China Wafer Level CSP Dividend
Dividend criteria checks 0/6
China Wafer Level CSP is a dividend paying company with a current yield of 0.21%.
Key information
0.2%
Dividend yield
16%
Payout ratio
Industry average yield | 0.9% |
Next dividend pay date | n/a |
Ex dividend date | n/a |
Dividend per share | CN¥0.046 |
Earnings per share | CN¥0.28 |
Dividend yield forecast | 0.5% |
Recent dividend updates
No updates
Recent updates
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 603005 is not paying a notable dividend for the CN market, therefore no need to check if payments are stable.
Growing Dividend: 603005 is not paying a notable dividend for the CN market, therefore no need to check if payments are increasing.
Dividend Yield vs Market
China Wafer Level CSP Dividend Yield vs Market |
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Segment | Dividend Yield |
---|---|
Company (603005) | 0.2% |
Market Bottom 25% (CN) | 0.6% |
Market Top 25% (CN) | 2.2% |
Industry Average (Semiconductor) | 0.9% |
Analyst forecast (603005) (up to 3 years) | 0.5% |
Notable Dividend: 603005's dividend (0.21%) isn’t notable compared to the bottom 25% of dividend payers in the CN market (0.58%).
High Dividend: 603005's dividend (0.21%) is low compared to the top 25% of dividend payers in the CN market (2.21%).
Earnings Payout to Shareholders
Earnings Coverage: 603005 is not paying a notable dividend for the CN market.
Cash Payout to Shareholders
Cash Flow Coverage: 603005 is not paying a notable dividend for the CN market.