WuXi AppTec is a dividend paying company with a current yield of 2.32% that is well covered by earnings. Next payment date is on 30th June, 2024 with an ex-dividend date of 17th June, 2024.
Key information
2.3%
Dividend yield
31%
Payout ratio
Industry average yield
1.2%
Next dividend pay date
30 Jun 24
Ex dividend date
17 Jun 24
Dividend per share
n/a
Earnings per share
HK$3.22
Dividend yield forecast in 3Y
2.6%
Recent dividend updates
Recent updates
Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 2359 has been paying a dividend for less than 10 years and during this time payments have been volatile.
Growing Dividend: 2359's dividend payments have increased, but the company has only paid a dividend for 5 years.
Dividend Yield vs Market
WuXi AppTec Dividend Yield vs Market
How does 2359 dividend yield compare to the market?
Segment
Dividend Yield
Company (2359)
2.3%
Market Bottom 25% (HK)
3.1%
Market Top 25% (HK)
7.6%
Industry Average (Life Sciences)
1.2%
Analyst forecast in 3 Years (2359)
2.6%
Notable Dividend: 2359's dividend (2.32%) isn’t notable compared to the bottom 25% of dividend payers in the Hong Kong market (3.11%).
High Dividend: 2359's dividend (2.32%) is low compared to the top 25% of dividend payers in the Hong Kong market (7.56%).
Earnings Payout to Shareholders
Earnings Coverage: With its reasonably low payout ratio (30.7%), 2359's dividend payments are well covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its reasonably low cash payout ratio (37.9%), 2359's dividend payments are well covered by cash flows.