Japan Systembank Corporation

NSE:5530 Stock Report

Market Cap: JP¥1.9b

Japan Systembank Dividends and Buybacks

Dividend criteria checks 3/6

Japan Systembank is a dividend paying company with a current yield of 3.78% that is well covered by earnings. Next payment date is on 28th February, 2025 with an ex-dividend date of 27th December, 2024.

Key information

3.8%

Dividend yield

-8.3%

Buyback Yield

Total Shareholder Yield-4.5%
Future Dividend Yieldn/a
Dividend Growth49.9%
Next dividend pay date28 Feb 25
Ex dividend date27 Dec 24
Dividend per shareJP¥64.000
Payout ratio11%

Recent dividend and buyback updates

Recent updates

Upcoming Dividend Payment

TodayNov 26 2024Ex Dividend DateDec 27 2024Dividend Pay DateFeb 28 202563 days from Ex DividendBuy in the next 30 days to receive the upcoming dividend

Stability and Growth of Payments

Fetching dividends data

Stable Dividend: Too early to tell whether 5530's dividend payments have been stable as they only just started paying a dividend.

Growing Dividend: Too early to tell if 5530's dividend payments are increasing as they only just started paying a dividend.


Dividend Yield vs Market

Japan Systembank Dividend Yield vs Market
How does 5530 dividend yield compare to the market?
SegmentDividend Yield
Company (5530)3.8%
Market Bottom 25% (JP)1.8%
Market Top 25% (JP)3.8%
Industry Average (Commercial Services)2.0%
Analyst forecast (5530) (up to 3 years)n/a

Notable Dividend: 5530's dividend (3.78%) is higher than the bottom 25% of dividend payers in the JP market (1.81%).

High Dividend: 5530's dividend (3.78%) is low compared to the top 25% of dividend payers in the JP market (3.78%).


Earnings Payout to Shareholders

Earnings Coverage: With its low payout ratio (10.9%), 5530's dividend payments are thoroughly covered by earnings.


Cash Payout to Shareholders

Cash Flow Coverage: With its low cash payout ratio (19.2%), 5530's dividend payments are well covered by cash flows.


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