Announcement • Apr 17
Texas Instruments Incorporated Declares A Quarterly Cash Dividend on Common Stock for Second Quarter 2026, Payable May 19, 2026 The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock for second quarter 2026, payable May 19, 2026, to stockholders of record on May 5, 2026. Announcement • Mar 23
Texas Instruments Incorporated Unveils High-Performance Isolated Power Modules with Isoshield Technology Texas Instruments Incorporated unveiled new isolated power modules, helping enable increased power density, efficiency and safety in applications ranging from data centers to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 isolated power modules leverage TI's IsoShield technology, a proprietary multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs. TI is showcasing these innovations at the 2026 Applied Power Electronics Conference (APEC), March 23-26 in San Antonio, Texas. IsoShield technology enables isolated power modules with up to three times higher power density than discrete solutions, shrinking solution size as much as 70%. Joining TI's portfolio of over 350 power modules with optimized packages, these new devices help engineers maximize power density while reducing material costs and design time in any power application. TI's new IsoShield technology copackages a high-performance planar transformer and an isolated power stage, offering functional, basic and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result is a packaging advancement that shrinks solution size by as much as 70% while delivering up to 2W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data center applications that require reinforced isolation. Power density innovations are nowhere more critical than in today's evolving data center and automotive designs. Meeting design requirements in those applications starts with advanced analog semiconductors – the components that enable smarter, more efficient operations. As global data centers continue to scale to meet exponentially growing demand, high-performance power modules must pack more power in smaller spaces. With TI's IsoShield packaging technology, designers can achieve higher power density in compact form factors, ensuring reliable and safe operation of the world's digital infrastructure. Similarly, the increased power density enabled by IsoShield technology helps engineers design lighter and more efficient EVs that significantly extend range and enhance performance. For decades, TI has strategically invested in power management technology, with recent developments in power modules featuring both integrated transformers and integrated inductors. Through innovative proprietary packaging solutions such as IsoShield and MagPack technologies, along with a comprehensive portfolio of over 350 power modules with optimized packages, TI's semiconductors empower engineers to maximize performance in any power design or application. In booth No. 1819 at the Henry B. González Convention Center, TI will feature the isolated power modules with IsoShield technology in a high-power, high-performance automotive silicon carbide (SiC) 300kW traction inverter reference design. Additionally, TI will debut other advancements in data centers, automotive, humanoid robots, sustainable energy and USB Type-C applications, including an 800V to 6V DC/DC power distribution board. This design features TI's portfolio of gallium nitride integrated power stages, digital isolators and microcontrollers that help enable high efficiency and power density in power conversion for next-generation data center computing trays with AI processors. Preproduction and production quantities of the new isolated power modules are available now on TI.com. Evaluation modules, reference designs and simulation models are also available. Part number Package size Voltage UCC34141-Q1 5.85mm ? 7.5mm ? 2.6mm Mid voltage (6V-20V) UCC33420 4mm ? 5mm ? 1mm Low voltage (5V). Announcement • Mar 17
Texas Instruments Unveils Complete 800 VDC Power Architecture For Future Generation AI Data Centers With NVIDIA Texas Instruments unveiled a complete 800V direct current (DC) power architecture for next-generation AI data centers built with the NVIDIA 800 VDC reference design. The solution will be showcased at NVIDIA GTC, March 16-19, 2026, at NVIDIA's power architecture display and TI's booth 169, demonstrating how TI's analog and embedded processing technology supports NVIDIA's vision for advancing high-voltage systems in AI data centers. TI has developed a complete 800 VDC power solution for future generation AI data centers with NVIDIA. As part of this collaboration, TI is demonstrating a power architecture requiring only two conversion stages from 800V to processor power. TI's 800 VDC architecture addresses these challenges by maximizing conversion efficiency and power density across the entire power path, simplifying the power architecture and enabling more scalable and reliable AI data center operations. TI's breakthrough approach requires only two conversion stages from 800V to GPU core power: compact 800V to 6V isolated bus converter with higher peak efficiency, followed by a 6V to <1V multiphase buck solution with high current density generation-over-generation. This streamlined architecture supports the NVIDIA reference design. Announcement • Mar 10
