KLIC Share Price Performance
US$55.35
9.14 (19.78%)
0.6% overvalued intrinsic discount
US$55.00
Fair Value
Price US$55.35
AnalystHighTarget US$55.00
AnalystLowTarget US$39.00
Fair ValueUS$55.00
Share Pricen/a
Kulicke and Soffa Industries, Inc. Stock Price
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KLIC Community Narratives
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Fair Value US$55 0.6% overvalued intrinsic discount
Advanced Packaging And On-Device AI Demand Will Drive Powerful Long-Term Upside
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Fair Value US$39 41.9% overvalued intrinsic discount
HBM And Advanced Packaging Headwinds Will Constrain Future Earnings Potential
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HBM And Advanced Packaging Headwinds Will Constrain Future Earnings Potential
Catalysts About Kulicke and Soffa Industries Kulicke and Soffa Industries designs and manufactures semiconductor assembly and packaging equipment for general semiconductor, memory, automotive and industrial end markets. What are the underlying business or industry changes driving this perspective?Read more
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AN
US$39
41.9% overvalued intrinsic discount
AnalystLowTarget's Fair Value
Revenue
13.36% p.a.
Profit Margin
18.15%
Future PE
14.79x
Price in 2029
US$51.77
Advanced Packaging And On-Device AI Demand Will Drive Powerful Long-Term Upside
Catalysts About Kulicke and Soffa Industries Kulicke and Soffa Industries provides advanced semiconductor assembly and packaging equipment to leading chip manufacturers worldwide. What are the underlying business or industry changes driving this perspective?Read more
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AN
US$55
0.6% overvalued intrinsic discount
AnalystHighTarget's Fair Value
Revenue
14.3% p.a.
Profit Margin
18.38%
Future PE
20.07x
Price in 2028
US$72.9
Trending Discussion
Recently Updated Narratives
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HBM And Advanced Packaging Headwinds Will Constrain Future Earnings Potential
Fair Value: US$39 41.9% overvalued intrinsic discount
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Advanced Packaging And On-Device AI Demand Will Drive Powerful Long-Term Upside
Fair Value: US$55 0.6% overvalued intrinsic discount
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Snowflake Analysis
Kulicke and Soffa Industries, Inc. Key Details
About KLIC
- Founded
- 1951
- Employees
- 2551
- CEO
- WebsiteView website
Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and consumables in China, the United States, Taiwan, Malaysia, Japan, the Philippines, Korea, Hong Kong, and internationally. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company provides services used to assemble semiconductor devices, such as integrated circuits, power discretes, light-emitting diode (LEDs), and sensors. It also offers ball bonding equipment, wafer level bonding equipment, and wedge and wedge-related bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares, and services for equipment. In addition, the company services, maintains, repairs, and upgrades equipment; and sells consumable aftermarket solutions and services. It serves integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Singapore.
