Japan Systembank is a dividend paying company with a current yield of 3.78% that is well covered by earnings. Next payment date is on 28th February, 2025 with an ex-dividend date of 27th December, 2024.
Key information
3.8%
Dividend yield
-8.3%
Buyback Yield
Total Shareholder Yield
-4.5%
Future Dividend Yield
n/a
Dividend Growth
49.9%
Next dividend pay date
28 Feb 25
Ex dividend date
27 Dec 24
Dividend per share
JP¥64.000
Payout ratio
11%
Recent dividend and buyback updates
Recent updates
Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: Too early to tell whether 5530's dividend payments have been stable as they only just started paying a dividend.
Growing Dividend: Too early to tell if 5530's dividend payments are increasing as they only just started paying a dividend.
Dividend Yield vs Market
Japan Systembank Dividend Yield vs Market
How does 5530 dividend yield compare to the market?
Segment
Dividend Yield
Company (5530)
3.8%
Market Bottom 25% (JP)
1.8%
Market Top 25% (JP)
3.8%
Industry Average (Commercial Services)
2.0%
Analyst forecast (5530) (up to 3 years)
n/a
Notable Dividend: 5530's dividend (3.78%) is higher than the bottom 25% of dividend payers in the JP market (1.81%).
High Dividend: 5530's dividend (3.78%) is low compared to the top 25% of dividend payers in the JP market (3.78%).
Earnings Payout to Shareholders
Earnings Coverage: With its low payout ratio (10.9%), 5530's dividend payments are thoroughly covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its low cash payout ratio (19.2%), 5530's dividend payments are well covered by cash flows.