Announcement • Aug 12

Fabric.AI And Kopin Corporation Confirm Plans To Give First Public Demonstration Of Neural I/O MicroLED Optical Interconnect At CES 2027

Fabric.AI, along with its development partner Kopin Corporation, confirmed that their Neural I/o MicroLED-based optical interconnect platform remains on track for a live, working demonstration at The Consumer Electronics Show 2027 this January—the platform’s first public showing. The confirmation follows the Company’s May 18, 2026 announcement targeting a demonstration of Neural I/o. In the months since, Fabric.AI and Kopin have moved through a sequence of engineering, integration and internal-development milestones—carrying the platform from architecture into demonstrable hardware and keeping the program ahead of the timeline the Company set out this spring. Neural I/o targets what has become the defining constraint on AI scaling. As accelerators have grown faster and clusters larger, the bottleneck has shifted away from raw compute and onto the fabric that moves data between GPUs, accelerators, pooled memory and servers. Conventional electrical I/o—copper traces and high-speed SerDes—is running into hard physical limits on reach, energy per bit, and bandwidth density, while today’s pluggable optics add latency, power and thermal load precisely where system designers can least afford it. The result is a growing share of every watt and every nanosecond spent not on computation, but on communication. Neural I/o approaches the problem from a different physical foundation. Rather than relying on a small number of high-rate laser channels, the platform uses a massively parallel array of MicroLEDs as its optical engine—trading per-lane speed for a large lane count, and in doing so opening a path toward higher aggregate bandwidth, lower energy per bit, reduced latency and a dramatically improved thermal envelope, all in a footprint that can be brought close to the compute die. Fabric.AI believes this parallel-by-design architecture is well matched to the direction of the industry, where scale-up and scale-out fabrics increasingly determine whether an AI factory’s compute can actually be kept fed. Neural I/o is being developed for one of the fastest-growing opportunities in AI infrastructure. As hyperscalers and enterprises race to stand up AI factories, the fabric connecting compute has moved from a supporting component to a primary determinant of system performance—and spending is following. Third-party research firm TrendForce projects that the optical interconnect market will exceed $39 billion by 2030, citing optical connectivity’s increasingly critical role in AI factory expansion. Within that market, co-packaged and near-packaged optics—the category most directly aligned with Neural I/o’s architecture—are expected to be among the fastest-growing segments, with SNS Insider forecasting the co-packaged optics market alone could approach $124 billion by 2032, reflecting a compound annual growth rate of above 26%. Underlying enabling technologies such as silicon photonics are projected to reach approximately $9.6 billion by 2030 (Wissen Research). Fabric.AI believes Neural I/o’s massively parallel, MicroLED-based approach positions the Company to participate in this expansion as system designers seek interconnect solutions that can scale bandwidth and energy efficiency in step with next-generation AI compute.

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