Texas Instruments Introduces Two New Microcontroller Families with Edge Artificial Intelligence Capabilities Texas Instruments introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate Texas Instruments' TinyEngine neural processing unit (NPU), a dedicated hardware accelerator for MCUs that optimizes deep learning inference operations to reduce latency and improve energy efficiency when processing at the edge. Texas Instruments' integrated TinyEngine NPU can run AI models with up to 90 times lower latency and more than 120 times lower energy utilization per inference than similar MCUs without an accelerator. New general-purpose and real-time MCUs from Texas Instruments include the TinyEngine NPU to enable more efficient edge AI in any application, from simple to complex systems. With integrated generative AI in Texas Instruments' CCStudio IDE and more than 60 models and application examples in CCStudio Edge AI Studio, developers can quickly and easily add edge AI to any device. Texas Instruments' embedded processing portfolio is supported by a comprehensive development ecosystem, including the CCStudio integrated development environment (IDE). Its generative AI features allow engineers to use simple language to accelerate code development, system configuration and debugging through industry-standard agents and models paired with Texas Instruments data. Texas Instruments is accelerating the adoption of edge AI in any electronic device, from real-time monitoring in wearable health monitors and home circuit breakers to physical AI in humanoid robots. The MSPM0G5187 Arm Cortex-M0+ MSPM0 MCU represents a fundamental shift for embedded designers, who can now bring edge AI to a wide range of simpler, smaller and more cost-effective applications. With local computation, the TinyEngine NPU executes computations required by neural networks in parallel to the primary CPU running application code. Compared to similar MCUs without an accelerator, this hardware acceleration minimizes the flash memory footprint, lowers latency by up to 90 times per AI inference, and reduces energy utilization by more than 120 times per AI inference. Such levels of efficiency allow resource-constrained devices – including portable, battery-powered products – to process AI workloads. At under USD 1 in 1,000-unit quantities, the MSPM0G5187 MCU reduces system and operating costs by offering an affordable alternative to other MCU or processor architectures. Motor control applications in appliances, robotics and industrial systems increasingly call for intelligent features such as adaptive control and predictive maintenance, but implementing these capabilities has historically required complex, multi-chip designs. Texas Instruments' new AM13Ex MCUs are the industry's first to integrate a high-performance Arm Cortex-M33 core, TinyEngine NPU and advanced real-time control architecture into a single chip. This degree of integration enables designers to implement sophisticated motor control and AI features simultaneously without external components, lowering bill-of-materials costs by up to 30%. Key enhancements include the ability to maintain precise real-time control loops for up to four motors while the TinyEngine NPU runs adaptive control algorithms for load sensing and energy optimization, and an integrated trigonometric math accelerator that performs calculations 10 times faster than coordinate rotation digital computer (CORDIC) implementations, delivering more precise, responsive motor-control performance. Both MCU families are supported by Texas Instruments' CCStudio Edge AI Studio, a free development environment that simplifies model selection, training and deployment across Texas Instruments' embedded processing portfolio. This edge AI toolchain gives engineers full flexibility to run AI models on Texas Instruments MCUs through either hardware or software implementations. There are more than 60 models and application examples available in the tool to help developers start deploying edge AI in any device, with additional tasks and models planned in the future. Production quantities of the MSPM0G5187 MCU are available for purchase, with the AM13E23019 MCU available in preproduction quantities. Additional package and memory variants will be released by the end of 2026. Multiple payment and shipping options are available. Announcement • Mar 05
Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026 Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026. Location: 12500 ti boulevard, texas, dallas United States Announcement • Jan 29
Texas Instruments Incorporated Provides Earnings Guidance for the First Quarter of 2026 Texas Instruments Incorporated provided earnings guidance for the first quarter of 2026. for the quarter, the company expects revenue in the range of $4.32 billion to $4.68 billion and earnings per share between $1.22 and $1.48. Announcement • Jan 16
Texas Instruments Incorporated Declares First Quarter 2026 Dividend, Payable on February 10, 2026 The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock, payable February 10, 2026, to stockholders of record on January 30, 2026. Announcement • Jan 05
