China Wafer Level CSP Dividend
Dividend criteria checks 0/6
China Wafer Level CSP is a dividend paying company with a current yield of 0.23%.
Key information
0.2%
Dividend yield
17%
Payout ratio
| Industry average yield | 1.0% |
| Next dividend pay date | n/a |
| Ex dividend date | n/a |
| Dividend per share | n/a |
| Earnings per share | CN¥0.26 |
| Dividend yield forecast in 3Y | 0.5% |
Recent dividend updates
No updates
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 603005 is not paying a notable dividend for the CN market, therefore no need to check if payments are stable.
Growing Dividend: 603005 is not paying a notable dividend for the CN market, therefore no need to check if payments are increasing.
Dividend Yield vs Market
| China Wafer Level CSP Dividend Yield vs Market |
|---|
| Segment | Dividend Yield |
|---|---|
| Company (603005) | 0.2% |
| Market Bottom 25% (CN) | 0.7% |
| Market Top 25% (CN) | 2.4% |
| Industry Average (Semiconductor) | 1.0% |
| Analyst forecast in 3 Years (603005) | 0.5% |
Notable Dividend: 603005's dividend (0.23%) isn’t notable compared to the bottom 25% of dividend payers in the CN market (0.67%).
High Dividend: 603005's dividend (0.23%) is low compared to the top 25% of dividend payers in the CN market (2.4%).
Earnings Payout to Shareholders
Earnings Coverage: 603005 is not paying a notable dividend for the CN market.
Cash Payout to Shareholders
Cash Flow Coverage: 603005 is not paying a notable dividend for the CN market.