China Wafer Level CSP Balance Sheet Health
Financial Health criteria checks 5/6
China Wafer Level CSP has a total shareholder equity of CN¥4.2B and total debt of CN¥383.4M, which brings its debt-to-equity ratio to 9.2%. Its total assets and total liabilities are CN¥4.9B and CN¥758.7M respectively. China Wafer Level CSP's EBIT is CN¥116.3M making its interest coverage ratio -2.6. It has cash and short-term investments of CN¥2.6B.
Key information
9.2%
Debt to equity ratio
CN¥383.39m
Debt
Interest coverage ratio | -2.6x |
Cash | CN¥2.65b |
Equity | CN¥4.17b |
Total liabilities | CN¥758.71m |
Total assets | CN¥4.93b |
Recent financial health updates
Financial Position Analysis
Short Term Liabilities: 603005's short term assets (CN¥2.9B) exceed its short term liabilities (CN¥496.4M).
Long Term Liabilities: 603005's short term assets (CN¥2.9B) exceed its long term liabilities (CN¥262.3M).
Debt to Equity History and Analysis
Debt Level: 603005 has more cash than its total debt.
Reducing Debt: 603005's debt to equity ratio has increased from 0% to 9.2% over the past 5 years.
Debt Coverage: 603005's debt is well covered by operating cash flow (85.7%).
Interest Coverage: 603005 earns more interest than it pays, so coverage of interest payments is not a concern.