Texas Instruments Introduces New Automotive Semiconductors and Development Resources to Enhance Safety and Autonomous Vehicles Texas Instruments introduced new automotive semiconductors and development resources to enhance safety and autonomy across vehicle models. TI's scalable TDA5 high-performance computing system-on-a-chip (SoC) family offers power- and safety-optimized processing and edge artificial intelligence (AI) that supports up to Society of Automotive Engineers Level 3 vehicle autonomy. High-performance compute SoCs enable safe, scalable AI across vehicle models. To enhance safety and autonomy in next-generation vehicles, automakers are adopting central computing systems that support AI and sensor fusion for real-time decision-making. Designed for high-performance computing, TI's TDA5 SoCs family offers edge AI acceleration from 10 trillion operations per second (TOPS) to 1200 TOPS with power efficiency beyond 24 TOPS/W. This scalability, enabled by their chiplet-ready design with Universal Chiplet Interconnect Express interface technology, allows designers to implement different feature sets and support up to Level 3 autonomous driving using a single portfolio. Building on over two decades of experience in automotive processing, the family expands the performance of TI's existing portfolio to enable automakers to centralize their computing architectures and process advanced AI models. By integrating the latest generation of TI's C7™? neural processing unit (NPU), TDA5 SoCs provide up to 12 times the AI computing of previous generations with similar power consumption, eliminating the need for costly thermal solutions. This performance supports billions of parameters within language models and transformer networks, increasing in-vehicle intelligence while maintaining cross-domain functionality. The family features the latest Arm®? Cortex®?-A720AE cores, allowing automakers to integrate more safety, security and computing applications. TDA5 SoCs reduce system complexity and costs by supporting cross-domain fusion of ADAS, in-vehicle infotainment and gateway systems within a single chip. Their safety-first architecture further simplifies systems by helping automakers meet Automotive Safety Integrity Level D safety standards without external components. The transceiver supports both satellite and edge architectures, offering automakers the flexibility to simplify and accelerate the global deployment of ADAS features across entry-level to premium vehicles. The AWR2188 features enhanced analog-to-digital converter data processing and a radar chirp signal slope engine, both supporting 30% faster performance than currently available solutions. This level of performance powers advanced radar use cases such as detecting lost cargo, distinguishing between closely positioned vehicles and identifying objects in high-dynamic-range scenarios. Ethernet is an important enabler for this evolution, as it allows systems to collect and transmit more data across vehicle zones in real time through a simple, unified network architecture. TI's newDP83TD555J-Q1 10BASE-T1S Ethernet Serial Peripheral Interface PHY with an integrated media access controller offers nanosecond time synchronization, reliability and Power over Data Line capabilities. These features enable engineers to extend high-performance Ethernet to vehicle edge nodes while reducing cable design complexity and costs. With TI's end-to-end system offering, which includes technologies for advanced sensing, reliable in-vehicle networking and efficient AI processing, automakers can develop systems that improve safety and automation levels across different vehicle models. Announcement • Oct 22
Texas Instruments Incorporated Provides Earnings Guidance for the Fourth Quarter of 2025 Texas Instruments Incorporated provided earnings guidance for the fourth quarter of 2025. For the quarter, the company expects revenue in the range of $4.22 billion to $4.58 billion and earnings per share between $1.13 and $1.39. Announcement • Oct 17
Texas Instruments Incorporated Announces Board Changes On October 16, 2025, Richard K. Templeton notified the Board of Directors of Texas Instruments Incorporated that he will retire as executive chairman and as a member of the Board on December 31, 2025. The Board has appointed Haviv Ilan, the Company’s president and chief executive officer, as the Company’s new chairman, effective on Mr. Templeton’s retirement. Beginning January 2026. Ilan succeeds Rich Templeton, who will retire at the end of 2025 after a 45-year career with the company. Ilan has been a member of the board of directors since 2021 and TI’s president and CEO since 2023. Prior to that, he was chief operating officer and held senior leadership positions across TI’s analog and embedded processing businesses during his 26-year career at the company. Announcement • Oct 15
Renesas Reportedly Explores Sale of Timing Unit Renesas Electronics Corporation (TSE:6723) is working with bankers at JPMorgan to explore the potential sale of its timing division in a deal that could value the business at close to $2 billion, Reuters' Milana Vinn reported. According to people familiar with the matter, Texas Instruments Incorporated (NasdaqGS:TXN) and Infineon Technologies AG (XTRA:IFX) are among the potential buyers of the unit. Announcement • Sep 19
Texas Instruments Incorporated Raises Quarterly Cash Dividend, Payable on November 12, 2025 Texas Instruments Incorporated (TI) announced it will raise its quarterly cash dividend 4%, from $1.36 per share to $1.42, or $5.68 annualized. The higher dividend will be payable November 12, 2025, to stockholders of record on October 31, 2025, contingent upon formal declaration by the board of directors at its regular meeting in October. Announcement • Jul 23
