China Wafer Level CSP Balance Sheet Health
Financial Health criteria checks 5/6
China Wafer Level CSP has a total shareholder equity of CN¥4.3B and total debt of CN¥33.5M, which brings its debt-to-equity ratio to 0.8%. Its total assets and total liabilities are CN¥4.7B and CN¥418.2M respectively. China Wafer Level CSP's EBIT is CN¥193.1M making its interest coverage ratio -50.5. It has cash and short-term investments of CN¥2.4B.
Key information
0.8%
Debt to equity ratio
CN¥33.50m
Debt
Interest coverage ratio | -50.5x |
Cash | CN¥2.42b |
Equity | CN¥4.26b |
Total liabilities | CN¥418.19m |
Total assets | CN¥4.68b |
Recent financial health updates
No updates
Recent updates
Financial Position Analysis
Short Term Liabilities: 603005's short term assets (CN¥2.7B) exceed its short term liabilities (CN¥325.3M).
Long Term Liabilities: 603005's short term assets (CN¥2.7B) exceed its long term liabilities (CN¥92.9M).
Debt to Equity History and Analysis
Debt Level: 603005 has more cash than its total debt.
Reducing Debt: 603005's debt to equity ratio has increased from 0% to 0.8% over the past 5 years.
Debt Coverage: 603005's debt is well covered by operating cash flow (987.4%).
Interest Coverage: 603005 earns more interest than it pays, so coverage of interest payments is not a concern.