Hosokawa Micron Dividend
Dividend criteria checks 4/6
Hosokawa Micron is a dividend paying company with a current yield of 2.44% that is well covered by earnings. Next payment date is on 16th December, 2024 with an ex-dividend date of 27th September, 2024.
Key information
2.4%
Dividend yield
13%
Payout ratio
Industry average yield | 2.1% |
Next dividend pay date | 16 Dec 24 |
Ex dividend date | 27 Sep 24 |
Dividend per share | n/a |
Earnings per share | JP¥391.18 |
Dividend yield forecast in 3Y | 2.7% |
Recent dividend updates
Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 6277's dividend payments have been volatile in the past 10 years.
Growing Dividend: 6277's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
Hosokawa Micron Dividend Yield vs Market |
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Segment | Dividend Yield |
---|---|
Company (6277) | 2.4% |
Market Bottom 25% (JP) | 1.7% |
Market Top 25% (JP) | 3.5% |
Industry Average (Machinery) | 2.1% |
Analyst forecast in 3 Years (6277) | 2.7% |
Notable Dividend: 6277's dividend (2.44%) is higher than the bottom 25% of dividend payers in the JP market (1.69%).
High Dividend: 6277's dividend (2.44%) is low compared to the top 25% of dividend payers in the JP market (3.45%).
Earnings Payout to Shareholders
Earnings Coverage: With its low payout ratio (12.8%), 6277's dividend payments are thoroughly covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its reasonably low cash payout ratio (44.2%), 6277's dividend payments are well covered by cash flows.