Texas Instruments Incorporated Provides Earnings Guidance for the Third Quarter of 2025 Texas Instruments Incorporated provided earnings guidance for the third quarter of 2025. For the quarter company expects revenue in the range of $4.45 billion to $4.80 billion and earnings per share between $1.36 and $1.60. Announcement • Jul 18
Texas Instruments Incorporated Declares Cash Dividend for the Third Quarter of 2025, Payable on August 12, 2025 Texas Instruments Incorporated's board of directors declared a quarterly cash dividend of $1.36 per share of common stock for the third quarter of 2025, payable August 12, 2025, to stockholders of record on July 31, 2025. Announcement • Jun 28
Texas Instruments Incorporated(NasdaqGS:TXN) dropped from Russell Top 50 Index Texas Instruments Incorporated(NasdaqGS:TXN) dropped from Russell Top 50 Index Announcement • Apr 24
Texas Instruments Incorporated Provides Earnings Guidance for the Second Quarter of 2025 Texas Instruments Incorporated provided earnings guidance for the second quarter of 2025. The company’s second quarter outlook is for revenue in the range of $4.17 billion to $4.53 billion and earnings per share between $1.21 and $1.47. Announcement • Apr 18
Texas Instruments Board Declares Second Quarter 2025 Dividend, Payable on May 13, 2025 The board of directors of Texas Instruments Incorporated declared a Second Quarter 2025 cash dividend of $1.36 per share of common stock, payable May 13, 2025, to stockholders of record on April 30, 2025. Announcement • Apr 15
Texas Instruments Introduces New Portfolio of Automotive Lidar, Time and Radar Chips Texas Instruments introduced a new portfolio of automotive lidar, clock and radar chips to help automakers transform vehicle safety by bringing more autonomous features to a wider range of cars. TI's new LMH13000, the industry's first integrated high-speed lidar laser driver, delivers ultra-fast rise time to improve real-time decision-making. Addressing evolving ADAS needs, TI's new AWR2944P mmWave radar sensor offers advanced front and corner radar capabilities. Real-time decision-making with 30% longer distance measurements. A crucial technology for the future of safe autonomous vehicles, lidar provides a detailed 3D map of the driver's surroundings. This integration also supports an average 30% reduction in system costs while reducing solution size by four times, empowering design engineers to discretely mount compact, affordable lidar modules in more areas and across more vehicle models As lidar technology reaches higher output currents, vast variations in pulse duration over temperature make it challenging to meet eye safety standards. TI's LMH13000 laser driver provides up to 5A of adjustable output current with only 2% variation across its -40C to 125C ambient temperature range, compared to discrete solutions that can have up to 30% variation. The device's short pulse-width generation and current control enable the system to meet Class 1 U.S. Food and Drug Administration eye safety standards. Electronics in ADAS and in-vehicle infotainment systems must work reliably while facing temperature fluctuations, fluctuations and electromagnetic interference. With TI's BAW technology benefits, the new CDC6C-Q1 oscillator and LMK3H0102-Q1 and LMK3C0105-Q1 clock generators increase reliability by 100 times compared to traditional quartz-based clocks, with a failure-in-time rate of 0.3. Enhanced clocking precision and resilience in harsh conditions enable safer operation, cleaner data communication, and higher-speed data processing across next-generation vehicle subsystems. Additionally, the company unveiled a new front and corner radar sensor, the AWR2944P, building on TI's widely adopted AWR2944 platform. The new radar sensor's enhancements improve vehicle safety by extending detection range, improving angular accuracy, and enabling more sophisticated processing algorithms. Key enhancements include: An improved signal-to-noise ratio. A larger memory capacity. An integrated radar hardware accelerator that allows the microcontroller and digital signal processor to execute machine learning for edge artificial intelligence applications. TI's new automotive lidar, clock and Radar solutions build on the company's commitment to helping engineers design adaptable ADAS for a safer, more automated driving experience. Package, availability and pricing. Pre production quantities of the LMH13000, CDC6C-Q1, CDC6C-Q 1, LMK3H0102 -Q1, LMK3H0105-Q1 and LMK 3C0105-Q1. Announcement • Mar 18
Texas Instruments Debuts New Power- Management Chips to Support the Rapidly Growing Power Needs of Data Centers Texas Instruments debuted new power-management chips to support the rapidly growing power needs of modern data centers. As the adoption of high-performance computing and artificial intelligence (AI) increases, data centers require more power-dense and efficient solutions. TI's new TPS1685 is the industry's first 48V integrated hot-swap eFuse with power-path protection to support data center hardware and processing needs. To simplify data center design, TI also introduced a new family of integrated GaN power stages, the LMG3650R035, LMG3650R025 and LMG3650R070, in industry-standard TOLL packaging. TI is showcasing these devices at the 2025 Applied Power Electronics Conference (APEC), March 16-20, in