants Recognise JAPAN MATERIAL Co., Ltd.'s (TSE:6055) Earnings

Apr 01
Market Participants Recognise JAPAN MATERIAL Co., Ltd.'s (TSE:6055) Earnings

Upcoming Dividend Payment

TodayNov 25 2024Ex Dividend DateMar 28 2025Dividend Pay DateJun 27 202591 days from Ex DividendBuy in the next 122 days to receive the upcoming dividend

Stability and Growth of Payments

Fetching dividends data

Stable Dividend: 6055's dividends per share have been stable in the past 10 years.

Growing Dividend: 6055's dividend payments have increased over the past 10 years.


Dividend Yield vs Market

JAPAN MATERIAL Dividend Yield vs Market
How does 6055 dividend yield compare to the market?
SegmentDividend Yield
Company (6055)1.3%
Market Bottom 25% (JP)1.8%
Market Top 25% (JP)3.8%
Industry Average (Semiconductor)1.7%
Analyst forecast (6055) (up to 3 years)1.6%

Notable Dividend: 6055's dividend (1.35%) isn’t notable compared to the bottom 25% of dividend payers in the JP market (1.82%).

High Dividend: 6055's dividend (1.35%) is low compared to the top 25% of dividend payers in the JP market (3.78%).


Earnings Payout to Shareholders

Earnings Coverage: With its reasonably low payout ratio (32.5%), 6055's dividend payments are well covered by earnings.


Cash Payout to Shareholders

Cash Flow Coverage: With its reasonably low cash payout ratio (45.1%), 6055's dividend payments are well covered by cash flows.


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