Atlanta, Georgia. The new power stages integrate a high-performance gate driver with a 650V GaN field-effect transistor (FET) while achieving high efficiency (>98%) and high-power density (>100W/in3). They also integrate advanced protection features including over-current protection, short-circuit protection and over-temperature protection. This is especially important for AC/DC applications like server power, where designers are challenged to push more power into smaller spaces. At APEC 2025, TI will showcase power solutions that enable designers to reimagine new levels of power density and efficiency, including: Dell's 1.8kW server power-supply unit (PSU) with TI GaN power stages: Dell's first high-efficiency 12V PSU design uses a TI integrated GaN power stage. The PSU features a GaN FET with built-in driver, protection and temperature reporting to achieve over 96% system-level efficiency. Vertiv's 5.5kW server PSU: Part of Vertiv's PowerDirect Rack DC power system, the latest PSU from Vertiv is powered by TI GaN technology to deliver up to 132kW per rack. Greatwall's 8kWPS: To help designers increase power density, Greatwall and TI co-developed an 8kW open-rackPSU using TI GaN technology and TI C2000 real-time microcontrollers. Throughout the show, TI power experts will lead 27 industry and technical sessions to address power-management design challenges. Visit TI in the Georgia World Congress Center, Booth No. 1213. The full schedule is available at tuck-in. Package, availability and pricing. Preproduction quantities of the TPS1685, LMG3650R035), LMG3650R070 and LMG3650R025 are available for purchase now on TI.com. Multiple payment and shipping options are available. Evaluation modules are available. Evaluation modules are used to be available for the first and available for purchase now on TI". Announcement • Mar 12
Texas Instruments Introduces Small MCU, Expanding its Comprehensive Arm Cortex-M0+ MSPM0 MCU Portfolio Texas Instruments (TI) introduced the small MCU, expanding its comprehensive Arm Cortex-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance. With over 100 cost-effective MCUs, TI's MSPM0 MCU portfolio offers scalable configurations of on-chip analog peripherals and a range of computing options to enhance the sensing and control capabilities of embedded designs. TI will display these devices at embedded world 2025, March 11, 2025 – March 13, 2025, in Nuremberg, Germany. The MSPM0C1104 MCU leverages the advantages of WCSP packaging technology, along with intentional feature selection and TI's cost optimization efforts. The size of the eight-ball WCSP is 1.38mm, making it 38% smaller than competing devices. The MCU features 16KB of memory; a 12-bit analog-to-digital converter with three channels; six general-purpose input/output pins; and compatibility with standard communication interfaces such as Universal Asynchronous Receiver Transmitter (UART), Serial Peripheral Interface (SPI) and Inter-Integrated Circuit (IC). Integrating accurate, high-speed analog components into the world's smallest MCU gives engineers the flexibility to maintain the computing performance of their embedded systems without increasing board size. The new MSPM0C1104 joins TI's MSPM0 MCU portfolio, which offers scalability, cost optimization and ease of use to accelerate time to market. TI's MSPM0 MCUs feature pin-to-pin compatible package options and feature sets to match memory, analog and computing requirements in personal electronics, industrial and automotive applications. Starting at USD 0.16 in 1,000-unit quantities, the portfolio includes other small packages to help reduce board size and bill of materials. This optimization and feature integration across the portfolio help engineers design products of any size while reducing cost and complexity in their systems. For further support, TI's comprehensive ecosystem includes an optimized software development kit for all MSPM0 MCUs; a hardware development kit for rapid prototyping; reference designs; and subsystems, which are code examples for common MCU functions. TI's Zero Code Studio tool enables users to configure, develop and run MCU applications in minutes without coding. Engineers can take advantage of this ecosystem to scale designs and reuse code without the need for significant hardware or software modifications. In addition to this ecosystem, TI's MSPM0 MCU portfolio is supported by TI's growing investments in its internal manufacturing capacity to support future demand. At embedded world 2025, TI will demonstrate how its technologies enable engineers to reimagine embedded systems, helping create a more intelligent and connected world. TI's exhibit in Hall 3A, Booth No. 131 will include advancements in real-time monitoring and perception with edge artificial intelligence, connectivity for the Internet of Things, and development with open-source software. Package, availability and pricing: Preproduction quantities of the MSPM0C1104 MCU are available at TI.com. Pricing of the WCSP device is USD 0.20 in 1,000-unit quantities. Multiple payment and shipping options are available. The MSPM0C1104 LaunchPad development kit is available for USD 5.99 on TI.com. Announcement • Mar 07
Texas Instruments Incorporated, Annual General Meeting, Apr 17, 2025 Texas Instruments Incorporated, Annual General Meeting, Apr 17, 2025. Location: 12500 ti boulevard, texas, dallas United States 
